CA2665922A1 - Printable compositions containing silver nanoparticles, processes for producing electrically conductive coatings using the same, and coatings prepared thereby - Google Patents

Printable compositions containing silver nanoparticles, processes for producing electrically conductive coatings using the same, and coatings prepared thereby Download PDF

Info

Publication number
CA2665922A1
CA2665922A1 CA002665922A CA2665922A CA2665922A1 CA 2665922 A1 CA2665922 A1 CA 2665922A1 CA 002665922 A CA002665922 A CA 002665922A CA 2665922 A CA2665922 A CA 2665922A CA 2665922 A1 CA2665922 A1 CA 2665922A1
Authority
CA
Canada
Prior art keywords
weight
parts
composition according
printable composition
dispersing agent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
CA002665922A
Other languages
English (en)
French (fr)
Inventor
Stefan Bahnmueller
Stefanie Eiden
Stephan Michael Meier
Dirk Storch
Bernard Dunkel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Clariant International Ltd
Original Assignee
Bayer MaterialScience AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bayer MaterialScience AG filed Critical Bayer MaterialScience AG
Publication of CA2665922A1 publication Critical patent/CA2665922A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/52—Electrically conductive inks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0263—Details about a collection of particles
    • H05K2201/0266—Size distribution
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1131—Sintering, i.e. fusing of metal particles to achieve or improve electrical conductivity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24893—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including particulate material
    • Y10T428/24909—Free metal or mineral containing

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Nanotechnology (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Physics & Mathematics (AREA)
  • Conductive Materials (AREA)
  • Paints Or Removers (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Powder Metallurgy (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
CA002665922A 2008-05-16 2009-05-13 Printable compositions containing silver nanoparticles, processes for producing electrically conductive coatings using the same, and coatings prepared thereby Abandoned CA2665922A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102008023882.1 2008-05-16
DE102008023882A DE102008023882A1 (de) 2008-05-16 2008-05-16 Druckbare Zusammensetzung auf Basis von Silberpartikeln zur Erzeugung elektrisch leitfähiger Beschichtungen

Publications (1)

Publication Number Publication Date
CA2665922A1 true CA2665922A1 (en) 2009-11-16

Family

ID=41057239

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002665922A Abandoned CA2665922A1 (en) 2008-05-16 2009-05-13 Printable compositions containing silver nanoparticles, processes for producing electrically conductive coatings using the same, and coatings prepared thereby

Country Status (13)

Country Link
US (2) US8101097B2 (enExample)
EP (1) EP2119747B1 (enExample)
JP (1) JP2009275227A (enExample)
KR (1) KR20090119732A (enExample)
CN (1) CN101580659B (enExample)
BR (1) BRPI0901446A2 (enExample)
CA (1) CA2665922A1 (enExample)
DE (1) DE102008023882A1 (enExample)
IL (1) IL198646A (enExample)
RU (1) RU2532949C2 (enExample)
SG (1) SG157311A1 (enExample)
TW (1) TWI518146B (enExample)
ZA (1) ZA200903196B (enExample)

Cited By (1)

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Publication number Priority date Publication date Assignee Title
CN117483765A (zh) * 2023-11-11 2024-02-02 深圳特新界面科技有限公司 一种石墨烯/铜复合材料及其制备方法
CN117483765B (zh) * 2023-11-11 2024-05-28 深圳特新界面科技有限公司 一种石墨烯/铜复合材料及其制备方法

Also Published As

Publication number Publication date
TW201016796A (en) 2010-05-01
US8101097B2 (en) 2012-01-24
IL198646A (en) 2011-02-28
DE102008023882A1 (de) 2009-11-19
EP2119747A1 (de) 2009-11-18
SG157311A1 (en) 2009-12-29
IL198646A0 (en) 2010-02-17
RU2009118342A (ru) 2010-11-20
CN101580659B (zh) 2014-04-02
JP2009275227A (ja) 2009-11-26
KR20090119732A (ko) 2009-11-19
BRPI0901446A2 (pt) 2010-01-26
TWI518146B (zh) 2016-01-21
US20120138347A1 (en) 2012-06-07
US20100040846A1 (en) 2010-02-18
RU2532949C2 (ru) 2014-11-20
EP2119747B1 (de) 2012-10-31
ZA200903196B (en) 2011-06-29
CN101580659A (zh) 2009-11-18

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