TWI402136B - 研磨附聚物拋光方法 - Google Patents
研磨附聚物拋光方法 Download PDFInfo
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- TWI402136B TWI402136B TW095127479A TW95127479A TWI402136B TW I402136 B TWI402136 B TW I402136B TW 095127479 A TW095127479 A TW 095127479A TW 95127479 A TW95127479 A TW 95127479A TW I402136 B TWI402136 B TW I402136B
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- abrasive
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/013—Application of loose grinding agent as auxiliary tool during truing operation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
- B24B37/245—Pads with fixed abrasives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/007—Cleaning of grinding wheels
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
- B24D7/06—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with inserted abrasive blocks, e.g. segmental
- B24D7/063—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with inserted abrasive blocks, e.g. segmental with segments embedded in a matrix which is rubbed away during the grinding process
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
- Pharmaceuticals Containing Other Organic And Inorganic Compounds (AREA)
- Cosmetics (AREA)
- Saccharide Compounds (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/191,711 US7494519B2 (en) | 2005-07-28 | 2005-07-28 | Abrasive agglomerate polishing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200720020A TW200720020A (en) | 2007-06-01 |
| TWI402136B true TWI402136B (zh) | 2013-07-21 |
Family
ID=37401245
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW095127479A TWI402136B (zh) | 2005-07-28 | 2006-07-27 | 研磨附聚物拋光方法 |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US7494519B2 (enExample) |
| EP (1) | EP1910025B1 (enExample) |
| JP (1) | JP5620639B2 (enExample) |
| KR (1) | KR101299272B1 (enExample) |
| CN (1) | CN101232969B (enExample) |
| AT (1) | ATE496729T1 (enExample) |
| DE (1) | DE602006019876D1 (enExample) |
| TW (1) | TWI402136B (enExample) |
| WO (1) | WO2007015909A1 (enExample) |
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| US7594845B2 (en) * | 2005-10-20 | 2009-09-29 | 3M Innovative Properties Company | Abrasive article and method of modifying the surface of a workpiece |
| CN101313417B (zh) * | 2005-11-22 | 2011-04-20 | 3M创新有限公司 | 发光制品的阵列及其制造方法 |
| EP2087533A2 (en) * | 2006-11-17 | 2009-08-12 | 3M Innovative Properties Company | Planarized led with optical extractor |
| JP2010510671A (ja) * | 2006-11-17 | 2010-04-02 | スリーエム イノベイティブ プロパティズ カンパニー | Ｌｅｄ光源用の光学接着組成物 |
| JP4561732B2 (ja) * | 2006-11-20 | 2010-10-13 | トヨタ自動車株式会社 | 移動体位置測位装置 |
| CN101548398A (zh) * | 2006-11-20 | 2009-09-30 | 3M创新有限公司 | 用于led光源的光学粘合组合物 |
| US8323072B1 (en) | 2007-03-21 | 2012-12-04 | 3M Innovative Properties Company | Method of polishing transparent armor |
| US8038750B2 (en) | 2007-07-13 | 2011-10-18 | 3M Innovative Properties Company | Structured abrasive with overlayer, and method of making and using the same |
| CN102272258B (zh) * | 2008-11-17 | 2014-08-20 | 圣戈班磨料磨具有限公司 | 丙烯酸酯稳定颜色的、酚醛树脂粘结的磨料产品及制造其的方法 |
| JP2010194704A (ja) * | 2009-01-27 | 2010-09-09 | Shinano Denki Seiren Kk | 定盤修正用砥石、定盤修正用研磨装置及び研磨定盤の修正方法 |
| KR101271444B1 (ko) * | 2009-06-04 | 2013-06-05 | 가부시키가이샤 사무코 | 고정 연마 입자 가공 장치 및 고정 연마 입자 가공 방법, 그리고 반도체 웨이퍼 제조 방법 |
| US8603350B2 (en) * | 2009-07-17 | 2013-12-10 | Ohara Inc. | Method of manufacturing substrate for information storage media |
| JP2011045938A (ja) * | 2009-08-25 | 2011-03-10 | Three M Innovative Properties Co | 焼成凝集体の製造方法、焼成凝集体、研磨材組成物及び研磨材物品。 |
| US8360823B2 (en) * | 2010-06-15 | 2013-01-29 | 3M Innovative Properties Company | Splicing technique for fixed abrasives used in chemical mechanical planarization |
| CN102985971B (zh) * | 2010-08-31 | 2016-06-01 | Hoya株式会社 | 磁盘用玻璃基板的制造方法以及磁盘的制造方法 |
| US20130065490A1 (en) * | 2011-09-12 | 2013-03-14 | 3M Innovative Properties Company | Method of refurbishing vinyl composition tile |
| KR20150007277A (ko) * | 2012-04-10 | 2015-01-20 | 아사히 가라스 가부시키가이샤 | 유리 기판의 연마 방법 |
| US20130324021A1 (en) * | 2012-05-31 | 2013-12-05 | Webster Ryan | Diamond impregnated polishing pad with diamond pucks |
| JP5373171B1 (ja) * | 2012-10-20 | 2013-12-18 | 株式会社ナノテム | 砥石およびそれを用いた研削・研磨装置 |
| EP3049215B1 (en) | 2013-09-25 | 2021-04-14 | 3M Innovative Properties Company | Composite ceramic abrasive polishing solution |
| CN105579194B (zh) | 2013-09-25 | 2019-04-26 | 3M创新有限公司 | 多层抛光垫 |
| BR112016010724B1 (pt) | 2013-11-12 | 2021-11-16 | 3M Innovative Properties Company | Artigo abrasivo estruturado |
| JP6561058B2 (ja) | 2013-12-09 | 2019-08-14 | スリーエム イノベイティブ プロパティズ カンパニー | 集塊性研磨粒子、その粒子を含む研磨物品、及びその製造方法 |
| JP6838811B2 (ja) | 2014-05-02 | 2021-03-03 | スリーエム イノベイティブ プロパティズ カンパニー | 断続的構造化研磨物品並びに被加工物の研磨方法 |
| US9149904B1 (en) | 2014-06-13 | 2015-10-06 | Seagate Technology Llc | Platen for wafer polishing having diamond-ceramic composites |
| WO2016019211A1 (en) * | 2014-08-01 | 2016-02-04 | 3M Innovative Properties Company | Polishing solutions and methods of using same |
| US10086500B2 (en) * | 2014-12-18 | 2018-10-02 | Applied Materials, Inc. | Method of manufacturing a UV curable CMP polishing pad |
| CN105140155B (zh) * | 2015-07-15 | 2018-06-05 | 桂林电子科技大学 | 一种用于GaAs MMIC减薄工艺的粘片方法 |
| EP3192844B1 (en) * | 2016-01-12 | 2021-02-24 | Eoswiss Engineering Sarl | Method and device for chemical mechanical polishing |
| KR102728543B1 (ko) | 2016-01-25 | 2024-11-08 | 씨엠씨 머티리얼즈 엘엘씨 | 양이온성 중합체 첨가제를 포함하는 연마용 조성물 |
| US10195713B2 (en) | 2016-08-11 | 2019-02-05 | 3M Innovative Properties Company | Lapping pads and systems and methods of making and using the same |
| GB201616955D0 (en) * | 2016-10-06 | 2016-11-23 | University Of Newcastle Upon Tyne | Micro-milling |
| CN112969768B (zh) * | 2018-10-11 | 2022-06-28 | 3M创新有限公司 | 受支撑磨料颗粒、磨料制品及其制备方法 |
| JP7435436B2 (ja) * | 2020-12-24 | 2024-02-21 | 株式会社Sumco | キャリアプレートの研磨方法 |
| CN113549424B (zh) * | 2021-08-04 | 2022-05-13 | 白鸽磨料磨具有限公司 | 一种抛光用氧化铈团簇粉及其制备方法 |
| US20250282021A1 (en) * | 2024-03-07 | 2025-09-11 | Wolfspeed, Inc. | Disc Grinding for Semiconductor Wafers on Polishing System |
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-
2005
- 2005-07-28 US US11/191,711 patent/US7494519B2/en active Active
-
2006
- 2006-07-19 AT AT06787879T patent/ATE496729T1/de not_active IP Right Cessation
- 2006-07-19 CN CN2006800276462A patent/CN101232969B/zh not_active Expired - Lifetime
- 2006-07-19 WO PCT/US2006/028061 patent/WO2007015909A1/en not_active Ceased
- 2006-07-19 DE DE602006019876T patent/DE602006019876D1/de not_active Expired - Lifetime
- 2006-07-19 JP JP2008523964A patent/JP5620639B2/ja not_active Expired - Fee Related
- 2006-07-19 EP EP06787879A patent/EP1910025B1/en not_active Expired - Lifetime
- 2006-07-19 KR KR1020087002051A patent/KR101299272B1/ko not_active Expired - Fee Related
- 2006-07-27 TW TW095127479A patent/TWI402136B/zh not_active IP Right Cessation
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW565488B (en) * | 2001-07-20 | 2003-12-11 | 3M Innovative Properties Co | Fixed abrasive articles |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101232969B (zh) | 2011-05-11 |
| EP1910025A1 (en) | 2008-04-16 |
| KR20080030057A (ko) | 2008-04-03 |
| TW200720020A (en) | 2007-06-01 |
| KR101299272B1 (ko) | 2013-08-23 |
| US7494519B2 (en) | 2009-02-24 |
| EP1910025B1 (en) | 2011-01-26 |
| ATE496729T1 (de) | 2011-02-15 |
| US20070026770A1 (en) | 2007-02-01 |
| JP2009502532A (ja) | 2009-01-29 |
| DE602006019876D1 (de) | 2011-03-10 |
| CN101232969A (zh) | 2008-07-30 |
| WO2007015909A1 (en) | 2007-02-08 |
| JP5620639B2 (ja) | 2014-11-05 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |