JP2009506217A5 - - Google Patents
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- Publication number
- JP2009506217A5 JP2009506217A5 JP2008528542A JP2008528542A JP2009506217A5 JP 2009506217 A5 JP2009506217 A5 JP 2009506217A5 JP 2008528542 A JP2008528542 A JP 2008528542A JP 2008528542 A JP2008528542 A JP 2008528542A JP 2009506217 A5 JP2009506217 A5 JP 2009506217A5
- Authority
- JP
- Japan
- Prior art keywords
- sma
- temperature range
- powder particles
- composite material
- attenuation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002245 particle Substances 0.000 description 5
- 229920000147 Styrene maleic anhydride Polymers 0.000 description 4
- 239000002131 composite material Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 229910000734 martensite Inorganic materials 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000001131 transforming Effects 0.000 description 2
- 230000003321 amplification Effects 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 235000020127 ayran Nutrition 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
ES200502129A ES2276605B1 (es) | 2005-08-31 | 2005-08-31 | Un material compuesto de matriz metalica basado en polvos de aleacion con memoria de forma, su procedimiento de obtencion y uso. |
PCT/ES2006/000493 WO2007026039A1 (es) | 2005-08-31 | 2006-08-30 | Un material compuesto de matriz metalica basado en polvos de aleaci n con memoria de forma/ su procedimiento de obtenci n y uso |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009506217A JP2009506217A (ja) | 2009-02-12 |
JP2009506217A5 true JP2009506217A5 (pt) | 2013-03-21 |
Family
ID=37808487
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008528542A Pending JP2009506217A (ja) | 2005-08-31 | 2006-08-30 | 形状記憶合金粉末に基づく金属マトリックス材料、該材料の製造法及び該材料の使用 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20090123329A1 (pt) |
EP (1) | EP1930452B1 (pt) |
JP (1) | JP2009506217A (pt) |
ES (2) | ES2276605B1 (pt) |
WO (1) | WO2007026039A1 (pt) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA2809208A1 (en) * | 2010-08-25 | 2012-03-01 | Torxx Group Inc. | Composite materials and methods and apparatus for making same |
CN102011038B (zh) * | 2010-12-15 | 2012-02-29 | 河北师范大学 | Mn50Ni50-xAlx高温铁磁形状记忆合金材料及其制备方法 |
JP5403707B2 (ja) * | 2011-12-27 | 2014-01-29 | 福田金属箔粉工業株式会社 | Cu系溶浸用粉末 |
CA2769075A1 (en) * | 2012-02-24 | 2013-08-24 | Torxx Group Inc. | Highly filled particulate composite materials and methods and apparatus for making same |
KR101988014B1 (ko) | 2012-04-18 | 2019-06-13 | 삼성디스플레이 주식회사 | 어레이 기판의 제조 방법 및 이에 사용되는 제조 장치 |
CN102719695A (zh) * | 2012-06-25 | 2012-10-10 | 镇江忆诺唯记忆合金有限公司 | 一种用粉末冶金法制备的CuAlMn记忆合金 |
CN111745162B (zh) * | 2019-03-26 | 2022-04-05 | 中国科学院金属研究所 | 具有三维互穿网络结构的形状记忆合金增强镁基复合材料及其制备方法 |
CN115341119A (zh) * | 2022-07-19 | 2022-11-15 | 华南理工大学 | 一种4d打印的铜基形状记忆合金粉末及其应用 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5429809A (en) * | 1977-08-10 | 1979-03-06 | Hitachi Ltd | Preparation of damping sintered material |
EP0035602B1 (de) * | 1980-03-03 | 1984-07-04 | BBC Aktiengesellschaft Brown, Boveri & Cie. | Verfahren zur pulvermetallurgischen Herstellung einer Gedächtnislegierung auf der Basis von Kupfer, Zink und Aluminium |
JPS5993848A (ja) * | 1982-11-22 | 1984-05-30 | Toshiba Corp | 防振合金 |
JPH1017959A (ja) * | 1996-07-03 | 1998-01-20 | Furukawa Electric Co Ltd:The | 複合材及びその製造方法 |
DE19741019C2 (de) * | 1997-09-18 | 2000-09-28 | Daimler Chrysler Ag | Strukturwerkstoff und Verfahren zu dessen Herstellung |
US6346132B1 (en) * | 1997-09-18 | 2002-02-12 | Daimlerchrysler Ag | High-strength, high-damping metal material and method of making the same |
US6796408B2 (en) * | 2002-09-13 | 2004-09-28 | The Boeing Company | Method for vibration damping using superelastic alloys |
US20060284313A1 (en) * | 2005-06-15 | 2006-12-21 | Yongqian Wang | Low stress chip attachment with shape memory materials |
-
2005
- 2005-08-31 ES ES200502129A patent/ES2276605B1/es active Active
-
2006
- 2006-08-30 JP JP2008528542A patent/JP2009506217A/ja active Pending
- 2006-08-30 ES ES06807938T patent/ES2725078T3/es active Active
- 2006-08-30 US US11/991,262 patent/US20090123329A1/en not_active Abandoned
- 2006-08-30 EP EP06807938.3A patent/EP1930452B1/en active Active
- 2006-08-30 WO PCT/ES2006/000493 patent/WO2007026039A1/es active Application Filing
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