JP2009513019A5 - - Google Patents

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Publication number
JP2009513019A5
JP2009513019A5 JP2008536797A JP2008536797A JP2009513019A5 JP 2009513019 A5 JP2009513019 A5 JP 2009513019A5 JP 2008536797 A JP2008536797 A JP 2008536797A JP 2008536797 A JP2008536797 A JP 2008536797A JP 2009513019 A5 JP2009513019 A5 JP 2009513019A5
Authority
JP
Japan
Prior art keywords
die
buffer region
resin
dielectric constant
filler
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2008536797A
Other languages
English (en)
Japanese (ja)
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JP2009513019A (ja
Filing date
Publication date
Priority claimed from US11/257,802 external-priority patent/US7435625B2/en
Application filed filed Critical
Publication of JP2009513019A publication Critical patent/JP2009513019A/ja
Publication of JP2009513019A5 publication Critical patent/JP2009513019A5/ja
Pending legal-status Critical Current

Links

JP2008536797A 2005-10-24 2006-10-18 パッケージのクロストークおよび損失を低減した半導体装置 Pending JP2009513019A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/257,802 US7435625B2 (en) 2005-10-24 2005-10-24 Semiconductor device with reduced package cross-talk and loss
PCT/US2006/040869 WO2007050420A2 (en) 2005-10-24 2006-10-18 Semiconductor device with reduced package cross-talk and loss

Publications (2)

Publication Number Publication Date
JP2009513019A JP2009513019A (ja) 2009-03-26
JP2009513019A5 true JP2009513019A5 (enExample) 2009-11-26

Family

ID=37968396

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008536797A Pending JP2009513019A (ja) 2005-10-24 2006-10-18 パッケージのクロストークおよび損失を低減した半導体装置

Country Status (5)

Country Link
US (2) US7435625B2 (enExample)
JP (1) JP2009513019A (enExample)
KR (1) KR101296701B1 (enExample)
TW (1) TWI414046B (enExample)
WO (1) WO2007050420A2 (enExample)

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CN102714555B (zh) * 2010-09-06 2016-06-15 华为技术有限公司 双向光电子设备中的串扰减小
WO2013063410A1 (en) 2011-10-28 2013-05-02 Hoya Corporation Usa Optical waveguide splitter on a waveguide substrate for attenuating a light source
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KR101905893B1 (ko) * 2012-06-13 2018-10-08 에스케이하이닉스 주식회사 복수의 유전층을 포함하는 임베디드 패키지 및 제조 방법
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US10446414B2 (en) * 2017-12-22 2019-10-15 Texas Instruments Incorporated Semiconductor package with filler particles in a mold compound
US10672703B2 (en) 2018-09-26 2020-06-02 Nxp Usa, Inc. Transistor with shield structure, packaged device, and method of fabrication

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