JP2009506217A - 形状記憶合金粉末に基づく金属マトリックス材料、該材料の製造法及び該材料の使用 - Google Patents
形状記憶合金粉末に基づく金属マトリックス材料、該材料の製造法及び該材料の使用 Download PDFInfo
- Publication number
- JP2009506217A JP2009506217A JP2008528542A JP2008528542A JP2009506217A JP 2009506217 A JP2009506217 A JP 2009506217A JP 2008528542 A JP2008528542 A JP 2008528542A JP 2008528542 A JP2008528542 A JP 2008528542A JP 2009506217 A JP2009506217 A JP 2009506217A
- Authority
- JP
- Japan
- Prior art keywords
- metal matrix
- particles
- matrix composite
- metal
- composite material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/02—Making non-ferrous alloys by melting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
- B22D19/00—Casting in, on, or around objects which form part of the product
- B22D19/14—Casting in, on, or around objects which form part of the product the objects being filamentary or particulate in form
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/04—Making non-ferrous alloys by powder metallurgy
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/04—Making non-ferrous alloys by powder metallurgy
- C22C1/0425—Copper-based alloys
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/10—Alloys containing non-metals
- C22C1/1036—Alloys containing non-metals starting from a melt
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C30/00—Alloys containing less than 50% by weight of each constituent
- C22C30/02—Alloys containing less than 50% by weight of each constituent containing copper
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/01—Alloys based on copper with aluminium as the next major constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
- B22F2998/10—Processes characterised by the sequence of their steps
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Powder Metallurgy (AREA)
- Manufacture Of Alloys Or Alloy Compounds (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| ES200502129A ES2276605B1 (es) | 2005-08-31 | 2005-08-31 | Un material compuesto de matriz metalica basado en polvos de aleacion con memoria de forma, su procedimiento de obtencion y uso. |
| PCT/ES2006/000493 WO2007026039A1 (es) | 2005-08-31 | 2006-08-30 | Un material compuesto de matriz metalica basado en polvos de aleaci n con memoria de forma/ su procedimiento de obtenci n y uso |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2009506217A true JP2009506217A (ja) | 2009-02-12 |
| JP2009506217A5 JP2009506217A5 (enExample) | 2013-03-21 |
Family
ID=37808487
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008528542A Pending JP2009506217A (ja) | 2005-08-31 | 2006-08-30 | 形状記憶合金粉末に基づく金属マトリックス材料、該材料の製造法及び該材料の使用 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20090123329A1 (enExample) |
| EP (1) | EP1930452B1 (enExample) |
| JP (1) | JP2009506217A (enExample) |
| ES (2) | ES2276605B1 (enExample) |
| WO (1) | WO2007026039A1 (enExample) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102011038A (zh) * | 2010-12-15 | 2011-04-13 | 河北师范大学 | Mn50Ni50-xAlx高温铁磁形状记忆合金材料及其制备方法 |
| CN111745162A (zh) * | 2019-03-26 | 2020-10-09 | 中国科学院金属研究所 | 具有三维互穿网络结构的形状记忆合金增强镁基复合材料及其制备方法 |
| CN116479285A (zh) * | 2023-04-06 | 2023-07-25 | 武汉理工大学 | 一种具有超大压缩弹性应变多孔Cu-Al-Mn基合金的制备方法 |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20130216815A1 (en) * | 2010-08-25 | 2013-08-22 | Torxx Group Inc | Composite materials and methods and apparatus for making same |
| JP5403707B2 (ja) * | 2011-12-27 | 2014-01-29 | 福田金属箔粉工業株式会社 | Cu系溶浸用粉末 |
| CA2769075A1 (en) * | 2012-02-24 | 2013-08-24 | Torxx Group Inc. | Highly filled particulate composite materials and methods and apparatus for making same |
| KR101988014B1 (ko) | 2012-04-18 | 2019-06-13 | 삼성디스플레이 주식회사 | 어레이 기판의 제조 방법 및 이에 사용되는 제조 장치 |
| CN102719695A (zh) * | 2012-06-25 | 2012-10-10 | 镇江忆诺唯记忆合金有限公司 | 一种用粉末冶金法制备的CuAlMn记忆合金 |
| CN115341119A (zh) * | 2022-07-19 | 2022-11-15 | 华南理工大学 | 一种4d打印的铜基形状记忆合金粉末及其应用 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5993848A (ja) * | 1982-11-22 | 1984-05-30 | Toshiba Corp | 防振合金 |
| JPH11158570A (ja) * | 1997-09-18 | 1999-06-15 | Daimler Benz Ag | 材料及びその製造方法 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5429809A (en) * | 1977-08-10 | 1979-03-06 | Hitachi Ltd | Preparation of damping sintered material |
| DE3068396D1 (en) * | 1980-03-03 | 1984-08-09 | Bbc Brown Boveri & Cie | Process for the production of a copper, zinc and aluminium base memory alloy by powder metallurgy technique |
| JPH1017959A (ja) * | 1996-07-03 | 1998-01-20 | Furukawa Electric Co Ltd:The | 複合材及びその製造方法 |
| US6346132B1 (en) * | 1997-09-18 | 2002-02-12 | Daimlerchrysler Ag | High-strength, high-damping metal material and method of making the same |
| US6796408B2 (en) * | 2002-09-13 | 2004-09-28 | The Boeing Company | Method for vibration damping using superelastic alloys |
| US20060284313A1 (en) * | 2005-06-15 | 2006-12-21 | Yongqian Wang | Low stress chip attachment with shape memory materials |
-
2005
- 2005-08-31 ES ES200502129A patent/ES2276605B1/es not_active Expired - Fee Related
-
2006
- 2006-08-30 ES ES06807938T patent/ES2725078T3/es active Active
- 2006-08-30 WO PCT/ES2006/000493 patent/WO2007026039A1/es not_active Ceased
- 2006-08-30 US US11/991,262 patent/US20090123329A1/en not_active Abandoned
- 2006-08-30 EP EP06807938.3A patent/EP1930452B1/en active Active
- 2006-08-30 JP JP2008528542A patent/JP2009506217A/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5993848A (ja) * | 1982-11-22 | 1984-05-30 | Toshiba Corp | 防振合金 |
| JPH11158570A (ja) * | 1997-09-18 | 1999-06-15 | Daimler Benz Ag | 材料及びその製造方法 |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102011038A (zh) * | 2010-12-15 | 2011-04-13 | 河北师范大学 | Mn50Ni50-xAlx高温铁磁形状记忆合金材料及其制备方法 |
| CN102011038B (zh) * | 2010-12-15 | 2012-02-29 | 河北师范大学 | Mn50Ni50-xAlx高温铁磁形状记忆合金材料及其制备方法 |
| CN111745162A (zh) * | 2019-03-26 | 2020-10-09 | 中国科学院金属研究所 | 具有三维互穿网络结构的形状记忆合金增强镁基复合材料及其制备方法 |
| CN111745162B (zh) * | 2019-03-26 | 2022-04-05 | 中国科学院金属研究所 | 具有三维互穿网络结构的形状记忆合金增强镁基复合材料及其制备方法 |
| CN116479285A (zh) * | 2023-04-06 | 2023-07-25 | 武汉理工大学 | 一种具有超大压缩弹性应变多孔Cu-Al-Mn基合金的制备方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| ES2725078T3 (es) | 2019-09-19 |
| ES2276605A1 (es) | 2007-06-16 |
| WO2007026039A1 (es) | 2007-03-08 |
| EP1930452B1 (en) | 2019-01-09 |
| US20090123329A1 (en) | 2009-05-14 |
| EP1930452A1 (en) | 2008-06-11 |
| ES2276605B1 (es) | 2008-05-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| Chowdhury et al. | Mechanical characterization of doped SAC solder materials at high temperature | |
| CN107641732B (zh) | 一种高阻尼双相Mn-Cu合金的制备方法 | |
| Shi et al. | Investigation of rare earth-doped BiAg high-temperature solders | |
| Prasad et al. | Influence of B4C reinforcement particles with varying sizes on the tensile failure and fractography of LM29 alloy composites | |
| Sadykov et al. | Influence of the structural state on mechanical behavior of tin babbit | |
| Tabaru et al. | High temperature strength of Nb3Al-base alloys | |
| JP2009506217A (ja) | 形状記憶合金粉末に基づく金属マトリックス材料、該材料の製造法及び該材料の使用 | |
| Yazici et al. | Effects of minor Cu and Si additions on glass forming ability and mechanical properties of Co-Fe-Ta-B Bulk metallic glass | |
| JP2001049375A (ja) | 優れた振動吸収性能を有するAl合金およびその製造方法 | |
| Gain et al. | Thermal aging effects on microstructure, elastic property and damping characteristic of a eutectic Sn–3.5 Ag solder | |
| Zhai et al. | Connecting solidified microstructure with compression properties for bulk Ti–Al alloys with V addition conducted by electromagnetic levitation and first principle | |
| Eckert et al. | Al based alloys containing amorphous and nanostructured phases | |
| Du et al. | Enhanced compression ductility of stoichiometric NiAl at room temperature by Y and Cu co-addition | |
| Aliyu et al. | Influence of micro-addition of lanthanum on grain characteristics, mechanical properties, and corrosion behavior of CuAlNiMnLa shape memory alloy | |
| Changyong et al. | Effect of cerium on microstructure, wetting and mechanical properties of Ag-Cu-Ti filler alloy | |
| JP2003147475A (ja) | TiAl金属間化合物基合金、及び鋳造部品の製造方法 | |
| Sanjay et al. | Effect of artificial ageing on wear behaviour of Al7010/B4C composite | |
| CN119952037B (zh) | 一种高尺寸稳定性的仪表级SiCp/Al复合材料的制备方法 | |
| Gao et al. | Growth and evolution kinetics of intermetallic compounds in Sn-0.7 Cu-10Bi-0.15 Co/Cu interface | |
| YC et al. | Viscous flow behavior and workability of Mg-Cu-(Ag)-Gd bulk metallic glasses | |
| Zhang et al. | Effect of thermal annealing on microstructure and mechanical properties of a gradient structured tantalum prepared by plasma activated sintering | |
| Mahdi | Effect of Sintering Time for Aluminum/Stainless Steel Composite on Mechanical Properties | |
| Taiwo et al. | Microstructural analysis of aluminum–graphite composites for electronics applications | |
| Yokoi et al. | Tensile and Fatigue Properties of Miniature Size Specimen of Sn-3.5 Ag-0.5 Cu-0.07 Ni-0.01 Ge Lead-Free Solder | |
| Salem | Effect of addition of GO Nanoparticles on the tensile properties and deformation temperature of Sn-3.5 Ag-0.7 Cu lead free solder alloy |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20090806 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20120628 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20120731 |
|
| A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20121024 |
|
| A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20121031 |
|
| A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20121126 |
|
| A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20121203 |
|
| A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20121225 |
|
| A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20130107 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20130131 |
|
| A524 | Written submission of copy of amendment under article 19 pct |
Free format text: JAPANESE INTERMEDIATE CODE: A524 Effective date: 20130131 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20130806 |
|
| A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20131031 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20140401 |