JP2009295741A - 部品移載方法及び部品移載装置 - Google Patents

部品移載方法及び部品移載装置 Download PDF

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Publication number
JP2009295741A
JP2009295741A JP2008147019A JP2008147019A JP2009295741A JP 2009295741 A JP2009295741 A JP 2009295741A JP 2008147019 A JP2008147019 A JP 2008147019A JP 2008147019 A JP2008147019 A JP 2008147019A JP 2009295741 A JP2009295741 A JP 2009295741A
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JP
Japan
Prior art keywords
wafer
adhesive sheet
sheet
laser
wafer piece
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Pending
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JP2008147019A
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English (en)
Japanese (ja)
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JP2009295741A5 (https=
Inventor
Ritsuko Nagao
里築子 長尾
Hiroaki Fujita
宏昭 藤田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yamaha Motor Co Ltd
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Yamaha Motor Co Ltd
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Publication date
Application filed by Yamaha Motor Co Ltd filed Critical Yamaha Motor Co Ltd
Priority to JP2008147019A priority Critical patent/JP2009295741A/ja
Publication of JP2009295741A publication Critical patent/JP2009295741A/ja
Publication of JP2009295741A5 publication Critical patent/JP2009295741A5/ja
Pending legal-status Critical Current

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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2008147019A 2008-06-04 2008-06-04 部品移載方法及び部品移載装置 Pending JP2009295741A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008147019A JP2009295741A (ja) 2008-06-04 2008-06-04 部品移載方法及び部品移載装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008147019A JP2009295741A (ja) 2008-06-04 2008-06-04 部品移載方法及び部品移載装置

Publications (2)

Publication Number Publication Date
JP2009295741A true JP2009295741A (ja) 2009-12-17
JP2009295741A5 JP2009295741A5 (https=) 2011-04-07

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ID=41543679

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JP2008147019A Pending JP2009295741A (ja) 2008-06-04 2008-06-04 部品移載方法及び部品移載装置

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JP (1) JP2009295741A (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020053558A (ja) * 2018-09-27 2020-04-02 東レエンジニアリング株式会社 転写方法およびこれを用いた画像表示装置の製造方法ならびに転写装置
JPWO2022244033A1 (https=) * 2021-05-17 2022-11-24
JP2024033292A (ja) * 2022-08-30 2024-03-13 東レエンジニアリング株式会社 ピックアップ装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0442557A (ja) * 1990-06-08 1992-02-13 Sumitomo Electric Ind Ltd チップ状部品のピックアップ装置
JPH09115986A (ja) * 1995-10-20 1997-05-02 Fujitsu Ltd 半導体装置の製造方法
JP2002164414A (ja) * 2000-11-27 2002-06-07 Shinkawa Ltd 半導体ペレット処理方法及び装置
JP2002353253A (ja) * 2001-05-24 2002-12-06 Nec Kansai Ltd 半導体チップ供給装置及び供給方法
JP2008060393A (ja) * 2006-08-31 2008-03-13 Shibuya Kogyo Co Ltd 板状物品のピックアップ装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0442557A (ja) * 1990-06-08 1992-02-13 Sumitomo Electric Ind Ltd チップ状部品のピックアップ装置
JPH09115986A (ja) * 1995-10-20 1997-05-02 Fujitsu Ltd 半導体装置の製造方法
JP2002164414A (ja) * 2000-11-27 2002-06-07 Shinkawa Ltd 半導体ペレット処理方法及び装置
JP2002353253A (ja) * 2001-05-24 2002-12-06 Nec Kansai Ltd 半導体チップ供給装置及び供給方法
JP2008060393A (ja) * 2006-08-31 2008-03-13 Shibuya Kogyo Co Ltd 板状物品のピックアップ装置

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020053558A (ja) * 2018-09-27 2020-04-02 東レエンジニアリング株式会社 転写方法およびこれを用いた画像表示装置の製造方法ならびに転写装置
JPWO2022244033A1 (https=) * 2021-05-17 2022-11-24
WO2022244033A1 (ja) * 2021-05-17 2022-11-24 ヤマハ発動機株式会社 部品移載装置
KR20230158097A (ko) * 2021-05-17 2023-11-17 야마하하쓰도키 가부시키가이샤 부품 이송 장치
JP7503712B2 (ja) 2021-05-17 2024-06-20 ヤマハ発動機株式会社 部品移載装置
KR102828117B1 (ko) 2021-05-17 2025-07-03 야마하하쓰도키 가부시키가이샤 부품 이송 장치
JP2024033292A (ja) * 2022-08-30 2024-03-13 東レエンジニアリング株式会社 ピックアップ装置

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