JP2009502532A5 - - Google Patents

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Publication number
JP2009502532A5
JP2009502532A5 JP2008523964A JP2008523964A JP2009502532A5 JP 2009502532 A5 JP2009502532 A5 JP 2009502532A5 JP 2008523964 A JP2008523964 A JP 2008523964A JP 2008523964 A JP2008523964 A JP 2008523964A JP 2009502532 A5 JP2009502532 A5 JP 2009502532A5
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JP
Japan
Prior art keywords
hardness
workpiece
abrasive
composite
providing
Prior art date
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Application number
JP2008523964A
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English (en)
Japanese (ja)
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JP5620639B2 (ja
JP2009502532A (ja
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Publication date
Priority claimed from US11/191,711 external-priority patent/US7494519B2/en
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Publication of JP2009502532A publication Critical patent/JP2009502532A/ja
Publication of JP2009502532A5 publication Critical patent/JP2009502532A5/ja
Application granted granted Critical
Publication of JP5620639B2 publication Critical patent/JP5620639B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2008523964A 2005-07-28 2006-07-19 研磨材粒塊で研磨する方法 Expired - Fee Related JP5620639B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/191,711 2005-07-28
US11/191,711 US7494519B2 (en) 2005-07-28 2005-07-28 Abrasive agglomerate polishing method
PCT/US2006/028061 WO2007015909A1 (en) 2005-07-28 2006-07-19 Abrasive agglomerate polishing method

Publications (3)

Publication Number Publication Date
JP2009502532A JP2009502532A (ja) 2009-01-29
JP2009502532A5 true JP2009502532A5 (enExample) 2009-09-03
JP5620639B2 JP5620639B2 (ja) 2014-11-05

Family

ID=37401245

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008523964A Expired - Fee Related JP5620639B2 (ja) 2005-07-28 2006-07-19 研磨材粒塊で研磨する方法

Country Status (9)

Country Link
US (1) US7494519B2 (enExample)
EP (1) EP1910025B1 (enExample)
JP (1) JP5620639B2 (enExample)
KR (1) KR101299272B1 (enExample)
CN (1) CN101232969B (enExample)
AT (1) ATE496729T1 (enExample)
DE (1) DE602006019876D1 (enExample)
TW (1) TWI402136B (enExample)
WO (1) WO2007015909A1 (enExample)

Families Citing this family (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7594845B2 (en) * 2005-10-20 2009-09-29 3M Innovative Properties Company Abrasive article and method of modifying the surface of a workpiece
US7573073B2 (en) * 2005-11-22 2009-08-11 3M Innovative Properties Company Arrays of light emitting articles and method of manufacturing same
KR20090089431A (ko) * 2006-11-17 2009-08-21 쓰리엠 이노베이티브 프로퍼티즈 컴파니 Ｌｅｄ 광원용 광학 접합 조성물
US20100051970A1 (en) * 2006-11-17 2010-03-04 Ouderkirk Andrew J Planarized led with optical extractor
CN101548398A (zh) * 2006-11-20 2009-09-30 3M创新有限公司 用于led光源的光学粘合组合物
JP4561732B2 (ja) * 2006-11-20 2010-10-13 トヨタ自動車株式会社 移動体位置測位装置
US8323072B1 (en) 2007-03-21 2012-12-04 3M Innovative Properties Company Method of polishing transparent armor
US8038750B2 (en) 2007-07-13 2011-10-18 3M Innovative Properties Company Structured abrasive with overlayer, and method of making and using the same
EP2367894A4 (en) * 2008-11-17 2015-03-04 Saint Gobain Abrasives Inc ACRYLATE COLOR-STABILIZED PHENOL-CONTAINED ABRASIVES AND THEIR PREPARATION
JP2010194704A (ja) * 2009-01-27 2010-09-09 Shinano Denki Seiren Kk 定盤修正用砥石、定盤修正用研磨装置及び研磨定盤の修正方法
KR101271444B1 (ko) * 2009-06-04 2013-06-05 가부시키가이샤 사무코 고정 연마 입자 가공 장치 및 고정 연마 입자 가공 방법, 그리고 반도체 웨이퍼 제조 방법
US8603350B2 (en) * 2009-07-17 2013-12-10 Ohara Inc. Method of manufacturing substrate for information storage media
JP2011045938A (ja) * 2009-08-25 2011-03-10 Three M Innovative Properties Co 焼成凝集体の製造方法、焼成凝集体、研磨材組成物及び研磨材物品。
US8360823B2 (en) 2010-06-15 2013-01-29 3M Innovative Properties Company Splicing technique for fixed abrasives used in chemical mechanical planarization
CN106057218B (zh) * 2010-08-31 2018-02-06 Hoya株式会社 磁盘用玻璃基板的制造方法以及磁盘的制造方法
US20130065490A1 (en) 2011-09-12 2013-03-14 3M Innovative Properties Company Method of refurbishing vinyl composition tile
JPWO2013153880A1 (ja) * 2012-04-10 2015-12-17 旭硝子株式会社 ガラス基板の研磨方法
US20130324021A1 (en) * 2012-05-31 2013-12-05 Webster Ryan Diamond impregnated polishing pad with diamond pucks
JP5373171B1 (ja) * 2012-10-20 2013-12-18 株式会社ナノテム 砥石およびそれを用いた研削・研磨装置
EP3049215B1 (en) 2013-09-25 2021-04-14 3M Innovative Properties Company Composite ceramic abrasive polishing solution
KR102252673B1 (ko) 2013-09-25 2021-05-18 쓰리엠 이노베이티브 프로퍼티즈 컴파니 다층화된 폴리싱 패드
WO2015073258A1 (en) 2013-11-12 2015-05-21 3M Innovative Properties Company Structured abrasive articles and methods of using the same
WO2015088953A1 (en) 2013-12-09 2015-06-18 3M Innovative Properties Company Conglomerate abrasive particles, abrasive articles including the same, and methods of making the same
JP6838811B2 (ja) 2014-05-02 2021-03-03 スリーエム イノベイティブ プロパティズ カンパニー 断続的構造化研磨物品並びに被加工物の研磨方法
US9149904B1 (en) 2014-06-13 2015-10-06 Seagate Technology Llc Platen for wafer polishing having diamond-ceramic composites
CN106574147A (zh) * 2014-08-01 2017-04-19 3M创新有限公司 抛光液及其使用方法
US10086500B2 (en) * 2014-12-18 2018-10-02 Applied Materials, Inc. Method of manufacturing a UV curable CMP polishing pad
CN105140155B (zh) * 2015-07-15 2018-06-05 桂林电子科技大学 一种用于GaAs MMIC减薄工艺的粘片方法
EP3192844B1 (en) * 2016-01-12 2021-02-24 Eoswiss Engineering Sarl Method and device for chemical mechanical polishing
EP3408342B1 (en) 2016-01-25 2024-03-06 CMC Materials LLC Polishing composition comprising cationic polymer additive
US10195713B2 (en) 2016-08-11 2019-02-05 3M Innovative Properties Company Lapping pads and systems and methods of making and using the same
GB201616955D0 (en) * 2016-10-06 2016-11-23 University Of Newcastle Upon Tyne Micro-milling
EP3864104A1 (en) * 2018-10-11 2021-08-18 3M Innovative Properties Company Supported abrasive particles, abrasive articles, and methods of making the same
JP7435436B2 (ja) * 2020-12-24 2024-02-21 株式会社Sumco キャリアプレートの研磨方法
CN113549424B (zh) * 2021-08-04 2022-05-13 白鸽磨料磨具有限公司 一种抛光用氧化铈团簇粉及其制备方法
US20250282021A1 (en) * 2024-03-07 2025-09-11 Wolfspeed, Inc. Disc Grinding for Semiconductor Wafers on Polishing System

Family Cites Families (46)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4311489A (en) 1978-08-04 1982-01-19 Norton Company Coated abrasive having brittle agglomerates of abrasive grain
JPS61226260A (ja) * 1985-03-30 1986-10-08 Mitsubishi Metal Corp 研削盤におけるドレツシング装置
US4652275A (en) 1985-08-07 1987-03-24 Minnesota Mining And Manufacturing Company Erodable agglomerates and abrasive products containing the same
US4799939A (en) 1987-02-26 1989-01-24 Minnesota Mining And Manufacturing Company Erodable agglomerates and abrasive products containing the same
JPS63274782A (ja) 1987-05-02 1988-11-11 Mishima Kosan Co Ltd ステンレス鋼のラッピング液
JPS63283862A (ja) * 1987-05-15 1988-11-21 Shintou Bureetaa Kk 研摩方法及び研摩装置
JPH01183370A (ja) * 1988-01-11 1989-07-21 Noritake Dia Kk 複合ボンドダイヤモンド砥石とその製造法
US5078753A (en) 1990-10-09 1992-01-07 Minnesota Mining And Manufacturing Company Coated abrasive containing erodable agglomerates
JPH04250983A (ja) * 1990-11-01 1992-09-07 Noritake Co Ltd 研削用複合砥石
US5152917B1 (en) 1991-02-06 1998-01-13 Minnesota Mining & Mfg Structured abrasive article
US5437754A (en) 1992-01-13 1995-08-01 Minnesota Mining And Manufacturing Company Abrasive article having precise lateral spacing between abrasive composite members
JPH0615572A (ja) * 1992-07-01 1994-01-25 Matsushita Electric Ind Co Ltd 研削砥石
MY114512A (en) 1992-08-19 2002-11-30 Rodel Inc Polymeric substrate with polymeric microelements
US5435816A (en) 1993-01-14 1995-07-25 Minnesota Mining And Manufacturing Company Method of making an abrasive article
CH686787A5 (de) 1993-10-15 1996-06-28 Diametal Ag Schleifbelag fuer Schleifwerkzeuge und Verfahren zur Herstellung des Schleifbelages.
US5632668A (en) 1993-10-29 1997-05-27 Minnesota Mining And Manufacturing Company Method for the polishing and finishing of optical lenses
US5454844A (en) 1993-10-29 1995-10-03 Minnesota Mining And Manufacturing Company Abrasive article, a process of making same, and a method of using same to finish a workpiece surface
WO1995020469A1 (en) * 1994-01-28 1995-08-03 Minnesota Mining And Manufacturing Company Coated abrasive containing erodible agglomerates
US5562745A (en) 1994-03-16 1996-10-08 Minnesota Mining And Manufacturing Company Abrasive articles, methods of making abrasive articles, and methods of using abrasive articles
BR9509116A (pt) 1994-09-30 1997-11-18 Minnesota Mining & Mfg Artigo abrasivo revestido processos para produzir o mesmo e processo para desbastar uma peça dura
US5958794A (en) 1995-09-22 1999-09-28 Minnesota Mining And Manufacturing Company Method of modifying an exposed surface of a semiconductor wafer
US5702811A (en) 1995-10-20 1997-12-30 Ho; Kwok-Lun High performance abrasive articles containing abrasive grains and nonabrasive composite grains
US6595831B1 (en) 1996-05-16 2003-07-22 Ebara Corporation Method for polishing workpieces using fixed abrasives
JP3709044B2 (ja) * 1996-10-17 2005-10-19 昭和電工株式会社 ガラス研磨用研磨材組成物およびその製造方法
JPH10156704A (ja) * 1996-12-03 1998-06-16 Toshiba Mach Co Ltd 研磨方法およびその装置
US6648733B2 (en) 1997-04-04 2003-11-18 Rodel Holdings, Inc. Polishing pads and methods relating thereto
US6117000A (en) * 1998-07-10 2000-09-12 Cabot Corporation Polishing pad for a semiconductor substrate
US6183346B1 (en) 1998-08-05 2001-02-06 3M Innovative Properties Company Abrasive article with embossed isolation layer and methods of making and using
JP2000117606A (ja) * 1998-10-09 2000-04-25 Asahi Glass Co Ltd ブラウン管用ガラスパネルのフェース面研削方法
JP4049510B2 (ja) 1999-03-24 2008-02-20 株式会社オハラ 情報記憶媒体用ガラス基板材またはガラスセラミックス基板材の加工方法
WO2000064894A1 (en) * 1999-04-23 2000-11-02 Takeda Chemical Industries, Ltd. 5-pyridyl-1,3-azole compounds, process for producing the same and use thereof
US20020077037A1 (en) * 1999-05-03 2002-06-20 Tietz James V. Fixed abrasive articles
US6319108B1 (en) 1999-07-09 2001-11-20 3M Innovative Properties Company Metal bond abrasive article comprising porous ceramic abrasive composites and method of using same to abrade a workpiece
US6602117B1 (en) 2000-08-30 2003-08-05 Micron Technology, Inc. Slurry for use with fixed-abrasive polishing pads in polishing semiconductor device conductive structures that include copper and tungsten and polishing methods
US6645624B2 (en) 2000-11-10 2003-11-11 3M Innovative Properties Company Composite abrasive particles and method of manufacture
US6551366B1 (en) 2000-11-10 2003-04-22 3M Innovative Properties Company Spray drying methods of making agglomerate abrasive grains and abrasive articles
US20030100246A1 (en) 2001-02-20 2003-05-29 Kazuto Hirokawa Polishing apparatus and dressing method
US6485355B1 (en) 2001-06-22 2002-11-26 International Business Machines Corporation Method to increase removal rate of oxide using fixed-abrasive
CN100360447C (zh) 2001-08-02 2008-01-09 3M创新有限公司 玻璃陶瓷
JP2003251560A (ja) * 2002-02-28 2003-09-09 Sanwa Kenma Kogyo Kk ドレッシング用成形体およびその製造方法
US6910951B2 (en) 2003-02-24 2005-06-28 Dow Global Technologies, Inc. Materials and methods for chemical-mechanical planarization
IL156094A0 (en) 2003-05-25 2003-12-23 J G Systems Inc Fixed abrasive cmp pad with built-in additives
JP4443870B2 (ja) * 2003-07-07 2010-03-31 克雄 庄司 超砥粒ホイール及びその製造方法
JP2005088153A (ja) * 2003-09-19 2005-04-07 Allied Material Corp ダイヤモンドラップ定盤による硬脆材料の平面研削加工法
JP2005271157A (ja) * 2004-03-25 2005-10-06 Noritake Super Abrasive:Kk ラップホイール
US7169031B1 (en) * 2005-07-28 2007-01-30 3M Innovative Properties Company Self-contained conditioning abrasive article

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