JP2009506217A5 - - Google Patents

Download PDF

Info

Publication number
JP2009506217A5
JP2009506217A5 JP2008528542A JP2008528542A JP2009506217A5 JP 2009506217 A5 JP2009506217 A5 JP 2009506217A5 JP 2008528542 A JP2008528542 A JP 2008528542A JP 2008528542 A JP2008528542 A JP 2008528542A JP 2009506217 A5 JP2009506217 A5 JP 2009506217A5
Authority
JP
Japan
Prior art keywords
sma
temperature range
powder particles
composite material
attenuation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2008528542A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009506217A (ja
Filing date
Publication date
Priority claimed from ES200502129A external-priority patent/ES2276605B1/es
Application filed filed Critical
Publication of JP2009506217A publication Critical patent/JP2009506217A/ja
Publication of JP2009506217A5 publication Critical patent/JP2009506217A5/ja
Pending legal-status Critical Current

Links

JP2008528542A 2005-08-31 2006-08-30 形状記憶合金粉末に基づく金属マトリックス材料、該材料の製造法及び該材料の使用 Pending JP2009506217A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
ES200502129A ES2276605B1 (es) 2005-08-31 2005-08-31 Un material compuesto de matriz metalica basado en polvos de aleacion con memoria de forma, su procedimiento de obtencion y uso.
PCT/ES2006/000493 WO2007026039A1 (es) 2005-08-31 2006-08-30 Un material compuesto de matriz metalica basado en polvos de aleaci n con memoria de forma/ su procedimiento de obtenci n y uso

Publications (2)

Publication Number Publication Date
JP2009506217A JP2009506217A (ja) 2009-02-12
JP2009506217A5 true JP2009506217A5 (enExample) 2013-03-21

Family

ID=37808487

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008528542A Pending JP2009506217A (ja) 2005-08-31 2006-08-30 形状記憶合金粉末に基づく金属マトリックス材料、該材料の製造法及び該材料の使用

Country Status (5)

Country Link
US (1) US20090123329A1 (enExample)
EP (1) EP1930452B1 (enExample)
JP (1) JP2009506217A (enExample)
ES (2) ES2276605B1 (enExample)
WO (1) WO2007026039A1 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2608912A1 (en) * 2010-08-25 2013-07-03 Torxx Group Inc. Composite materials and methods and apparatus for making same
CN102011038B (zh) * 2010-12-15 2012-02-29 河北师范大学 Mn50Ni50-xAlx高温铁磁形状记忆合金材料及其制备方法
JP5403707B2 (ja) * 2011-12-27 2014-01-29 福田金属箔粉工業株式会社 Cu系溶浸用粉末
CA2769075A1 (en) * 2012-02-24 2013-08-24 Torxx Group Inc. Highly filled particulate composite materials and methods and apparatus for making same
KR101988014B1 (ko) 2012-04-18 2019-06-13 삼성디스플레이 주식회사 어레이 기판의 제조 방법 및 이에 사용되는 제조 장치
CN102719695A (zh) * 2012-06-25 2012-10-10 镇江忆诺唯记忆合金有限公司 一种用粉末冶金法制备的CuAlMn记忆合金
CN111745162B (zh) * 2019-03-26 2022-04-05 中国科学院金属研究所 具有三维互穿网络结构的形状记忆合金增强镁基复合材料及其制备方法
CN115341119A (zh) * 2022-07-19 2022-11-15 华南理工大学 一种4d打印的铜基形状记忆合金粉末及其应用
CN116479285B (zh) * 2023-04-06 2025-03-21 武汉理工大学 一种具有超大压缩弹性应变多孔Cu-Al-Mn基合金的制备方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5429809A (en) * 1977-08-10 1979-03-06 Hitachi Ltd Preparation of damping sintered material
DE3068396D1 (en) * 1980-03-03 1984-08-09 Bbc Brown Boveri & Cie Process for the production of a copper, zinc and aluminium base memory alloy by powder metallurgy technique
JPS5993848A (ja) * 1982-11-22 1984-05-30 Toshiba Corp 防振合金
JPH1017959A (ja) * 1996-07-03 1998-01-20 Furukawa Electric Co Ltd:The 複合材及びその製造方法
US6346132B1 (en) * 1997-09-18 2002-02-12 Daimlerchrysler Ag High-strength, high-damping metal material and method of making the same
DE19741019C2 (de) * 1997-09-18 2000-09-28 Daimler Chrysler Ag Strukturwerkstoff und Verfahren zu dessen Herstellung
US6796408B2 (en) * 2002-09-13 2004-09-28 The Boeing Company Method for vibration damping using superelastic alloys
US20060284313A1 (en) * 2005-06-15 2006-12-21 Yongqian Wang Low stress chip attachment with shape memory materials

Similar Documents

Publication Publication Date Title
JP6261618B2 (ja) チタン素材および窒素固溶チタン粉末材料の製造方法
JP2013501630A5 (enExample)
CN107641732B (zh) 一种高阻尼双相Mn-Cu合金的制备方法
JP2006193790A5 (enExample)
JP2014218717A5 (enExample)
JP2009506217A5 (enExample)
CN106811630B (zh) 一种铝合金及其制备方法和应用
CN104451514A (zh) 一种SiC-Al2O3纳米涂层及其制备方法
CN101392347B (zh) 原位自生Al2O3增强钼基复合材料及其制备方法
JP2014504334A (ja) 高熱伝導性を有するアルミニウム合金粉末金属
CN102358925A (zh) 一种高强度高阻尼的Ti3Sn/TiNi记忆合金复合材料
KR101532409B1 (ko) 가공경화가 가능한 비정질 금속 기지 복합재료
JP2009038366A5 (enExample)
JP6169488B2 (ja) 無鉛滑り軸受
CN103492594B (zh) 用于制造无铅滑动轴承材料的方法
Aniruddha Ram et al. Influence of multiwalled carbon nanotubes on the aging behavior of AA 6061 alloy matrix nanocomposites
JP2012140683A (ja) Niを添加したヒートシンク材用Cuと高融点金属複合体とその製造法
EP1690953A4 (en) HEAT-RESISTANT AND HIGH-SPEED ALUMINUM ALLOYING AND MANUFACTURING METHOD AND MOTOR PARTS THEREOF
Zhang et al. Microstructure and properties of SiC whisker reinforced Sn-0.3 Ag-0.7 Cu solder alloy
JP2009506217A (ja) 形状記憶合金粉末に基づく金属マトリックス材料、該材料の製造法及び該材料の使用
CN106167863B (zh) 一种低铍铝合金及其制备方法与应用
Xiao et al. Effect of Zr addition on microstructure and properties of Cu–Ag–Ti alloys
JP7190286B2 (ja) Al-Fe-Er系アルミニウム合金
CN104131203A (zh) 用于热浸镀的含纳米硅的铝锌合金复合材料及其制备方法
Zhang et al. Ultrafine eutectic Ti x Sn y/TiNi composites with high damping capacity