JP2009302530A - 動的に調整可能な閾値電圧を有する3次元集積トランジスタの回路 - Google Patents
動的に調整可能な閾値電圧を有する3次元集積トランジスタの回路 Download PDFInfo
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- 229910004298 SiO 2 Inorganic materials 0.000 claims description 20
- 239000003989 dielectric material Substances 0.000 claims description 15
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- 239000010410 layer Substances 0.000 description 70
- 239000004065 semiconductor Substances 0.000 description 28
- 239000000463 material Substances 0.000 description 20
- 238000000034 method Methods 0.000 description 12
- 239000012212 insulator Substances 0.000 description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- 230000006870 function Effects 0.000 description 6
- 238000009413 insulation Methods 0.000 description 6
- 230000003071 parasitic effect Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 238000005498 polishing Methods 0.000 description 5
- 239000011229 interlayer Substances 0.000 description 4
- 230000008021 deposition Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
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- 230000005611 electricity Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 229920005591 polysilicon Polymers 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- 229910052682 stishovite Inorganic materials 0.000 description 2
- 229910052905 tridymite Inorganic materials 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000006399 behavior Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 230000001808 coupling effect Effects 0.000 description 1
- 230000001186 cumulative effect Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000000593 degrading effect Effects 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000012876 topography Methods 0.000 description 1
- 230000001960 triggered effect Effects 0.000 description 1
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Abstract
【解決手段】積層の所定レベルに位置する第1トランジスタT11と、所定レベルの上方の積層の第2レベルに位置する第2トランジスタT21とを備え、第1トランジスタは第2トランジスタのチャネル区域116に対向するゲート電極108を備え、第1トランジスタと第2トランジスタとは絶縁区域120により分離され、この絶縁区域は第1トランジスタのゲートと第2トランジスタのチャネルとの間の第1領域R1にて第1トランジスタのゲートと第2トランジスタのチャネルとの間の結合を可能にするように規定された組成および厚さを有し、この絶縁区域は、第1トランジスタおよび第2トランジスタのアクセス区域の間の第1領域の周囲に、第1領域とは異なる組成および厚さを有する第2領域R2を備える。
【選択図】図5
Description
第1トランジスタに印加された電位によって、第2トランジスタの閾値電圧を第1閾値電圧VT1にすること。
第1トランジスタに印加された他の電位の手段によって、第2トランジスタの閾値電圧を第1閾値電圧よりも高い閾値電圧VT2にすること。
少なくとも1つの第1段階中に、第1トランジスタのゲートに少なくとも1つの第1電位を印加し、第2トランジスタが第1閾値電圧VT1を有する。
少なくとも1つの第2段階中に、第1トランジスタのゲートに第1電位とは異なる少なくとも1つの第2電位を印加し、第2トランジスタが第1閾値電圧VT1とは異なる第2閾値電圧VT2を有する。
a)ソース領域と、ドレイン領域と、ソース領域およびドレイン領域を連結するチャネルを形成する構造と、チャネル上のゲートとを設けた、少なくとも1つの第1トランジスタを基板上に形成するステップ
b)第1トランジスタの上に絶縁区域を形成するステップであって、この絶縁区域はゲート上に位置する第1領域内では所定の組成および厚さを有し、第1トランジスタの少なくとも1つのアクセス区域上に位置する第2領域に、第1領域とは異なる組成および厚さとを有する
c)第1トランジスタの上方の絶縁区域上に半導体層を形成し、この半導体層から第2トランジスタを形成するステップ
のベクトル
方向に平行な方向で測る)。本説明を通して、「限界寸法」は、厚さを除いて最も小さいパターン寸法を意味するのに用いる。
ΔVthは、第2トランジスタT21の閾値電圧の変動であり、
εscおよびTscは、それぞれトランジスタT21のチャネル116が形成された半導体層の誘電率および厚さであり、
εOXおよびTOXは、それぞれ第2トランジスタT21のゲート誘電体の誘電率および厚みであり、
εILDおよびTILDは、それぞれ第2トランジスタT21の半導体層を第1トランジスタT11のゲート108から分離する絶縁区域120の誘電体の誘電率および厚さである。
ある電位を第1トランジスタのゲートに印加するある段階中、
別の電位を第1トランジスタのゲートに印加する他の段階中、
に供給される可変電位を印加するための手段(図5には図示せず)を用いて得ることができる。
第1段階中に、この所定トランジスタがオフ状態にあるときに、所定のトランジスタの下方に位置するもう一つのトランジスタのゲートに印加する所定の第1電位V1によって高い閾値電圧VTを印加すること、
第2段階中に、この所定トランジスタがオン状態にあるとき、上述の他のトランジスタのゲートに印加される所定の第2電位V2によって低い閾値電圧VTを印加すること。
ゲートG1およびG2に印加する電位Vg2およびVg1を、Vg2=Vg1=Vddとする。
Vton<Vt
のように低下し、これにより、より高い電流Ionを得ることを可能にする。
ゲートG1およびG2に印加する電位Vg2およびVg1を、Vg2=Vg1=0とする。
Claims (19)
- 積層を上に載せる基板と、
前記積層の所定レベルに位置する少なくとも1つの第1トランジスタと、
前記所定レベルの上方の、前記積層の第2レベルに位置する少なくとも1つの第2トランジスタとを備えるマイクロエレクトロニックデバイスであって、
前記第1トランジスタは、前記第2トランジスタのチャネル区域に対向して位置するゲート電極を備え、
前記第1トランジスタと前記第2トランジスタとは絶縁区域によって分離され、
前記絶縁区域は、複数の異なる誘電体から構成され、前記第1トランジスタのゲートと前記第2トランジスタのチャネルとの間の第1領域にて、前記第1トランジスタのゲート電極と前記第2トランジスタのチャネルとの間に第1電気容量C1を形成するように規定された組成および厚さを有し、
前記絶縁区域は、前記第1トランジスタの少なくとも1つのアクセス区域と前記第2トランジスタの少なくとも1つのアクセス区域との間に第2領域を備え、当該第2領域の組成および厚さは、前記第1トランジスタの前記アクセス区域と前記第2トランジスタの前記アクセス区域との間の第2電気容量C2を、C2<C1を満たすように生じさせるように規定されている、マイクロエレクトロニックデバイス。 - 前記絶縁区域は、前記第1領域にて、前記第1トランジスタのゲートと前記第2トランジスタのチャネルとの間の結合を実現するように規定された組成および厚さを有する、請求項1に記載のデバイス。
- 前記絶縁区域は、前記第1トランジスタの前記アクセス区域と前記第2トランジスタの前記アクセス区域との間の前記第2領域にて、前記第1トランジスタの前記アクセス区域と前記第2トランジスタの前記アクセス区域との間の結合を制限または防止するように規定された組成および厚さを有する、請求項2に記載のデバイス。
- 前記第1トランジスタのゲートと前記第2トランジスタのチャネルとの間の結合は、前記第1トランジスタのゲート電位の変化が前記第2トランジスタの閾値電圧の変化をもたらすものである、請求項2または請求項3に記載のマイクロエレクトロニックデバイス。
- Vddを前記デバイスの電源電圧とし、前記第1トランジスタのゲートと前記第2トランジスタのチャネルとの間の結合は、前記第1トランジスタのゲート電位の0〜Vddの変化が、前記第2トランジスタの閾値電圧の少なくとも50mVの変化を得ることを可能にするものである、請求項2から請求項4の何れか1項に記載のマイクロエレクトロニックデバイス。
- 前記ゲート電位は、0〜Vddの間、または、−Vdd〜+Vddの間で変化する、請求項5に記載のマイクロエレクトロニックデバイス。
- 前記第1領域は、第1誘電率k1を有する第1誘電体から形成され、
前記第2領域は、第2誘電率k2がk2<k1となるような第2誘電体から形成される、請求項1から請求項6の何れか1項に記載のマイクロエレクトロニックデバイス。 - 前記第1領域は、第1誘電率k1を有する第1誘電体から形成され、
前記第2領域は、前記第1誘電体と第2誘電率k2がk2<k1となるような第2誘電体との積層を備える、請求項1から請求項6の何れか1項に記載のマイクロエレクトロニックデバイス。 - 前記第1領域は、第1誘電体と第2誘電体との第1積層から形成され、
前記第2領域は、前記第1誘電体と前記第2誘電体との第2積層を備え、
前記第1誘電体および前記第2誘電体のそれぞれの厚さは、前記第1積層と前記第2積層とで異なる、請求項1から請求項6の何れか1項に記載のマイクロエレクトロニックデバイス。 - 前記絶縁区域の前記第1領域は、1〜50ナノメートルの間のSiO2等価膜厚を有する、請求項1から請求項9の何れか1項に記載のマイクロエレクトロニックデバイス。
- 前記デバイスは、前記第2トランジスタの閾値電圧を調節する手段を更に提供され、前記第1トランジスタのゲートに可変電位を印加するための分極手段を備え、当該分極手段は、
第1段階中には、前記第1トランジスタのゲートに少なくとも1つの第1電位を印加し、
第2段階中には、前記第1トランジスタのゲートに、前記第1電位とは異なる少なくとも1つの第2電位を印加するよう規定されている、
請求項1から請求項10の何れか1項に記載のマイクロエレクトロニックデバイス。 - 前記第1電位は、前記第2トランジスタをオン状態にして、前記第2トランジスタを第1閾値電圧にするように規定され、
前記第2電位は、前記第2トランジスタをオフ状態にして、前記第2トランジスタを、前記第1閾値電圧よりも高い第2閾値電圧にするように規定される、
請求項11に記載のマイクロエレクトロニックデバイス。 - 前記第1トランジスタのチャネル区域は、前記第2トランジスタのゲートに完全に対向して位置する、請求項1から請求項12の何れか1項に記載のマイクロエレクトロニックデバイス。
- 前記基板の主面に直交し、前記第1トランジスタ、及び/又は、前記第2トランジスタのゲートを通る軸上に、1つ以上の他のトランジスタを更に備える、請求項1から請求項13の何れか1項に記載のマイクロエレクトロニックデバイス。
- 前記積層内の前記第1トランジスタのレベルに位置する少なくとも1つの第3トランジスタと、
前記第3トランジスタの上方に位置する少なくとも1つの第4トランジスタとを更に備え、
前記第4トランジスタと前記第3トランジスタとは、前記第4トランジスタと前記第3トランジスタとの間の結合を制限または防止するために設けられた誘電体区域によって分離されている、
請求項1から請求項14の何れか1項に記載のマイクロエレクトロニックデバイス。 - 前記積層内の前記第1トランジスタのレベルに位置する少なくとも1つの第3トランジスタと、
少なくとも1つの第4トランジスタと、
前記第3トランジスタと前記第4トランジスタとの間に位置する第5減結合トランジスタとを更に備える、
請求項1から請求項15の何れか1項に記載のマイクロエレクトロニックデバイス。 - 前記第1トランジスタ、及び/又は、前記第2トランジスタのゲートを通り、前記基板の主面に平行な平面内に、1つ以上の他のトランジスタを更に備える、請求項1から請求項16の何れか1項に記載のマイクロエレクトロニックデバイス。
- 前記第1トランジスタのゲートと前記第2トランジスタのゲートと間に少なくとも1つの導体パッドを更に備える、請求項1から請求項17の何れか1項に記載のマイクロエレクトロニックデバイス。
- 前記トランジスタはSRAMメモリセルに属する、請求項1から請求項18の何れか1項に記載のマイクロエレクトロニックデバイス。
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JP2011243698A (ja) * | 2010-05-17 | 2011-12-01 | Renesas Electronics Corp | 半導体装置およびその製造方法 |
JP2013138191A (ja) * | 2011-12-01 | 2013-07-11 | Semiconductor Energy Lab Co Ltd | 半導体装置 |
US10043833B2 (en) | 2011-12-01 | 2018-08-07 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
KR101442353B1 (ko) * | 2012-03-07 | 2014-09-17 | 타이완 세미콘덕터 매뉴팩쳐링 컴퍼니 리미티드 | Sram 회로를 위한 구조물 및 방법 |
US9704868B2 (en) | 2013-12-27 | 2017-07-11 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
WO2015097593A1 (en) * | 2013-12-27 | 2015-07-02 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
JP7038164B2 (ja) | 2013-12-27 | 2022-03-17 | 株式会社半導体エネルギー研究所 | 半導体装置 |
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JP2020145470A (ja) * | 2013-12-27 | 2020-09-10 | 株式会社半導体エネルギー研究所 | 半導体装置 |
WO2015182000A1 (en) * | 2014-05-30 | 2015-12-03 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device, manufacturing method thereof, and electronic device |
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US9728559B2 (en) | 2015-02-06 | 2017-08-08 | Semiconductor Energy Laboratory Co., Ltd. | Device, manufacturing method thereof, and electronic device |
US10074672B2 (en) | 2015-02-06 | 2018-09-11 | Semiconductor Energy Laboratory Co., Ltd. | Device, manufacturing method thereof, and electronic device |
US10707239B2 (en) | 2015-02-06 | 2020-07-07 | Semiconductor Energy Laboratory Co., Ltd. | Device, manufacturing method thereof, and electronic device |
Also Published As
Publication number | Publication date |
---|---|
FR2932005B1 (fr) | 2011-04-01 |
US20090294822A1 (en) | 2009-12-03 |
FR2932005A1 (fr) | 2009-12-04 |
ATE536636T1 (de) | 2011-12-15 |
JP5586170B2 (ja) | 2014-09-10 |
EP2131397B1 (fr) | 2011-12-07 |
EP2131397A1 (fr) | 2009-12-09 |
US8183630B2 (en) | 2012-05-22 |
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