CN101232969B - 磨料团聚体抛光方法 - Google Patents

磨料团聚体抛光方法 Download PDF

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Publication number
CN101232969B
CN101232969B CN2006800276462A CN200680027646A CN101232969B CN 101232969 B CN101232969 B CN 101232969B CN 2006800276462 A CN2006800276462 A CN 2006800276462A CN 200680027646 A CN200680027646 A CN 200680027646A CN 101232969 B CN101232969 B CN 101232969B
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CN
China
Prior art keywords
abrasive
particles
conditioning
workpiece
hardness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN2006800276462A
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English (en)
Chinese (zh)
Other versions
CN101232969A (zh
Inventor
蒂莫西·D·弗莱彻
保罗·S·勒格
文森特·D·罗梅罗
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3M Innovative Properties Co
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3M Innovative Properties Co
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Publication date
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Publication of CN101232969A publication Critical patent/CN101232969A/zh
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/013—Application of loose grinding agent as auxiliary tool during truing operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B24B37/245—Pads with fixed abrasives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/007—Cleaning of grinding wheels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
    • B24D7/06—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with inserted abrasive blocks, e.g. segmental
    • B24D7/063—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with inserted abrasive blocks, e.g. segmental with segments embedded in a matrix which is rubbed away during the grinding process

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
  • Pharmaceuticals Containing Other Organic And Inorganic Compounds (AREA)
  • Cosmetics (AREA)
  • Saccharide Compounds (AREA)
CN2006800276462A 2005-07-28 2006-07-19 磨料团聚体抛光方法 Active CN101232969B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/191,711 2005-07-28
US11/191,711 US7494519B2 (en) 2005-07-28 2005-07-28 Abrasive agglomerate polishing method
PCT/US2006/028061 WO2007015909A1 (en) 2005-07-28 2006-07-19 Abrasive agglomerate polishing method

Publications (2)

Publication Number Publication Date
CN101232969A CN101232969A (zh) 2008-07-30
CN101232969B true CN101232969B (zh) 2011-05-11

Family

ID=37401245

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2006800276462A Active CN101232969B (zh) 2005-07-28 2006-07-19 磨料团聚体抛光方法

Country Status (9)

Country Link
US (1) US7494519B2 (enExample)
EP (1) EP1910025B1 (enExample)
JP (1) JP5620639B2 (enExample)
KR (1) KR101299272B1 (enExample)
CN (1) CN101232969B (enExample)
AT (1) ATE496729T1 (enExample)
DE (1) DE602006019876D1 (enExample)
TW (1) TWI402136B (enExample)
WO (1) WO2007015909A1 (enExample)

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US8603350B2 (en) * 2009-07-17 2013-12-10 Ohara Inc. Method of manufacturing substrate for information storage media
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US20130324021A1 (en) * 2012-05-31 2013-12-05 Webster Ryan Diamond impregnated polishing pad with diamond pucks
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JP6838811B2 (ja) 2014-05-02 2021-03-03 スリーエム イノベイティブ プロパティズ カンパニー 断続的構造化研磨物品並びに被加工物の研磨方法
US9149904B1 (en) 2014-06-13 2015-10-06 Seagate Technology Llc Platen for wafer polishing having diamond-ceramic composites
CN106574147A (zh) * 2014-08-01 2017-04-19 3M创新有限公司 抛光液及其使用方法
US10086500B2 (en) * 2014-12-18 2018-10-02 Applied Materials, Inc. Method of manufacturing a UV curable CMP polishing pad
CN105140155B (zh) * 2015-07-15 2018-06-05 桂林电子科技大学 一种用于GaAs MMIC减薄工艺的粘片方法
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JP7435436B2 (ja) * 2020-12-24 2024-02-21 株式会社Sumco キャリアプレートの研磨方法
CN113549424B (zh) * 2021-08-04 2022-05-13 白鸽磨料磨具有限公司 一种抛光用氧化铈团簇粉及其制备方法
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Also Published As

Publication number Publication date
JP5620639B2 (ja) 2014-11-05
DE602006019876D1 (de) 2011-03-10
JP2009502532A (ja) 2009-01-29
US20070026770A1 (en) 2007-02-01
TW200720020A (en) 2007-06-01
TWI402136B (zh) 2013-07-21
ATE496729T1 (de) 2011-02-15
US7494519B2 (en) 2009-02-24
KR101299272B1 (ko) 2013-08-23
CN101232969A (zh) 2008-07-30
WO2007015909A1 (en) 2007-02-08
EP1910025B1 (en) 2011-01-26
KR20080030057A (ko) 2008-04-03
EP1910025A1 (en) 2008-04-16

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