JP2009502533A5 - - Google Patents

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Publication number
JP2009502533A5
JP2009502533A5 JP2008523966A JP2008523966A JP2009502533A5 JP 2009502533 A5 JP2009502533 A5 JP 2009502533A5 JP 2008523966 A JP2008523966 A JP 2008523966A JP 2008523966 A JP2008523966 A JP 2008523966A JP 2009502533 A5 JP2009502533 A5 JP 2009502533A5
Authority
JP
Japan
Prior art keywords
hardness
abrasive
particles
conditioning
composite
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2008523966A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009502533A (ja
Filing date
Publication date
Priority claimed from US11/191,722 external-priority patent/US7169031B1/en
Application filed filed Critical
Publication of JP2009502533A publication Critical patent/JP2009502533A/ja
Publication of JP2009502533A5 publication Critical patent/JP2009502533A5/ja
Pending legal-status Critical Current

Links

JP2008523966A 2005-07-28 2006-07-19 自蔵型コンディショニング研磨物品 Pending JP2009502533A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/191,722 US7169031B1 (en) 2005-07-28 2005-07-28 Self-contained conditioning abrasive article
PCT/US2006/028064 WO2007015911A1 (en) 2005-07-28 2006-07-19 Self-contained conditioning abrasive article

Publications (2)

Publication Number Publication Date
JP2009502533A JP2009502533A (ja) 2009-01-29
JP2009502533A5 true JP2009502533A5 (OSRAM) 2009-09-03

Family

ID=37402642

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008523966A Pending JP2009502533A (ja) 2005-07-28 2006-07-19 自蔵型コンディショニング研磨物品

Country Status (8)

Country Link
US (1) US7169031B1 (OSRAM)
EP (1) EP1910026B1 (OSRAM)
JP (1) JP2009502533A (OSRAM)
KR (1) KR101299266B1 (OSRAM)
CN (1) CN101232968B (OSRAM)
DE (1) DE602006007857D1 (OSRAM)
TW (1) TWI399260B (OSRAM)
WO (1) WO2007015911A1 (OSRAM)

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7494519B2 (en) * 2005-07-28 2009-02-24 3M Innovative Properties Company Abrasive agglomerate polishing method
US7594845B2 (en) * 2005-10-20 2009-09-29 3M Innovative Properties Company Abrasive article and method of modifying the surface of a workpiece
WO2007061895A1 (en) * 2005-11-22 2007-05-31 3M Innovative Properties Company Arrays of light emitting articles and method of manufacturing same
US20070128991A1 (en) * 2005-12-07 2007-06-07 Yoon Il-Young Fixed abrasive polishing pad, method of preparing the same, and chemical mechanical polishing apparatus including the same
US20080098659A1 (en) * 2006-10-26 2008-05-01 Chien-Min Sung Methods for securing individual abrasive particles to a substrate in a predetermined pattern
US8026115B2 (en) * 2006-11-17 2011-09-27 3M Innovative Properties Company Optical bonding composition for LED light source
US20100051970A1 (en) * 2006-11-17 2010-03-04 Ouderkirk Andrew J Planarized led with optical extractor
JP4561732B2 (ja) * 2006-11-20 2010-10-13 トヨタ自動車株式会社 移動体位置測位装置
JP2010510685A (ja) * 2006-11-20 2010-04-02 スリーエム イノベイティブ プロパティズ カンパニー Ｌｅｄ光源用の光学接着組成物
US8323072B1 (en) 2007-03-21 2012-12-04 3M Innovative Properties Company Method of polishing transparent armor
US8038750B2 (en) 2007-07-13 2011-10-18 3M Innovative Properties Company Structured abrasive with overlayer, and method of making and using the same
JP5809053B2 (ja) * 2008-07-03 2015-11-10 スリーエム イノベイティブ プロパティズ カンパニー 固定研磨粒子及びそれから作製される物品
EP2419242A1 (en) * 2009-04-17 2012-02-22 3M Innovative Properties Company Planar abrasive articles made using transfer articles and method of making the same
US8603350B2 (en) * 2009-07-17 2013-12-10 Ohara Inc. Method of manufacturing substrate for information storage media
US20130005221A1 (en) * 2011-06-30 2013-01-03 Saint-Gobain Ceramics & Plastics, Inc. Method of polishing a workpiece with an abrasive segment comprising abrasive aggregates having silicon carbide particles
US20130065490A1 (en) 2011-09-12 2013-03-14 3M Innovative Properties Company Method of refurbishing vinyl composition tile
CN102490111B (zh) * 2011-11-24 2014-06-11 上海华力微电子有限公司 一种固定磨料化学机械研磨装置
CN104302446B (zh) * 2012-03-20 2017-10-31 Jh罗得股份有限公司 自调理抛光垫及其制备方法
JP6016301B2 (ja) 2013-02-13 2016-10-26 昭和電工株式会社 単結晶ＳｉＣ基板の表面加工方法、その製造方法及び単結晶ＳｉＣ基板の表面加工用研削プレート
US9633831B2 (en) * 2013-08-26 2017-04-25 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing composition for polishing a sapphire surface and methods of using same
JP5954293B2 (ja) 2013-10-17 2016-07-20 信越半導体株式会社 研磨用の発泡ウレタンパッドのドレッシング装置
JP6561058B2 (ja) * 2013-12-09 2019-08-14 スリーエム イノベイティブ プロパティズ カンパニー 集塊性研磨粒子、その粒子を含む研磨物品、及びその製造方法
EP2928275A1 (en) * 2014-04-04 2015-10-07 ABB Technology Ltd Arrangement for cooling components of a subsea electric system
KR20160147917A (ko) 2014-05-02 2016-12-23 쓰리엠 이노베이티브 프로퍼티즈 컴파니 불연속된 구조화된 연마 용품 및 작업편의 연마 방법
CN103962973A (zh) * 2014-05-08 2014-08-06 武汉法山磨料磨具有限公司 一种含羧甲基纤维素钠的树脂砂轮的制作方法
US10086500B2 (en) 2014-12-18 2018-10-02 Applied Materials, Inc. Method of manufacturing a UV curable CMP polishing pad
US10195713B2 (en) 2016-08-11 2019-02-05 3M Innovative Properties Company Lapping pads and systems and methods of making and using the same
US10654146B2 (en) * 2018-01-23 2020-05-19 Seagate Technology Llc One or more charging members used in the manufacture of a lapping plate, and related apparatuses and methods of making
CN109894930B (zh) * 2019-03-22 2021-06-25 湖南科技大学 一种缓释型柔性磨具及抛光方法
CN112809517A (zh) * 2020-04-10 2021-05-18 赖太忠 一种精加工打磨机及使用方法
CN118927171A (zh) * 2024-09-19 2024-11-12 郑州磨料磨具磨削研究所有限公司 一种研抛一体化复合磨具及其制备方法和应用

Family Cites Families (44)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US100246A (en) * 1870-03-01 1870-03-01 Liam e
US4311489A (en) * 1978-08-04 1982-01-19 Norton Company Coated abrasive having brittle agglomerates of abrasive grain
US4652275A (en) * 1985-08-07 1987-03-24 Minnesota Mining And Manufacturing Company Erodable agglomerates and abrasive products containing the same
US4799939A (en) * 1987-02-26 1989-01-24 Minnesota Mining And Manufacturing Company Erodable agglomerates and abrasive products containing the same
JPS63274782A (ja) 1987-05-02 1988-11-11 Mishima Kosan Co Ltd ステンレス鋼のラッピング液
JPH01183370A (ja) * 1988-01-11 1989-07-21 Noritake Dia Kk 複合ボンドダイヤモンド砥石とその製造法
US5078753A (en) * 1990-10-09 1992-01-07 Minnesota Mining And Manufacturing Company Coated abrasive containing erodable agglomerates
JPH04250983A (ja) * 1990-11-01 1992-09-07 Noritake Co Ltd 研削用複合砥石
US5152917B1 (en) 1991-02-06 1998-01-13 Minnesota Mining & Mfg Structured abrasive article
US5437754A (en) 1992-01-13 1995-08-01 Minnesota Mining And Manufacturing Company Abrasive article having precise lateral spacing between abrasive composite members
JPH0615572A (ja) * 1992-07-01 1994-01-25 Matsushita Electric Ind Co Ltd 研削砥石
MY114512A (en) * 1992-08-19 2002-11-30 Rodel Inc Polymeric substrate with polymeric microelements
US5435816A (en) 1993-01-14 1995-07-25 Minnesota Mining And Manufacturing Company Method of making an abrasive article
CH686787A5 (de) 1993-10-15 1996-06-28 Diametal Ag Schleifbelag fuer Schleifwerkzeuge und Verfahren zur Herstellung des Schleifbelages.
US5632668A (en) * 1993-10-29 1997-05-27 Minnesota Mining And Manufacturing Company Method for the polishing and finishing of optical lenses
US5454844A (en) * 1993-10-29 1995-10-03 Minnesota Mining And Manufacturing Company Abrasive article, a process of making same, and a method of using same to finish a workpiece surface
EP0741632A1 (en) * 1994-01-28 1996-11-13 Minnesota Mining And Manufacturing Company Coated abrasive containing erodible agglomerates
US5562745A (en) * 1994-03-16 1996-10-08 Minnesota Mining And Manufacturing Company Abrasive articles, methods of making abrasive articles, and methods of using abrasive articles
WO1996010471A1 (en) 1994-09-30 1996-04-11 Minnesota Mining And Manufacturing Company Coated abrasive article, method for preparing the same, and method of using
US5958794A (en) 1995-09-22 1999-09-28 Minnesota Mining And Manufacturing Company Method of modifying an exposed surface of a semiconductor wafer
US5702811A (en) * 1995-10-20 1997-12-30 Ho; Kwok-Lun High performance abrasive articles containing abrasive grains and nonabrasive composite grains
US6595831B1 (en) 1996-05-16 2003-07-22 Ebara Corporation Method for polishing workpieces using fixed abrasives
JPH09314457A (ja) * 1996-05-29 1997-12-09 Speedfam Co Ltd ドレッサ付き片面研磨装置
JP3709044B2 (ja) * 1996-10-17 2005-10-19 昭和電工株式会社 ガラス研磨用研磨材組成物およびその製造方法
JPH10156704A (ja) * 1996-12-03 1998-06-16 Toshiba Mach Co Ltd 研磨方法およびその装置
US5938506A (en) * 1997-06-03 1999-08-17 Speedfam-Ipec Corporation Methods and apparatus for conditioning grinding stones
JP3594199B2 (ja) * 1997-09-08 2004-11-24 独立行政法人理化学研究所 光ドレッシング方法とこの方法による加工装置と砥石
US6183346B1 (en) * 1998-08-05 2001-02-06 3M Innovative Properties Company Abrasive article with embossed isolation layer and methods of making and using
JP4049510B2 (ja) 1999-03-24 2008-02-20 株式会社オハラ 情報記憶媒体用ガラス基板材またはガラスセラミックス基板材の加工方法
US20020077037A1 (en) * 1999-05-03 2002-06-20 Tietz James V. Fixed abrasive articles
JP4030247B2 (ja) * 1999-05-17 2008-01-09 株式会社荏原製作所 ドレッシング装置及びポリッシング装置
US6319108B1 (en) 1999-07-09 2001-11-20 3M Innovative Properties Company Metal bond abrasive article comprising porous ceramic abrasive composites and method of using same to abrade a workpiece
US6602117B1 (en) 2000-08-30 2003-08-05 Micron Technology, Inc. Slurry for use with fixed-abrasive polishing pads in polishing semiconductor device conductive structures that include copper and tungsten and polishing methods
US6645624B2 (en) 2000-11-10 2003-11-11 3M Innovative Properties Company Composite abrasive particles and method of manufacture
US6551366B1 (en) 2000-11-10 2003-04-22 3M Innovative Properties Company Spray drying methods of making agglomerate abrasive grains and abrasive articles
KR20030022105A (ko) 2001-02-20 2003-03-15 가부시키 가이샤 에바라 세이사꾸쇼 폴리싱장치 및 드레싱방법
US6485355B1 (en) 2001-06-22 2002-11-26 International Business Machines Corporation Method to increase removal rate of oxide using fixed-abrasive
CA2454079A1 (en) * 2001-08-02 2003-02-13 3M Innovative Properties Company Glass-ceramics
JP2003251560A (ja) * 2002-02-28 2003-09-09 Sanwa Kenma Kogyo Kk ドレッシング用成形体およびその製造方法
US6910951B2 (en) 2003-02-24 2005-06-28 Dow Global Technologies, Inc. Materials and methods for chemical-mechanical planarization
IL156094A0 (en) 2003-05-25 2003-12-23 J G Systems Inc Fixed abrasive cmp pad with built-in additives
JP4443870B2 (ja) * 2003-07-07 2010-03-31 克雄 庄司 超砥粒ホイール及びその製造方法
US7160178B2 (en) * 2003-08-07 2007-01-09 3M Innovative Properties Company In situ activation of a three-dimensional fixed abrasive article
JP2005271157A (ja) * 2004-03-25 2005-10-06 Noritake Super Abrasive:Kk ラップホイール

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