JP2010502458A5 - - Google Patents
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- Publication number
- JP2010502458A5 JP2010502458A5 JP2009526795A JP2009526795A JP2010502458A5 JP 2010502458 A5 JP2010502458 A5 JP 2010502458A5 JP 2009526795 A JP2009526795 A JP 2009526795A JP 2009526795 A JP2009526795 A JP 2009526795A JP 2010502458 A5 JP2010502458 A5 JP 2010502458A5
- Authority
- JP
- Japan
- Prior art keywords
- abrasive article
- layer
- abrasive
- foil
- discreet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011888 foil Substances 0.000 claims 4
- 239000002245 particle Substances 0.000 claims 4
- 239000000956 alloy Substances 0.000 claims 2
- 229910045601 alloy Inorganic materials 0.000 claims 2
- 239000002184 metal Substances 0.000 claims 2
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US82404806P | 2006-08-30 | 2006-08-30 | |
| US60/824,048 | 2006-08-30 | ||
| PCT/US2007/075791 WO2008027714A1 (en) | 2006-08-30 | 2007-08-13 | Extended life abrasive article and method |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2010502458A JP2010502458A (ja) | 2010-01-28 |
| JP2010502458A5 true JP2010502458A5 (enExample) | 2010-10-14 |
| JP5285609B2 JP5285609B2 (ja) | 2013-09-11 |
Family
ID=39136260
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009526795A Expired - Fee Related JP5285609B2 (ja) | 2006-08-30 | 2007-08-13 | 長寿命化された研磨物品及び方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US8377158B2 (enExample) |
| EP (1) | EP2076360A4 (enExample) |
| JP (1) | JP5285609B2 (enExample) |
| KR (1) | KR101483314B1 (enExample) |
| CN (1) | CN101511542B (enExample) |
| TW (1) | TWI522447B (enExample) |
| WO (1) | WO2008027714A1 (enExample) |
Families Citing this family (52)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9463552B2 (en) | 1997-04-04 | 2016-10-11 | Chien-Min Sung | Superbrasvie tools containing uniformly leveled superabrasive particles and associated methods |
| US9409280B2 (en) | 1997-04-04 | 2016-08-09 | Chien-Min Sung | Brazed diamond tools and methods for making the same |
| US9199357B2 (en) * | 1997-04-04 | 2015-12-01 | Chien-Min Sung | Brazed diamond tools and methods for making the same |
| US9221154B2 (en) | 1997-04-04 | 2015-12-29 | Chien-Min Sung | Diamond tools and methods for making the same |
| US9238207B2 (en) | 1997-04-04 | 2016-01-19 | Chien-Min Sung | Brazed diamond tools and methods for making the same |
| US9868100B2 (en) | 1997-04-04 | 2018-01-16 | Chien-Min Sung | Brazed diamond tools and methods for making the same |
| US9724802B2 (en) | 2005-05-16 | 2017-08-08 | Chien-Min Sung | CMP pad dressers having leveled tips and associated methods |
| US8393934B2 (en) | 2006-11-16 | 2013-03-12 | Chien-Min Sung | CMP pad dressers with hybridized abrasive surface and related methods |
| US8678878B2 (en) | 2009-09-29 | 2014-03-25 | Chien-Min Sung | System for evaluating and/or improving performance of a CMP pad dresser |
| US9138862B2 (en) | 2011-05-23 | 2015-09-22 | Chien-Min Sung | CMP pad dresser having leveled tips and associated methods |
| DE102008021636B3 (de) * | 2008-04-30 | 2009-11-19 | Esk Ceramics Gmbh & Co. Kg | Verfahren zum Fixieren eines Verbindungselements auf einem Werkstück und Bauteil aus einem Werkstück mit einem darauf fixierten Verbindungselement |
| JP2009302136A (ja) * | 2008-06-10 | 2009-12-24 | Panasonic Corp | 半導体集積回路 |
| US20110104989A1 (en) * | 2009-04-30 | 2011-05-05 | First Principles LLC | Dressing bar for embedding abrasive particles into substrates |
| US8801497B2 (en) | 2009-04-30 | 2014-08-12 | Rdc Holdings, Llc | Array of abrasive members with resilient support |
| US9221148B2 (en) | 2009-04-30 | 2015-12-29 | Rdc Holdings, Llc | Method and apparatus for processing sliders for disk drives, and to various processing media for the same |
| US20100330890A1 (en) | 2009-06-30 | 2010-12-30 | Zine-Eddine Boutaghou | Polishing pad with array of fluidized gimballed abrasive members |
| KR101548147B1 (ko) | 2009-08-14 | 2015-08-28 | 생-고뱅 어브레이시브즈, 인코포레이티드 | 연신체에 연마입자가 결합된 연마제품 |
| KR101433750B1 (ko) | 2009-08-14 | 2014-08-27 | 생-고뱅 어브레이시브즈, 인코포레이티드 | 연신체에 연마입자가 결합된 연마제품, 및 그의 형성 방법 |
| US20110073094A1 (en) * | 2009-09-28 | 2011-03-31 | 3M Innovative Properties Company | Abrasive article with solid core and methods of making the same |
| DE102010038324B4 (de) * | 2010-07-23 | 2012-03-22 | Hilti Aktiengesellschaft | Vorrichtung zum Positionieren von Schneidpartikeln |
| TW201223699A (en) * | 2010-09-03 | 2012-06-16 | Saint Gobain Abrasives Inc | Bonded abrasive articles, method of forming such articles, and grinding performance of such articles |
| TWI544064B (zh) | 2010-09-03 | 2016-08-01 | 聖高拜磨料有限公司 | 粘結的磨料物品及形成方法 |
| TW201507812A (zh) | 2010-12-30 | 2015-03-01 | 聖高拜磨料有限公司 | 磨料物品及形成方法 |
| CN102601747B (zh) * | 2011-01-20 | 2015-12-09 | 中芯国际集成电路制造(上海)有限公司 | 一种研磨垫及其制备方法、使用方法 |
| TWI487019B (en) | 2011-05-23 | 2015-06-01 | Cmp pad dresser having leveled tips and associated methods | |
| JP2014530770A (ja) | 2011-09-16 | 2014-11-20 | サンーゴバンアブレイシブズ,インコーポレイティド | 研磨物品および形成方法 |
| US9211634B2 (en) | 2011-09-29 | 2015-12-15 | Saint-Gobain Abrasives, Inc. | Abrasive articles including abrasive particles bonded to an elongated substrate body having a barrier layer, and methods of forming thereof |
| US9644283B2 (en) * | 2011-09-30 | 2017-05-09 | Apple Inc. | Laser texturizing and anodization surface treatment |
| CN102601746B (zh) * | 2012-02-29 | 2015-04-08 | 河南富耐克超硬材料股份有限公司 | 一种柔性磨具用磨片及该磨片的制造方法 |
| JP5972032B2 (ja) * | 2012-05-01 | 2016-08-17 | 新技術開発株式会社 | 高効率精密加工用研磨工具及びその製法 |
| SG11201407232YA (en) * | 2012-05-04 | 2014-12-30 | Entegris Inc | Cmp conditioner pads with superabrasive grit enhancement |
| TWI477343B (zh) | 2012-06-29 | 2015-03-21 | Saint Gobain Abrasives Inc | 研磨物品及形成方法 |
| TW201402274A (zh) | 2012-06-29 | 2014-01-16 | Saint Gobain Abrasives Inc | 研磨物品及形成方法 |
| TWI474889B (zh) | 2012-06-29 | 2015-03-01 | 聖高拜磨料有限公司 | 研磨物品及形成方法 |
| TW201404527A (zh) | 2012-06-29 | 2014-02-01 | 聖高拜磨料有限公司 | 研磨物品及形成方法 |
| KR101736085B1 (ko) * | 2012-10-15 | 2017-05-16 | 생-고뱅 어브레이시브즈, 인코포레이티드 | 특정한 형태들을 가진 연마 입자들 및 이러한 입자들을 형성하는 방법들 |
| US9266219B2 (en) | 2012-12-31 | 2016-02-23 | Saint-Gobain Abrasives, Inc. | Bonded abrasive article and method of grinding |
| US9102039B2 (en) | 2012-12-31 | 2015-08-11 | Saint-Gobain Abrasives, Inc. | Bonded abrasive article and method of grinding |
| JP2016501735A (ja) | 2012-12-31 | 2016-01-21 | サンーゴバン アブレイシブズ,インコーポレイティド | 結合研磨物品および研削方法 |
| WO2014165447A1 (en) | 2013-03-31 | 2014-10-09 | Saint-Gobain Abrasives, Inc. | Bonded abrasive article and method of grinding |
| TW201441355A (zh) | 2013-04-19 | 2014-11-01 | Saint Gobain Abrasives Inc | 研磨製品及其形成方法 |
| EP2835220B1 (de) * | 2013-08-07 | 2019-09-11 | Reishauer AG | Abrichtwerkzeug sowie ein Verfahren zu dessen Herstellung |
| EP2859997B1 (en) | 2013-10-08 | 2015-09-30 | Valentini, Guido | Method for manufacturing a polishing pad and polishing pad |
| US10786875B2 (en) * | 2014-07-02 | 2020-09-29 | Raytheon Technologies Corporation | Abrasive preforms and manufacture and use methods |
| CN107257721A (zh) * | 2014-12-22 | 2017-10-17 | 3M创新有限公司 | 具有可移除的磨料构件的磨料制品及其分离和更换方法 |
| TWI664057B (zh) | 2015-06-29 | 2019-07-01 | 美商聖高拜磨料有限公司 | 研磨物品及形成方法 |
| CN107520770B (zh) * | 2017-05-04 | 2019-03-08 | 漳州职业技术学院 | 一种磨粒晶体定向分布的耐磨金刚石砂轮制备方法 |
| CN107081688A (zh) * | 2017-05-27 | 2017-08-22 | 江苏省江南新型复合研磨材料及制品工程技术研究中心有限公司 | 一种高强度高性能的复合研磨片及其制造方法 |
| KR102013386B1 (ko) * | 2018-01-29 | 2019-08-22 | 새솔다이아몬드공업 주식회사 | 역도금 패드 컨디셔너 제조방법 및 패드 컨디셔너 |
| KR102554674B1 (ko) * | 2018-02-08 | 2023-07-11 | 스미토모덴키고교가부시키가이샤 | 초지립 및 초지립 휠 |
| US11331767B2 (en) | 2019-02-01 | 2022-05-17 | Micron Technology, Inc. | Pads for chemical mechanical planarization tools, chemical mechanical planarization tools, and related methods |
| KR102227790B1 (ko) * | 2019-11-11 | 2021-03-15 | 동신다이아몬드공업 주식회사 | 다이아몬드 배열 및 패턴을 다양하게 형성시킬수 있도록 제조되는 다이아몬드공구 및 그 제조방법 |
Family Cites Families (31)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3675311A (en) * | 1970-07-02 | 1972-07-11 | Northrop Corp | Thin-film diffusion brazing of nickel and nickel base alloys |
| US4029479A (en) * | 1973-01-29 | 1977-06-14 | Rohr Industries, Inc. | Plated foil for liquid interface bonding of titanium |
| US4706872A (en) * | 1986-10-16 | 1987-11-17 | Rohr Industries, Inc. | Method of bonding columbium to nickel and nickel based alloys using low bonding pressures and temperatures |
| JPH0197570A (ja) | 1987-10-06 | 1989-04-17 | Noritake Dia Kk | メタルボンド砥石用ダイヤモンド砥材 |
| JPH01246516A (ja) * | 1988-03-29 | 1989-10-02 | Sony Corp | 焦点位置検出装置 |
| US5049165B1 (en) * | 1989-01-30 | 1995-09-26 | Ultimate Abrasive Syst Inc | Composite material |
| JP3026988B2 (ja) | 1990-02-05 | 2000-03-27 | 東京磁気印刷株式会社 | 研磨具 |
| JPH04129660A (ja) | 1990-09-19 | 1992-04-30 | Hitachi Ltd | 磁気ディスクおよびその基板の表面加工方法 |
| CN2104731U (zh) * | 1991-07-24 | 1992-05-20 | 张希浩 | 电镀金刚石磨削工具 |
| US5234152A (en) * | 1992-01-07 | 1993-08-10 | Regents Of The University Of California | Transient liquid phase ceramic bonding |
| US6654061B2 (en) * | 1995-06-14 | 2003-11-25 | Canon Kabushiki Kaisha | Automatic focus adjusting apparatus and method utilized by an image sensing apparatus |
| US20040112359A1 (en) * | 1997-04-04 | 2004-06-17 | Chien-Min Sung | Brazed diamond tools and methods for making the same |
| TW394723B (en) * | 1997-04-04 | 2000-06-21 | Sung Chien Min | Abrasive tools with patterned grit distribution and method of manufacture |
| US7124753B2 (en) | 1997-04-04 | 2006-10-24 | Chien-Min Sung | Brazed diamond tools and methods for making the same |
| US6884155B2 (en) * | 1999-11-22 | 2005-04-26 | Kinik | Diamond grid CMP pad dresser |
| US6537140B1 (en) * | 1997-05-14 | 2003-03-25 | Saint-Gobain Abrasives Technology Company | Patterned abrasive tools |
| US6123612A (en) * | 1998-04-15 | 2000-09-26 | 3M Innovative Properties Company | Corrosion resistant abrasive article and method of making |
| JP2000106353A (ja) * | 1998-07-31 | 2000-04-11 | Nippon Steel Corp | 半導体基板用研磨布のドレッサ― |
| TW467809B (en) * | 1999-12-17 | 2001-12-11 | Ultimate Abrasive Systems Llc | Abrasive surface and article and methods for making them |
| US20020012063A1 (en) * | 2000-03-10 | 2002-01-31 | Olympus Optical Co., Ltd. | Apparatus for automatically detecting focus and camera equipped with automatic focus detecting apparatus |
| JP2002209912A (ja) | 2001-01-22 | 2002-07-30 | Masayuki Nakagawa | 歯科技工用モデルトリーマー専用ディスク形超砥粒電着砥石の構造並に製造の方法。 |
| FR2820666B1 (fr) * | 2001-02-14 | 2003-04-11 | Arjo Wiggins Sa | Support autoagrippant pour un produit abrasif applique et procede de fabrication dudit produit abrasif l'incorporant |
| US6669745B2 (en) * | 2001-02-21 | 2003-12-30 | 3M Innovative Properties Company | Abrasive article with optimally oriented abrasive particles and method of making the same |
| JP2003051980A (ja) * | 2001-08-08 | 2003-02-21 | Matsushita Electric Ind Co Ltd | オートフォーカス装置及び撮像装置並びにカメラシステム |
| JP3795786B2 (ja) * | 2001-10-09 | 2006-07-12 | 敬久 山崎 | ろう付けしたダイヤモンド及びダイヤモンドのろう付け方法 |
| JP3975395B2 (ja) * | 2002-02-26 | 2007-09-12 | フジノン株式会社 | カメラシステム |
| JP4045483B2 (ja) * | 2002-03-13 | 2008-02-13 | フジノン株式会社 | ピント状態検出装置 |
| JP4647885B2 (ja) * | 2003-02-17 | 2011-03-09 | 株式会社ニコン | カメラ |
| JP4463084B2 (ja) * | 2003-11-27 | 2010-05-12 | 株式会社オクテック | ドレッシング工具 |
| JP2005219152A (ja) * | 2004-02-04 | 2005-08-18 | Ebara Corp | ドレッサおよびその製造方法 |
| JP4506634B2 (ja) | 2005-10-03 | 2010-07-21 | トヨタ紡織株式会社 | フィルタ及びクリーナ |
-
2007
- 2007-08-13 JP JP2009526795A patent/JP5285609B2/ja not_active Expired - Fee Related
- 2007-08-13 EP EP07814031A patent/EP2076360A4/en not_active Withdrawn
- 2007-08-13 WO PCT/US2007/075791 patent/WO2008027714A1/en not_active Ceased
- 2007-08-13 CN CN2007800324263A patent/CN101511542B/zh not_active Expired - Fee Related
- 2007-08-13 US US11/837,774 patent/US8377158B2/en not_active Expired - Fee Related
- 2007-08-13 KR KR20097004215A patent/KR101483314B1/ko not_active Expired - Fee Related
- 2007-08-23 TW TW096131276A patent/TWI522447B/zh not_active IP Right Cessation
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