CN104014936B - 高分子材料工件的激光加工方法及激光切割系统 - Google Patents
高分子材料工件的激光加工方法及激光切割系统 Download PDFInfo
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- CN104014936B CN104014936B CN201310066047.3A CN201310066047A CN104014936B CN 104014936 B CN104014936 B CN 104014936B CN 201310066047 A CN201310066047 A CN 201310066047A CN 104014936 B CN104014936 B CN 104014936B
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- laser
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- cutting head
- cutting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
- B23K26/046—Automatically focusing the laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
Description
Claims (9)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201310066047.3A CN104014936B (zh) | 2013-02-28 | 2013-02-28 | 高分子材料工件的激光加工方法及激光切割系统 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201310066047.3A CN104014936B (zh) | 2013-02-28 | 2013-02-28 | 高分子材料工件的激光加工方法及激光切割系统 |
Publications (2)
Publication Number | Publication Date |
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CN104014936A CN104014936A (zh) | 2014-09-03 |
CN104014936B true CN104014936B (zh) | 2016-12-28 |
Family
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CN201310066047.3A Active CN104014936B (zh) | 2013-02-28 | 2013-02-28 | 高分子材料工件的激光加工方法及激光切割系统 |
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CN (1) | CN104014936B (zh) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104227243A (zh) * | 2014-09-11 | 2014-12-24 | 深圳英诺激光科技有限公司 | 一种硬质材料激光深加工设备及加工方法 |
TWI566870B (zh) * | 2014-09-30 | 2017-01-21 | 國立交通大學 | 雷射加工方法及雷射加工物 |
CN105127604A (zh) * | 2015-09-06 | 2015-12-09 | 深圳英诺激光科技有限公司 | 激光加工系统及方法 |
CN107127459B (zh) * | 2017-06-01 | 2019-04-05 | 深圳光韵达激光应用技术有限公司 | 一种金刚石刀具的激光精确加工方法 |
CN108581185A (zh) * | 2018-07-06 | 2018-09-28 | 温州大学激光与光电智能制造研究院 | 激光加工光路切换系统及其方法 |
CN114173982B (zh) * | 2019-07-29 | 2023-08-11 | Ws光学技术有限责任公司 | 用于射束加工板状或管状工件的方法 |
CN111618447B (zh) * | 2020-05-20 | 2022-04-01 | Tcl华星光电技术有限公司 | 一种基板双侧激光切割装置及切割方法 |
CN112809196A (zh) * | 2020-12-22 | 2021-05-18 | 安捷利(番禺)电子实业有限公司 | 一种5g高频lcp材料外形切割方法 |
CN112894162B (zh) * | 2021-01-14 | 2023-08-29 | 大族激光科技产业集团股份有限公司 | 一种电路板的激光切割方法及激光切割系统 |
CN113182704A (zh) * | 2021-04-29 | 2021-07-30 | 云谷(固安)科技有限公司 | 激光切割方法、控制装置及系统 |
CN113916414B (zh) * | 2021-09-30 | 2024-04-26 | 中国科学院重庆绿色智能技术研究院 | 一种皮革基力学传感器及其制备方法 |
CN114700637B (zh) * | 2022-04-28 | 2024-03-12 | 大族激光科技产业集团股份有限公司 | 一种激光切割装置、设备以及方法 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1034364A (ja) * | 1996-07-25 | 1998-02-10 | Souei Tsusho Kk | 複数点熱源による脆性材料の割断加工方法 |
JP2001239384A (ja) * | 2000-02-25 | 2001-09-04 | Nippon Sharyo Seizo Kaisha Ltd | レーザ切断方法およびその装置 |
CN101559626A (zh) * | 2008-04-08 | 2009-10-21 | 镭美科技股份有限公司 | 脆性材料的热应力割断方法 |
CN102438787A (zh) * | 2009-04-17 | 2012-05-02 | 沓名宗春 | 纤维强化复合材料的激光加工方法及加工构件 |
CN102510788A (zh) * | 2010-06-14 | 2012-06-20 | 三菱电机株式会社 | 激光加工装置以及激光加工方法 |
CN102612499A (zh) * | 2009-09-24 | 2012-07-25 | 株式会社Ihi检查计测 | 脆性工件的切割方法及切割装置 |
CN102896430A (zh) * | 2012-08-29 | 2013-01-30 | 肖和平 | 一种半导体材料的激光加工方法 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102007059987B4 (de) * | 2007-12-11 | 2015-03-05 | Trumpf Werkzeugmaschinen Gmbh + Co. Kg | Verfahren zum keyhole-freien Laserschmelzschneiden mittels vor- und nachlaufender Laserstrahlen |
-
2013
- 2013-02-28 CN CN201310066047.3A patent/CN104014936B/zh active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1034364A (ja) * | 1996-07-25 | 1998-02-10 | Souei Tsusho Kk | 複数点熱源による脆性材料の割断加工方法 |
JP2001239384A (ja) * | 2000-02-25 | 2001-09-04 | Nippon Sharyo Seizo Kaisha Ltd | レーザ切断方法およびその装置 |
CN101559626A (zh) * | 2008-04-08 | 2009-10-21 | 镭美科技股份有限公司 | 脆性材料的热应力割断方法 |
CN102438787A (zh) * | 2009-04-17 | 2012-05-02 | 沓名宗春 | 纤维强化复合材料的激光加工方法及加工构件 |
CN102612499A (zh) * | 2009-09-24 | 2012-07-25 | 株式会社Ihi检查计测 | 脆性工件的切割方法及切割装置 |
CN102510788A (zh) * | 2010-06-14 | 2012-06-20 | 三菱电机株式会社 | 激光加工装置以及激光加工方法 |
CN102896430A (zh) * | 2012-08-29 | 2013-01-30 | 肖和平 | 一种半导体材料的激光加工方法 |
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Publication number | Publication date |
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CN104014936A (zh) | 2014-09-03 |
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Address after: 518000 Shenzhen Province, Nanshan District high tech park, North West New Road, No. 9 Applicant after: HANS LASER TECHNOLOGY INDUSTRY GROUP CO., LTD. Applicant after: Shenzhen Dazu Digital Control Science & Technology Co., Ltd. Address before: 518000 Shenzhen Province, Nanshan District high tech park, North West New Road, No. 9 Applicant before: Dazu Laser Sci. & Tech. Co., Ltd., Shenzhen Applicant before: Shenzhen Dazu Digital Control Science & Technology Co., Ltd. |
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Free format text: CORRECT: APPLICANT; FROM: DAZU LASER SCI. + TECH. CO., LTD., SHENZHEN TO: HAN'S LASER TECHNOLOGY INDUSTRY GROUP CO., LTD. |
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Effective date of registration: 20201123 Address after: 518000 No. 9988 Shennan Avenue, Shenzhen, Guangdong, Nanshan District Patentee after: HAN'S LASER TECHNOLOGY INDUSTRY GROUP Co.,Ltd. Address before: 518000 No. 9 West West Road, Nanshan District hi tech park, Shenzhen, Guangdong Patentee before: HAN'S LASER TECHNOLOGY INDUSTRY GROUP Co.,Ltd. Patentee before: SHENZHEN HAN'S CNC SCIENCE AND TECHNOLOGY Co.,Ltd. |