JP2009275227A - 銀ナノ粒子含有印刷可能組成物、該組成物を用いた導電性被膜の製造方法、および該方法により製造された被膜 - Google Patents

銀ナノ粒子含有印刷可能組成物、該組成物を用いた導電性被膜の製造方法、および該方法により製造された被膜 Download PDF

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Publication number
JP2009275227A
JP2009275227A JP2009119559A JP2009119559A JP2009275227A JP 2009275227 A JP2009275227 A JP 2009275227A JP 2009119559 A JP2009119559 A JP 2009119559A JP 2009119559 A JP2009119559 A JP 2009119559A JP 2009275227 A JP2009275227 A JP 2009275227A
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JP
Japan
Prior art keywords
weight
parts
printable composition
composition
dispersant
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2009119559A
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English (en)
Japanese (ja)
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JP2009275227A5 (enExample
Inventor
Stefan Bahnmueller
シュテファン・バーンミューラー
Stefanie Eiden
シュテファニー・アイデン
Stephan Michael Meier
シュテファン・ミヒャエル・マイヤー
Dirk Storch
ディルク・シュトルヒ
Bernard Dunkel
ベルナルト・ドゥンケル
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Covestro Deutschland AG
Original Assignee
Bayer MaterialScience AG
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Filing date
Publication date
Application filed by Bayer MaterialScience AG filed Critical Bayer MaterialScience AG
Publication of JP2009275227A publication Critical patent/JP2009275227A/ja
Publication of JP2009275227A5 publication Critical patent/JP2009275227A5/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/52—Electrically conductive inks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0263—Details about a collection of particles
    • H05K2201/0266—Size distribution
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1131—Sintering, i.e. fusing of metal particles to achieve or improve electrical conductivity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24893—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including particulate material
    • Y10T428/24909—Free metal or mineral containing

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Nanotechnology (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Physics & Mathematics (AREA)
  • Conductive Materials (AREA)
  • Paints Or Removers (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Powder Metallurgy (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2009119559A 2008-05-16 2009-05-18 銀ナノ粒子含有印刷可能組成物、該組成物を用いた導電性被膜の製造方法、および該方法により製造された被膜 Pending JP2009275227A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102008023882A DE102008023882A1 (de) 2008-05-16 2008-05-16 Druckbare Zusammensetzung auf Basis von Silberpartikeln zur Erzeugung elektrisch leitfähiger Beschichtungen

Publications (2)

Publication Number Publication Date
JP2009275227A true JP2009275227A (ja) 2009-11-26
JP2009275227A5 JP2009275227A5 (enExample) 2012-06-28

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009119559A Pending JP2009275227A (ja) 2008-05-16 2009-05-18 銀ナノ粒子含有印刷可能組成物、該組成物を用いた導電性被膜の製造方法、および該方法により製造された被膜

Country Status (13)

Country Link
US (2) US8101097B2 (enExample)
EP (1) EP2119747B1 (enExample)
JP (1) JP2009275227A (enExample)
KR (1) KR20090119732A (enExample)
CN (1) CN101580659B (enExample)
BR (1) BRPI0901446A2 (enExample)
CA (1) CA2665922A1 (enExample)
DE (1) DE102008023882A1 (enExample)
IL (1) IL198646A (enExample)
RU (1) RU2532949C2 (enExample)
SG (1) SG157311A1 (enExample)
TW (1) TWI518146B (enExample)
ZA (1) ZA200903196B (enExample)

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US9120931B2 (en) 2010-10-27 2015-09-01 Mimaki Enginerring Co., Ltd. Water-based ink
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US9378859B2 (en) 2010-08-20 2016-06-28 Rhodia Operations Polymer compositions, polymer films, polymer gels, polymer foams, and electronic devices containing such films, gels and foams
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WO2017138326A1 (ja) * 2016-02-12 2017-08-17 パナソニックＩｐマネジメント株式会社 樹脂組成物及びそれを備えた半導体デバイス

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EP2119747A1 (de) 2009-11-18
SG157311A1 (en) 2009-12-29
IL198646A0 (en) 2010-02-17
RU2009118342A (ru) 2010-11-20
CN101580659B (zh) 2014-04-02
KR20090119732A (ko) 2009-11-19
BRPI0901446A2 (pt) 2010-01-26
TWI518146B (zh) 2016-01-21
US20120138347A1 (en) 2012-06-07
CA2665922A1 (en) 2009-11-16
US20100040846A1 (en) 2010-02-18
RU2532949C2 (ru) 2014-11-20
EP2119747B1 (de) 2012-10-31
ZA200903196B (en) 2011-06-29
CN101580659A (zh) 2009-11-18

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