JP2009224783A5 - - Google Patents

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Publication number
JP2009224783A5
JP2009224783A5 JP2009062611A JP2009062611A JP2009224783A5 JP 2009224783 A5 JP2009224783 A5 JP 2009224783A5 JP 2009062611 A JP2009062611 A JP 2009062611A JP 2009062611 A JP2009062611 A JP 2009062611A JP 2009224783 A5 JP2009224783 A5 JP 2009224783A5
Authority
JP
Japan
Prior art keywords
semiconductor component
protective material
surface structure
manufacturing
heat transfer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2009062611A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009224783A (ja
Filing date
Publication date
Priority claimed from DE102008014653A external-priority patent/DE102008014653A1/de
Application filed filed Critical
Publication of JP2009224783A publication Critical patent/JP2009224783A/ja
Publication of JP2009224783A5 publication Critical patent/JP2009224783A5/ja
Pending legal-status Critical Current

Links

JP2009062611A 2008-03-17 2009-03-16 半導体構成素子を備える装置、および半導体構成素子を備える装置の製造方法 Pending JP2009224783A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102008014653A DE102008014653A1 (de) 2008-03-17 2008-03-17 Vorrichtung mit Halbleiterbauelement sowie Herstellungsverfahren

Publications (2)

Publication Number Publication Date
JP2009224783A JP2009224783A (ja) 2009-10-01
JP2009224783A5 true JP2009224783A5 (enExample) 2012-04-26

Family

ID=40983899

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009062611A Pending JP2009224783A (ja) 2008-03-17 2009-03-16 半導体構成素子を備える装置、および半導体構成素子を備える装置の製造方法

Country Status (4)

Country Link
US (1) US8039975B2 (enExample)
JP (1) JP2009224783A (enExample)
DE (1) DE102008014653A1 (enExample)
IT (1) IT1393346B1 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG150404A1 (en) * 2007-08-28 2009-03-30 Micron Technology Inc Semiconductor assemblies and methods of manufacturing such assemblies
JP2009170476A (ja) * 2008-01-11 2009-07-30 Panasonic Corp 半導体装置および半導体装置の製造方法
US7863722B2 (en) 2008-10-20 2011-01-04 Micron Technology, Inc. Stackable semiconductor assemblies and methods of manufacturing such assemblies
US9230878B2 (en) 2013-04-12 2016-01-05 Lenovo Enterprise Solutions (Singapore) Pte. Ltd. Integrated circuit package for heat dissipation
CN116868335A (zh) * 2021-01-20 2023-10-10 捷控技术有限公司 用于多晶粒电子组件的具有基板防流体的共形冷却组件

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06120295A (ja) * 1992-10-02 1994-04-28 Mitsubishi Electric Corp 半導体装置
JPH09232482A (ja) * 1996-02-23 1997-09-05 Denso Corp 半導体の表面処理方法および半導体装置
JP3410651B2 (ja) * 1998-02-06 2003-05-26 松下電器産業株式会社 半導体装置及びその製造方法
DE19951945A1 (de) 1999-10-28 2001-05-03 Daimler Chrysler Ag Halbleiterbauelement mit Seitenwandmetallisierung
US6731012B1 (en) * 1999-12-23 2004-05-04 International Business Machines Corporation Non-planar surface for semiconductor chips
DE10249205B3 (de) 2002-10-22 2004-08-05 Siemens Ag Leistungsbauelementanordnung zur mechatronischen Integration von Leistungsbauelementen
US7288839B2 (en) * 2004-02-27 2007-10-30 International Business Machines Corporation Apparatus and methods for cooling semiconductor integrated circuit package structures
JP2005260128A (ja) * 2004-03-15 2005-09-22 Yamaha Corp 半導体素子及びそれを備えたウエハレベル・チップサイズ・パッケージ
US7002247B2 (en) * 2004-06-18 2006-02-21 International Business Machines Corporation Thermal interposer for thermal management of semiconductor devices
TWI236870B (en) 2004-06-29 2005-07-21 Ind Tech Res Inst Heat dissipation apparatus with microstructure layer and manufacture method thereof

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