|
US9130344B2
(en)
|
2006-01-23 |
2015-09-08 |
Raydiance, Inc. |
Automated laser tuning
|
|
US8232687B2
(en)
|
2006-04-26 |
2012-07-31 |
Raydiance, Inc. |
Intelligent laser interlock system
|
|
CN101462822B
(zh)
*
|
2007-12-21 |
2012-08-29 |
鸿富锦精密工业(深圳)有限公司 |
具有通孔的脆性非金属工件及其加工方法
|
|
KR20120073249A
(ko)
*
|
2009-08-28 |
2012-07-04 |
코닝 인코포레이티드 |
화학적으로 강화된 유리 기판으로부터 제품을 레이저 절단하기 위한 방법
|
|
US8932510B2
(en)
|
2009-08-28 |
2015-01-13 |
Corning Incorporated |
Methods for laser cutting glass substrates
|
|
US8946590B2
(en)
|
2009-11-30 |
2015-02-03 |
Corning Incorporated |
Methods for laser scribing and separating glass substrates
|
|
KR101262923B1
(ko)
*
|
2010-08-17 |
2013-05-09 |
주식회사 이오테크닉스 |
레이저를 이용한 스크라이빙 방법 및 스크라이빙 장치
|
|
TWI513670B
(zh)
|
2010-08-31 |
2015-12-21 |
Corning Inc |
分離強化玻璃基板之方法
|
|
US8571077B2
(en)
|
2010-08-31 |
2013-10-29 |
First Solar, Inc. |
System and method for laser modulation
|
|
KR20140018183A
(ko)
|
2010-09-16 |
2014-02-12 |
레이디안스, 아이엔씨. |
적층 재료의 레이저 기반 처리
|
|
WO2012169025A1
(ja)
*
|
2011-06-08 |
2012-12-13 |
日本電気硝子株式会社 |
板状ガラスの切断方法及びその切断装置
|
|
US10239160B2
(en)
*
|
2011-09-21 |
2019-03-26 |
Coherent, Inc. |
Systems and processes that singulate materials
|
|
KR101300575B1
(ko)
*
|
2011-09-30 |
2013-08-27 |
앰코 테크놀로지 코리아 주식회사 |
반도체 패키지 제조용 레이저 가공 장치 및 방법
|
|
WO2013130581A1
(en)
*
|
2012-02-28 |
2013-09-06 |
Electro Scientific Industries, Inc. |
Method and apparatus for separation of strengthened glass and articles produced thereby
|
|
US9938180B2
(en)
|
2012-06-05 |
2018-04-10 |
Corning Incorporated |
Methods of cutting glass using a laser
|
|
US9610653B2
(en)
|
2012-09-21 |
2017-04-04 |
Electro Scientific Industries, Inc. |
Method and apparatus for separation of workpieces and articles produced thereby
|
|
WO2014079478A1
(en)
|
2012-11-20 |
2014-05-30 |
Light In Light Srl |
High speed laser processing of transparent materials
|
|
EP2754524B1
(de)
|
2013-01-15 |
2015-11-25 |
Corning Laser Technologies GmbH |
Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen Substraten, d.h. Wafer oder Glaselement, unter Verwendung einer Laserstrahlbrennlinie
|
|
US9701564B2
(en)
|
2013-01-15 |
2017-07-11 |
Corning Incorporated |
Systems and methods of glass cutting by inducing pulsed laser perforations into glass articles
|
|
US9919380B2
(en)
|
2013-02-23 |
2018-03-20 |
Coherent, Inc. |
Shaping of brittle materials with controlled surface and bulk properties
|
|
CN104014936B
(zh)
*
|
2013-02-28 |
2016-12-28 |
大族激光科技产业集团股份有限公司 |
高分子材料工件的激光加工方法及激光切割系统
|
|
EP2781296B1
(de)
*
|
2013-03-21 |
2020-10-21 |
Corning Laser Technologies GmbH |
Vorrichtung und verfahren zum ausschneiden von konturen aus flächigen substraten mittels laser
|
|
US9687936B2
(en)
|
2013-12-17 |
2017-06-27 |
Corning Incorporated |
Transparent material cutting with ultrafast laser and beam optics
|
|
US9701563B2
(en)
|
2013-12-17 |
2017-07-11 |
Corning Incorporated |
Laser cut composite glass article and method of cutting
|
|
US10442719B2
(en)
|
2013-12-17 |
2019-10-15 |
Corning Incorporated |
Edge chamfering methods
|
|
US9676167B2
(en)
*
|
2013-12-17 |
2017-06-13 |
Corning Incorporated |
Laser processing of sapphire substrate and related applications
|
|
US11556039B2
(en)
|
2013-12-17 |
2023-01-17 |
Corning Incorporated |
Electrochromic coated glass articles and methods for laser processing the same
|
|
US9850160B2
(en)
|
2013-12-17 |
2017-12-26 |
Corning Incorporated |
Laser cutting of display glass compositions
|
|
US20150165560A1
(en)
|
2013-12-17 |
2015-06-18 |
Corning Incorporated |
Laser processing of slots and holes
|
|
US9815730B2
(en)
|
2013-12-17 |
2017-11-14 |
Corning Incorporated |
Processing 3D shaped transparent brittle substrate
|
|
US9517963B2
(en)
|
2013-12-17 |
2016-12-13 |
Corning Incorporated |
Method for rapid laser drilling of holes in glass and products made therefrom
|
|
KR102445217B1
(ko)
|
2014-07-08 |
2022-09-20 |
코닝 인코포레이티드 |
재료를 레이저 가공하는 방법 및 장치
|
|
WO2016010991A1
(en)
|
2014-07-14 |
2016-01-21 |
Corning Incorporated |
Interface block; system for and method of cutting a substrate being transparent within a range of wavelengths using such interface block
|
|
WO2016010943A2
(en)
|
2014-07-14 |
2016-01-21 |
Corning Incorporated |
Method and system for arresting crack propagation
|
|
US9617180B2
(en)
|
2014-07-14 |
2017-04-11 |
Corning Incorporated |
Methods and apparatuses for fabricating glass articles
|
|
TWI659793B
(zh)
*
|
2014-07-14 |
2019-05-21 |
美商康寧公司 |
用於使用可調整雷射束焦線來處理透明材料的系統及方法
|
|
US10611667B2
(en)
|
2014-07-14 |
2020-04-07 |
Corning Incorporated |
Method and system for forming perforations
|
|
US10047001B2
(en)
|
2014-12-04 |
2018-08-14 |
Corning Incorporated |
Glass cutting systems and methods using non-diffracting laser beams
|
|
EP3245166B1
(en)
|
2015-01-12 |
2020-05-27 |
Corning Incorporated |
Laser cutting of thermally tempered substrates using the multi photon absorption method
|
|
EP3848334A1
(en)
|
2015-03-24 |
2021-07-14 |
Corning Incorporated |
Alkaline earth boro-aluminosilicate glass article with laser cut edge
|
|
WO2016160391A1
(en)
|
2015-03-27 |
2016-10-06 |
Corning Incorporated |
Gas permeable window and method of fabricating the same
|
|
DE102015104802A1
(de)
*
|
2015-03-27 |
2016-09-29 |
Schott Ag |
Verfahren zum Trennen von Glas mittels eines Lasers, sowie verfahrensgemäß hergestelltes Glaserzeugnis
|
|
US11420894B2
(en)
*
|
2015-04-24 |
2022-08-23 |
Nanoplus Ltd. |
Brittle object cutting apparatus and cutting method thereof
|
|
US11186060B2
(en)
|
2015-07-10 |
2021-11-30 |
Corning Incorporated |
Methods of continuous fabrication of holes in flexible substrate sheets and products relating to the same
|
|
MY194570A
(en)
|
2016-05-06 |
2022-12-02 |
Corning Inc |
Laser cutting and removal of contoured shapes from transparent substrates
|
|
US10410883B2
(en)
|
2016-06-01 |
2019-09-10 |
Corning Incorporated |
Articles and methods of forming vias in substrates
|
|
US10794679B2
(en)
|
2016-06-29 |
2020-10-06 |
Corning Incorporated |
Method and system for measuring geometric parameters of through holes
|
|
CN109803934A
(zh)
|
2016-07-29 |
2019-05-24 |
康宁股份有限公司 |
用于激光处理的装置和方法
|
|
WO2018044843A1
(en)
|
2016-08-30 |
2018-03-08 |
Corning Incorporated |
Laser processing of transparent materials
|
|
CN109803786B
(zh)
|
2016-09-30 |
2021-05-07 |
康宁股份有限公司 |
使用非轴对称束斑对透明工件进行激光加工的设备和方法
|
|
JP7066701B2
(ja)
|
2016-10-24 |
2022-05-13 |
コーニング インコーポレイテッド |
シート状ガラス基体のレーザに基づく加工のための基体処理ステーション
|
|
US10752534B2
(en)
|
2016-11-01 |
2020-08-25 |
Corning Incorporated |
Apparatuses and methods for laser processing laminate workpiece stacks
|
|
US10688599B2
(en)
|
2017-02-09 |
2020-06-23 |
Corning Incorporated |
Apparatus and methods for laser processing transparent workpieces using phase shifted focal lines
|
|
CA3055275A1
(en)
*
|
2017-03-03 |
2018-09-07 |
Furukawa Electric Co., Ltd. |
Welding method and welding apparatus
|
|
US10580725B2
(en)
|
2017-05-25 |
2020-03-03 |
Corning Incorporated |
Articles having vias with geometry attributes and methods for fabricating the same
|
|
US11078112B2
(en)
|
2017-05-25 |
2021-08-03 |
Corning Incorporated |
Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same
|
|
US10626040B2
(en)
|
2017-06-15 |
2020-04-21 |
Corning Incorporated |
Articles capable of individual singulation
|
|
CN107442934A
(zh)
*
|
2017-07-14 |
2017-12-08 |
华中科技大学 |
一种基于能量带拼接的激光焊接设备
|
|
US12180108B2
(en)
|
2017-12-19 |
2024-12-31 |
Corning Incorporated |
Methods for etching vias in glass-based articles employing positive charge organic molecules
|
|
US11554984B2
(en)
|
2018-02-22 |
2023-01-17 |
Corning Incorporated |
Alkali-free borosilicate glasses with low post-HF etch roughness
|
|
CN109396661A
(zh)
*
|
2018-11-09 |
2019-03-01 |
上海申和热磁电子有限公司 |
一种用于co2激光引导光纤加工氧化铝陶瓷的加工方法
|
|
JP7420548B2
(ja)
|
2019-12-24 |
2024-01-23 |
ファナック株式会社 |
ワーク搬送システム
|
|
CN113245701A
(zh)
*
|
2021-04-14 |
2021-08-13 |
哈尔滨焊接研究院有限公司 |
降低钛合金厚板窄间隙激光填丝焊接头应力和变形的方法及装置
|
|
CN114192985B
(zh)
*
|
2021-11-30 |
2023-04-21 |
深圳信息职业技术学院 |
磁场辅助激光抛光装置与磁场辅助抛光方法
|
|
CN114734153B
(zh)
*
|
2022-03-31 |
2023-02-14 |
武汉华日精密激光股份有限公司 |
一种用于激光器加工脆性材料的裂片方法及系统
|