JP2009502532A5 - - Google Patents

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Publication number
JP2009502532A5
JP2009502532A5 JP2008523964A JP2008523964A JP2009502532A5 JP 2009502532 A5 JP2009502532 A5 JP 2009502532A5 JP 2008523964 A JP2008523964 A JP 2008523964A JP 2008523964 A JP2008523964 A JP 2008523964A JP 2009502532 A5 JP2009502532 A5 JP 2009502532A5
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JP
Japan
Prior art keywords
hardness
workpiece
abrasive
composite
providing
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2008523964A
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English (en)
Japanese (ja)
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JP5620639B2 (ja
JP2009502532A (ja
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Publication date
Priority claimed from US11/191,711 external-priority patent/US7494519B2/en
Application filed filed Critical
Publication of JP2009502532A publication Critical patent/JP2009502532A/ja
Publication of JP2009502532A5 publication Critical patent/JP2009502532A5/ja
Application granted granted Critical
Publication of JP5620639B2 publication Critical patent/JP5620639B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2008523964A 2005-07-28 2006-07-19 研磨材粒塊で研磨する方法 Expired - Fee Related JP5620639B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/191,711 2005-07-28
US11/191,711 US7494519B2 (en) 2005-07-28 2005-07-28 Abrasive agglomerate polishing method
PCT/US2006/028061 WO2007015909A1 (en) 2005-07-28 2006-07-19 Abrasive agglomerate polishing method

Publications (3)

Publication Number Publication Date
JP2009502532A JP2009502532A (ja) 2009-01-29
JP2009502532A5 true JP2009502532A5 (enExample) 2009-09-03
JP5620639B2 JP5620639B2 (ja) 2014-11-05

Family

ID=37401245

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008523964A Expired - Fee Related JP5620639B2 (ja) 2005-07-28 2006-07-19 研磨材粒塊で研磨する方法

Country Status (9)

Country Link
US (1) US7494519B2 (enExample)
EP (1) EP1910025B1 (enExample)
JP (1) JP5620639B2 (enExample)
KR (1) KR101299272B1 (enExample)
CN (1) CN101232969B (enExample)
AT (1) ATE496729T1 (enExample)
DE (1) DE602006019876D1 (enExample)
TW (1) TWI402136B (enExample)
WO (1) WO2007015909A1 (enExample)

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CN105722643B (zh) 2013-11-12 2018-06-05 3M创新有限公司 结构化磨料制品及其使用方法
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JP6838811B2 (ja) 2014-05-02 2021-03-03 スリーエム イノベイティブ プロパティズ カンパニー 断続的構造化研磨物品並びに被加工物の研磨方法
US9149904B1 (en) 2014-06-13 2015-10-06 Seagate Technology Llc Platen for wafer polishing having diamond-ceramic composites
JP2017530210A (ja) * 2014-08-01 2017-10-12 スリーエム イノベイティブ プロパティズ カンパニー 研磨液及びその使用方法
US10086500B2 (en) * 2014-12-18 2018-10-02 Applied Materials, Inc. Method of manufacturing a UV curable CMP polishing pad
CN105140155B (zh) * 2015-07-15 2018-06-05 桂林电子科技大学 一种用于GaAs MMIC减薄工艺的粘片方法
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JP6936233B2 (ja) 2016-01-25 2021-09-15 シーエムシー マテリアルズ，インコーポレイティド カチオン重合体助剤を含む研磨組成物
US10195713B2 (en) 2016-08-11 2019-02-05 3M Innovative Properties Company Lapping pads and systems and methods of making and using the same
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WO2020075005A1 (en) * 2018-10-11 2020-04-16 3M Innovative Properties Company Supported abrasive particles, abrasive articles, and methods of making the same
JP7435436B2 (ja) * 2020-12-24 2024-02-21 株式会社Sumco キャリアプレートの研磨方法
CN113549424B (zh) * 2021-08-04 2022-05-13 白鸽磨料磨具有限公司 一种抛光用氧化铈团簇粉及其制备方法
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