CN111326454B - 元件阵列的制造方法和特定元件的除去方法 - Google Patents

元件阵列的制造方法和特定元件的除去方法 Download PDF

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CN111326454B
CN111326454B CN201911280544.7A CN201911280544A CN111326454B CN 111326454 B CN111326454 B CN 111326454B CN 201911280544 A CN201911280544 A CN 201911280544A CN 111326454 B CN111326454 B CN 111326454B
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adhesive sheet
elements
specific
specific element
manufacturing
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CN111326454A (zh
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宫腰敏畅
须永诚寿郎
进藤修
加藤康生
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TDK Corp
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Abstract

本发明提供一种即使在以规定的排列并排的元件小的情况下，也能够容易地仅除去特定元件的特定元件的除去方法和能够制造除去了特定元件的元件阵列的元件阵列的制造方法。准备在粘接片(22)的粘接层(22b)的表面以规定的排列并排有元件(23)的粘接片(22)。对以规定的排列并排的元件(23)内的特定的元件(23a)照射激光(L)，将特定的元件(23a)从粘接片(22)的粘接层(22b)除去，并在粘接片(22)的表面保留其它的元件(23)。

Description

元件阵列的制造方法和特定元件的除去方法
技术领域
本发明涉及例如LED元件等显示元件等排列而成的元件阵列的制造方法和特定元件的除去方法。
背景技术
作为显示装置，提案有排列多个LED元件作为发光元件而构成显示元件阵列的显示装置。在使用现有的LED元件的显示装置中，在将发出蓝色、绿色、红色的任一种的LED元件分别形成于半导体基板上后，在显示面上排列成矩阵状，进行驱动用的配线形成等。
这样，为了将分别形成于半导体基板上的元件排列在显示装置上的规定的位置，进行发光二极管元件的转印，作为该转印方法，广泛利用了使用真空吸附在期望的位置配置元件的方法。另外，在配线形成中使用引线接合技术等。
但是，由于LED元件使用原材料高价的砷化镓(GaAs)类、镓·铟·磷(GaInP)类、氮化镓(GaN)类等半导体材料制造，因此，为了降低每一个元件的制造成本，期望缩小元件尺寸。
但是，真空吸附微小的发光元件，进一步在与显示画面对应的位置排列元件，形成所要的配线是不容易的，也难以提高元件排列的位置精度。
因此，提案有选择地剥离在基板上以等间隔形成的微小的发光二极管元件，对其它基板转印元件的技术(例如参照专利文献1)。
但是，在下述的专利文献1所示的现有的显示元件的转印方法中，即使能够将形成于元件形成用基板的显示元件的阵列例如转印到转印前的安装用基板上，也可能会有不良的元件被转印。在安装用基板的表面安装元件的阵列后，仅除去特定的元件的作业是不容易的，而且仅特定的元件的更换作业更困难。
而且，在下述的专利文献1所示的方法中，因为是从基板的背面照射激光而将元件从基板剥离进行转印的方法，所以当元件的尺寸变小时，仅转印特定的元件是困难的。
现有技术文献
专利文献
专利文献1：日本特开2006－41500号公报
发明内容
发明要解决的技术问题
本发明是鉴于这种实际情况而开发的，其目的在于，提供一种即使在以规定的排列并排的元件小的情况下，也能够容易地仅除去特定元件的特定元件的除去方法和能够制造除去特定的元件的元件阵列的元件阵列的制造方法。
用于解决技术问题的技术方案
为了实现上述目的，本发明的元件阵列的制造方法包括：
准备在粘接片的粘接层的表面以规定的排列并排有元件的所述粘接片的工序；
对以规定的排列并排的元件内的特定的元件照射激光，将所述特定的元件从所述粘接片除去的工序；和
将附着于所述粘接片的表面的规定排列的元件直接或间接地转印到安装用基板上的工序。
本发明人等新发现：例如通过将形成于元件形成用基板上的规定排列的元件转印到粘接片的粘接层的表面等的方法，通过使用在粘接片的粘接层的表面，以规定的排列并排有元件的所述粘接片，在维持规定的排列的状态下，容易除去不良的元件。即，本发明人等发现：通过仅对判断为不良的特定的元件直接照射激光，将照射的元件以从粘接层弹起的方式除去。此时，成品的元件的排列被原样维持。另外，与除去的元件对应的位置处的粘接层的损伤也少，也容易在该部分再次重新配置成品的元件。此外，也可以不重新配置成品的元件而设为例如元件阵列。
在本发明的制造方法中，通过将附着于粘接片的表面的规定排列的成品元件直接或间接地转印到安装用基板上，能够不使用真空吸附拾取装置等，而在维持规定的排列的状态下制造元件阵列。此外，直接转印是指将粘接片原样使用，间接转印是指从粘接片转印到其它转印用的粘接片或其它部件之后，转印到安装用基板上。此外，通过从粘接片进行转印，能够容易地将元件的阵列转印到安装用基板上。
在本发明的元件阵列的制造方法中，即使在以规定的排列并排的元件小的情况下，也能够容易地仅除去不良的元件，能够容易地制造除去了不良的特定元件的元件阵列。
也可以是，本发明的制造方法还包括在将所述特定的不良的元件从所述粘接片除去的空的位置使另外的成品元件(优良元件)附着于所述粘接片的所述粘接层的表面的工序。
另外，也可以是，本发明的制造方法还包括：
在元件形成用基板上以规定的排列制作所述元件的工序；和
将在所述元件形成用基板上制作的规定的排列的所述元件转印到所述粘接片的粘接层的表面的工序。
另外，也可以是，本发明的制造方法还包括分别检查在所述元件形成用基板上制作的规定的排列的所述元件的工序。
或者，也可以是，本发明的制造方法也还包括分别检查在所述粘接片的粘接层的表面上以规定的排列并排的元件的工序。
优选的是，对判定为不良的所述元件在与该元件的平面形状一致的方形光点形状的照射范围照射所述激光。通过这样激光，不对接近的其它元件造成影响，容易仅将特定的元件从粘接片除去。
优选的是，对判定为不良的所述元件在包含该元件的平面形状的整体的范围照射所述激光。通过这样照射激光，容易将特定的元件从粘接片除去。
通过对判定为不良的所述元件以优选3次发射以内的发射数、更优选以2次发射以内的发射数、进一步优选以1次发射照射所述激光，以将特定的不良所述元件从所述粘接片弹飞的方式，选择所述激光的输出和波长。发射数越少，对粘接片的损伤越少，并且对与除去的元件接近的成品的元件施加损伤的风险越少。
优选的是，所述激光的波长为532nm以下，进一步优选为266nm以下。通过照射这种激光，不对接近的其它的元件造成影响，容易仅将特定的元件从粘接片除去。
本发明的特定元件的除去方法包括：
准备在粘接片的粘接层的表面以规定的排列并排有元件的所述粘接片的工序；和
对以规定的排列并排的元件内的特定的元件照射激光，将所述特定的元件从所述粘接片除去，在所述粘接片的表面保留其它的元件的工序。
在本发明的特定元件的除去方法中，即使在以规定的排列并排的元件小的情况下，也能够容易地仅除去不良的元件等特定的元件。
优选的是，对所述特定的元件在与该元件的平面形状一致的方形光点形状的照射范围照射所述激光。通过这样照射激光，不对接近的其它的元件造成影响，容易仅将特定的元件从粘接片除去。
优选的是，对所述特定的元件在包含该元件的平面形状的整体的范围照射所述激光。通过这样照射激光，容易将特定的元件从粘接片除去。
通过对所述特定的元件以优选3次发射以内的发射数、更优选以2次发射以内的发射数、进一步优选以1次发射照射所述激光，以将所述特定的元件从所述粘接片弹飞的方式，选择所述激光的输出和波长。发射数越少，对粘接片的损伤越少，并且对与除去的元件接近的其它的元件(例如成品元件)施加损伤的风险越少。
优选的是，所述激光的波长为532nm以下，进一步优选为266nm以下。通过照射这种激光，不对接近的其它的元件造成影响，容易仅将特定的元件从粘接片除去。
附图说明
图1是表示在本发明的一实施方式的元件阵列的制造方法中使用的装置的重要部位的概略立体图。
图2是表示本发明的一实施方式的元件阵列的制造方法的一工序的重要部位剖视图。
图3是表示图2的延续的工序的重要部位剖视图。
图4是表示沿着图3所示的IV－IV线的元件阵列的俯视图。
具体实施方式
以下，基于附图所示的实施方式对本发明进行说明。
如图1所示，本发明的一实施方式的元件阵列的制造装置10具有能够除去不良的特定的元件的特定元件的除去装置20和将基板安装于除去装置20的基板载台24的基板安装装置50。
特定元件的除去装置20具有保持基板22的作为基板保持单元的基板载台24和朝向基板22的表面照射激光L的激光照射器具30。
基板载台24具有Z轴移动工作台26、Y轴移动基座28、轨道29。Z轴移动工作台26具有装拆自如地保持基板22的设置台26a，相对于Y轴移动基座28沿Z轴方向移动自如地安装。在设置台26a也可以具备用于装拆自如地保持基板的吸附机构。
Y轴移动基座28沿着轨道29在处理位置Y1和安装位置Y2之间沿Y轴方向可移动。基板载台24构成通过Z轴工作台26沿Z轴方向移动，Y轴基座28沿Y轴方向移动，使基板22沿着相对于从激光照射器具30的射出部32沿X轴方向射出的激光L大致垂直的平面移动的移动机构。此外，在本实施方式中，X轴及Y轴与水平面平行，Z轴与垂直线平行，X轴和Y轴与Z轴相互垂直。
如图3所示，基板22由基板主体22a和形成于基板主体22a的表面的粘接层22b构成。基板主体22a可以为具有柔性的粘接片(粘接性片)本身，或也可以为表面贴附有形成有粘接层的粘接片的具有刚性的基板。粘接层22b例如由天然橡胶、合成橡胶、丙烯酸类树脂、硅氧橡胶等粘接性树脂构成，其厚度优选为1.0～10.0μm。
在本实施方式中，如图4所示，元件23沿Y轴方向以规定间隔δy，沿Z轴方向以规定间隔δz呈矩阵状装拆自如地附着于粘接层22b的表面。元件23没有特别限定，但例如为显示元件。此外，显示元件不限于用于显示画面的元件，也可以为用于进行照明的元件，例如可示例发光元件(LED元件)、荧光元件等。另外，元件23不限于显示元件，也可以为陶瓷电容器、片式电感器等电子元件或半导体元件。
在本实施方式中，元件23例如为微型发光元件(微型LED元件)，且其平面形状例如具有5μm×5μm～200μm×300μm的尺寸。另外，规定间隔δy和规定间隔δz可以相同也可以不同，例如在5～100μm的范围内。
从图1所示的激光照射器具30的射出部32射出的激光L沿与图3所示的粘接层22b的表面大致垂直方向照射，如图4所示，仅对以规定的排列配置的元件23内的特定的元件23a进行照射。因此，图1所示的激光照射器具30也可以具有在包含图4所示的特定的元件23a的平面形状的整体的范围、在与该元件23a的平面形状一致的方形光点形状的照射范围La用于仅对特定的元件23a的表面直接照射激光L的照射掩模。
另外，图1所示的激光照射器具30也可以具有拍摄装置34。拍摄装置34也可以与激光照射器具30分开设置，能够对图4所示的元件23的阵列进行拍摄。拍摄装置34对图4所示的元件23进行拍摄，可以进行各元件23的外观检查，也可以移动控制图1所示的基板载台24，以使激光L仅对在其外观检查中判断为不良的特定的元件23a进行照射。例如，移动控制图1所示的基板载台24，使基板22沿平面(沿着Z轴或Y轴)方向移动，以使激光L仅对特定的元件23a进行照射。
如图1所示，在处理位置Y1，在安装于设置台26a的基板22的表面的下方配置有回收机构40。如后述，回收机构40具有用于接收从基板22的表面落下的图3所示的特定的元件23a的上端开口部。上端开口部具有拥有比基板22的外径大的Y轴方向的宽度和比基板22的厚度大的X轴方向的宽度的上端开口部，设定为能够接收从基板22的表面任一位置落下的图3所示的特定的元件23a的大小。
在回收机构40的内部也可以具备吸引周围的气体的吸引机构。在回收机构40的Z轴方向的上部即安装于设置台26a的基板22的上部设置有气体喷出机构42。从气体喷出机构42吹出空气或惰性气体等气体，吹出的气体朝向Z轴的下方，通过附着于图3所示的基板22的表面的特定的元件23a的表面，流入图1所示的回收机构40的上端开口部。
图1所示的基板安装装置50配置于在位于处理位置Y1的除去装置20的Y轴方向附近存在的安装位置Y2，具有基板吸附器具52。基板吸附器具52是用于将得到图2所示的工序而成为图3所示的状态并搬运到预先置台上的基板22转移到移动至安装位置Y2的设置台26a的表面的装置。
基板吸附器具52固定于转动杆54的前端，可转动地安装于支承杆56的前端。支承杆56固定于Y轴移动块58的上端，块58沿着轨道59在安装位置Y2和交接位置Y3之间沿着Y轴可往复移动。此外，为了使基板吸附器具52沿Z轴方向可移动，转动杆54可以伸缩自如，或者基板安装装置50的一部分或全部也可以沿Z轴方向移动自如。另外，支承杆56也可以沿X轴方向移动自如。
接着，对本发明的一实施方式的元件阵列的制造方法、特别是发光元件(LED元件)阵列的制造方法进行说明。
首先，在图2所示的元件形成用基板25的表面制作将例如LED元件等元件23排列成矩阵状的元件阵列。作为元件阵列的制造中使用的基板25，例如根据元件23的种类(蓝色发光元件、红色发光元件、绿色发光元件等)而不同，例如使用蓝宝石基板、玻璃基板、GaAs基板、SiC基板等。
如图2所示，在基板25的表面形成元件23的阵列后，将形成有元件23的基板25的表面按压到形成于基板22的表面的粘接层22b，通过例如激光剥离法等方法仅将元件23的阵列从基板25剥离并转印到粘接层22b的表面。此外，作为用于转印的方法，不限定于激光剥离法，也可以为使用粘接力的差的转印、伴随加热剥离的转印等方法。
转印了元件23的阵列后的基板22被搬送到配置于图1所示的交接位置Y3的预先置台60上。搬送到预先置台60的基板22通过基板安装装置50安装于移动到安装位置Y2的工作台26的设置台26a上。在安装位置Y2安装的基板22被移动到处理位置Y1。
在处理位置Y1，例如使用拍摄装置34，如图4所示，进行排列成阵列状的每个元件23的外观检查，并找出不良(不要)的特定的元件23a。此外，检查也可以在设置于处理位置Y1前进行。
接着，如图3及图4所示，移动控制图1所示的基板载台24，以使激光L在规定的照射范围La仅对特定的元件23a进行照射。此时，也可以使用拍摄装置34，一边检查特定的元件23a的位置一边控制基板载台24的移动。
接着，将激光L仅对特定的元件23a进行照射。对特定的元件23a在与该元件23a的平面形状一致的方形光点形状的照射范围La照射激光L。通过这样照射激光L，不对接近的其它的元件23造成影响，容易仅将特定的元件23a从粘接层22b除去。
另外，对特定的元件23a在包含该元件23a的平面形状的整体的范围照射激光L。通过这样照射激光L，容易将特定的元件23a从粘接层22b除去。
通过对特定的元件23a以优选3次发射以内的发射数、更优选2次发射以内的发射数、进一步优选1次发射照射激光L，以将特定的元件23a从粘接层22b弹飞的方式，选择激光L的输出和波长。发射数越少，对粘接层22b的损伤越少，并且对与除去的元件23a接近的成品的元件23增加损伤的风险越少。
优选的是，激光L的波长为532nm以下，进一步优选为266nm以下。通过照射这种激光L，不对接近的其它的元件23造成影响，容易仅将特定的元件23a从粘接层22b除去。作为图1所示的激光照射器具30，具体而言，例如可使用YAG激光、二氧化碳激光、准分子激光、UV激光等。如果考虑激光的波长或除去的能量，则优选YAG激光。
在本实施方式的方法中，如上述，通过将形成于图2所示的元件形成用基板25上的规定排列的元件23转印于基板22的粘接层22b的表面等方法，使元件23以规定的排列并排附着于粘接层22b的表面，由此，在维持规定的排列的状态下，容易除去判断为不良的特定的元件23a。即，如图3所示，通过仅对特定的元件23a直接照射激光L，照射的元件23a被以从粘接层22b弹起的方式除去。此时，成品的元件23的排列仍被维持。
此外，作为将照射的元件23a以从粘接层22b弹起的方式除去的原因，考虑如下原因。
认为通过激光照射对元件23a施加的能量到达元件23a和粘接层的界面，且其能量作为物理的应力以剥离粘接层和元件23a的粘接的形式施加。或者，认为通过激光照射对元件23a施加的能量作为使元件直接受到外力起作用，并通过该外力剥离元件23a。
另外，与除去的元件23a对应的位置处的粘接层22b的损伤也少，也容易在该部分再次重新配置成品的元件23。作为用于重新配置成品的元件的方法，考虑转印法、吸附搬送法、盖印方法等通常的方法。
此外，也可以在除去特定的元件23a的位置不重新配置成品的元件23，而例如作为具有元件阵列的显示装置(包含照明装置)。例如在元件23的尺寸小的情况下，即使缺少2以上的排列的元件23内的特定的一个元件23a，具有元件阵列的显示装置(包含照明装置)的整体有时也没有问题。
另外，在本实施方式的制造方法中，通过将附着于基板22的表面的规定排列的成品的元件23直接或间接地转印到图示省略的安装用基板上，能够不使用真空吸附拾取装置等，而在维持了规定的排列的状态下，制造微型LED元件阵列等元件阵列。此外，直接转印是指直接使用粘接片，间接转印是指从粘接片转印到其它转印用的粘接片或其它部件之后，将元件23的阵列转印到安装用基板上。
在本实施方式的元件阵列的制造方法中，即使在以规定的排列并排的元件23小到5μm×5μm以下左右的情况下，也容易仅除去特定的元件23，能够容易制作除去了不良的元件23a的元件阵列。本实施方式的制造方法还可以具有在将特定的元件23a从粘接层22b除去的空的位置将其它成品的元件23附着于粘接层22b的表面的工序。
此外，本发明不限定于上述的实施方式，能够在本发明的范围内进行各种改变。
例如，在上述的实施方式中，以使基板22的表面成为与包含Y轴及Z轴的平面平行的面的方式保持基板，将激光L的射出方向设为与Y轴平行的水平方向，但本发明不限定于此。例如，基板22的表面可以保持成与包含X轴及Y轴的平面平行的面，也可以将激光L的射出方向设为与Z轴平行的方向。另外，只要基板22的表面相对于激光L为大致垂直即可，基板2的表面不限定于包含Y轴及Z轴的平面、包含X轴及Y轴的平面，也可以保持为相对于水平面与所有的角度的平面平行。
另外，元件23的检查可以在拍摄装置34以外进行，例如也可以在图2所示的基板25的表面制作元件23后，通过未图示的拍摄装置进行每个元件23的外观检查，特定不良的元件23，并存储其排列的位置。然后，在图1所示的处理位置Y1，也可以在存储的排列的位置仅对特定的元件23a进行激光的照射，仅除去特定的元件23a。此外，每个元件23的检查也可以不仅进行外观检查而进行电气检查等检查。
另外，在上述的实施方式中，移动控制图1所示的基板载台24以使激光L仅对特定的元件23a进行照射，但例如也可以使用电流镜和Fθ透镜等，控制激光L照射的方向，以使激光L例如仅对特定的元件23a进行照射。使用电流镜和Fθ透镜等的机构也可以与激光扫描机构机构相同。但是，移动控制基板载台24能够使作为整体的装置结构简单。
符号说明
10…元件阵列制造装置
20…特定元件的除去装置
22…基板(粘接片)
22a…基板主体
22b…粘接层
23…元件
23a…特定的元件
24…基板载台
25…元件形成用基板
26…Z轴移动工作
26a…设置台
28…Y轴移动基座
29…轨道
30…激光照射器具
32…激光射出部
34…拍摄装置
40…回收机构
42…气体喷出机构
50…基板安装装置
52…基板吸附器具
54…转动杆
56…支承杆
58…Y轴移动块
59…轨道
60…预先置台
L…激光
La…照射范围
Y1…处理位置
Y2…安装位置
Y3…交接位置

Claims (17)

1.一种元件阵列的制造方法，其特征在于，包括：
准备在粘接片的粘接层的表面以规定的排列并排有元件的所述粘接片的工序；
对以规定的排列并排的元件内的特定的元件照射激光，将所述特定的元件从所述粘接片除去的工序；
在将所述特定的元件从所述粘接片除去的空的位置使与所述特定的元件不同的成品元件附着于所述粘接片的所述粘接层的表面的工序；和
将附着于所述粘接片的表面的规定排列的元件直接或间接地转印到安装用基板上的工序。
2.根据权利要求1所述的元件阵列的制造方法，其特征在于，还具有：
在元件形成用基板上以规定的排列制作所述元件的工序；和
将在所述元件形成用基板上制作的规定的排列的所述元件转印到所述粘接片的粘接层的表面的工序。
3.根据权利要求2所述的元件阵列的制造方法，其特征在于，
还具有分别检查在所述元件形成用基板上制作的规定的排列的所述元件的工序。
4.根据权利要求1所述的元件阵列的制造方法，其特征在于，
还具有分别检查在所述粘接片的粘接层的表面上以规定的排列并排的元件的工序。
5.根据权利要求1所述的元件阵列的制造方法，其特征在于，
所述元件为显示元件。
6.根据权利要求3或4所述的元件阵列的制造方法，其特征在于，
对通过所述检查判定为不良的所述元件在与该元件的平面形状一致的方形光点形状的照射范围照射所述激光。
7.根据权利要求3或4所述的元件阵列的制造方法，其特征在于，
对通过所述检查判定为不良的所述元件在包含该元件的平面形状的整体的范围照射所述激光。
8.根据权利要求3或4所述的元件阵列的制造方法，其特征在于，
对通过所述检查判定为不良的所述元件以3次发射以内的发射数照射所述激光，由此以将所述特定的不良元件从所述粘接片弹飞的方式，选择所述激光的输出和波长。
9.根据权利要求8所述的元件阵列的制造方法，其特征在于，
所述激光的波长为532nm以下。
10.一种特定元件的除去方法，其特征在于，包括：
准备在粘接片的粘接层的表面以规定的排列并排有元件的所述粘接片的工序；和
以所述粘接层的表面成为与垂直方向平行的面的方式配置所述粘接片，对以规定的排列并排的元件内的特定的元件的表面照射激光，将所述特定的元件从所述粘接片由于重力落下而除去，在所述粘接片的表面保留其它的元件的工序。
11.根据权利要求10所述的特定元件的除去方法，其特征在于，
在所述粘接片的下方配置有回收沿垂直方向落下的所述特定的元件的回收机构。
12.根据权利要求11所述的特定元件的除去方法，其特征在于，
所述回收机构具有从上端开口部吸引周围的气体，并且产生向垂直方向的气体的流动的吸引机构。
13.根据权利要求10所述的特定元件的除去方法，其特征在于，
对所述特定的元件在与该元件的平面形状一致的方形光点形状的照射范围照射所述激光。
14.根据权利要求10所述的特定元件的除去方法，其特征在于，
对所述特定的元件在包含该元件的平面形状的整体的范围照射所述激光。
15.根据权利要求10所述的特定元件的除去方法，其特征在于，
通过对所述特定的元件以3次发射以内的发射数照射所述激光，以将所述特定的元件从所述粘接片弹飞的方式，选择所述激光的输出和波长。
16.根据权利要求15所述的特定元件的除去方法，其特征在于，
所述激光的波长为532nm以下。
17.根据权利要求10所述的特定元件的除去方法，其特征在于，
所述元件具有俯视时为5μm×5μm～200μm×300μm的尺寸。
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