JP2009295741A5 - - Google Patents
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- Publication number
- JP2009295741A5 JP2009295741A5 JP2008147019A JP2008147019A JP2009295741A5 JP 2009295741 A5 JP2009295741 A5 JP 2009295741A5 JP 2008147019 A JP2008147019 A JP 2008147019A JP 2008147019 A JP2008147019 A JP 2008147019A JP 2009295741 A5 JP2009295741 A5 JP 2009295741A5
- Authority
- JP
- Japan
- Prior art keywords
- adhesive sheet
- wafer
- sheet
- laser
- irradiation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 235000012431 wafers Nutrition 0.000 claims description 174
- 238000012546 transfer Methods 0.000 claims description 76
- 239000000853 adhesive Substances 0.000 claims description 59
- 230000001070 adhesive effect Effects 0.000 claims description 59
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 34
- 238000000034 method Methods 0.000 claims description 32
- 238000001179 sorption measurement Methods 0.000 claims description 12
- 230000001678 irradiating effect Effects 0.000 claims description 11
- 239000000758 substrate Substances 0.000 description 28
- 230000003287 optical effect Effects 0.000 description 10
- 239000007789 gas Substances 0.000 description 6
- 230000007246 mechanism Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000001771 impaired effect Effects 0.000 description 3
- 238000005304 joining Methods 0.000 description 3
- 238000000608 laser ablation Methods 0.000 description 3
- 238000007493 shaping process Methods 0.000 description 3
- 238000010008 shearing Methods 0.000 description 3
- 238000005507 spraying Methods 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000012937 correction Methods 0.000 description 2
- 239000005416 organic matter Substances 0.000 description 2
- 230000010355 oscillation Effects 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008147019A JP2009295741A (ja) | 2008-06-04 | 2008-06-04 | 部品移載方法及び部品移載装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008147019A JP2009295741A (ja) | 2008-06-04 | 2008-06-04 | 部品移載方法及び部品移載装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2009295741A JP2009295741A (ja) | 2009-12-17 |
| JP2009295741A5 true JP2009295741A5 (https=) | 2011-04-07 |
Family
ID=41543679
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008147019A Pending JP2009295741A (ja) | 2008-06-04 | 2008-06-04 | 部品移載方法及び部品移載装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2009295741A (https=) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6932676B2 (ja) * | 2018-09-27 | 2021-09-08 | 東レエンジニアリング株式会社 | 転写方法およびこれを用いた画像表示装置の製造方法ならびに転写装置 |
| JP7503712B2 (ja) * | 2021-05-17 | 2024-06-20 | ヤマハ発動機株式会社 | 部品移載装置 |
| JP2024033292A (ja) * | 2022-08-30 | 2024-03-13 | 東レエンジニアリング株式会社 | ピックアップ装置 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0442557A (ja) * | 1990-06-08 | 1992-02-13 | Sumitomo Electric Ind Ltd | チップ状部品のピックアップ装置 |
| JP3731227B2 (ja) * | 1995-10-20 | 2006-01-05 | 富士通株式会社 | 半導体装置の製造方法 |
| JP2002164414A (ja) * | 2000-11-27 | 2002-06-07 | Shinkawa Ltd | 半導体ペレット処理方法及び装置 |
| JP2002353253A (ja) * | 2001-05-24 | 2002-12-06 | Nec Kansai Ltd | 半導体チップ供給装置及び供給方法 |
| JP4766258B2 (ja) * | 2006-08-31 | 2011-09-07 | 澁谷工業株式会社 | 板状物品のピックアップ装置 |
-
2008
- 2008-06-04 JP JP2008147019A patent/JP2009295741A/ja active Pending
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