DE102008014653A1 - Vorrichtung mit Halbleiterbauelement sowie Herstellungsverfahren - Google Patents

Vorrichtung mit Halbleiterbauelement sowie Herstellungsverfahren Download PDF

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Publication number
DE102008014653A1
DE102008014653A1 DE102008014653A DE102008014653A DE102008014653A1 DE 102008014653 A1 DE102008014653 A1 DE 102008014653A1 DE 102008014653 A DE102008014653 A DE 102008014653A DE 102008014653 A DE102008014653 A DE 102008014653A DE 102008014653 A1 DE102008014653 A1 DE 102008014653A1
Authority
DE
Germany
Prior art keywords
surface structure
protective
semiconductor device
semiconductor
semiconductor component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE102008014653A
Other languages
German (de)
English (en)
Inventor
Dieter Donis
Jens Koenig
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Priority to DE102008014653A priority Critical patent/DE102008014653A1/de
Priority to ITMI2009A000377A priority patent/IT1393346B1/it
Priority to JP2009062611A priority patent/JP2009224783A/ja
Priority to US12/404,766 priority patent/US8039975B2/en
Publication of DE102008014653A1 publication Critical patent/DE102008014653A1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/117—Shapes of semiconductor bodies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Semiconductor Lasers (AREA)
DE102008014653A 2008-03-17 2008-03-17 Vorrichtung mit Halbleiterbauelement sowie Herstellungsverfahren Withdrawn DE102008014653A1 (de)

Priority Applications (4)

Application Number Priority Date Filing Date Title
DE102008014653A DE102008014653A1 (de) 2008-03-17 2008-03-17 Vorrichtung mit Halbleiterbauelement sowie Herstellungsverfahren
ITMI2009A000377A IT1393346B1 (it) 2008-03-17 2009-03-12 Dispositivo con componente semiconduttore, e procedimento di fabbricazione
JP2009062611A JP2009224783A (ja) 2008-03-17 2009-03-16 半導体構成素子を備える装置、および半導体構成素子を備える装置の製造方法
US12/404,766 US8039975B2 (en) 2008-03-17 2009-03-16 Device comprising a semiconductor component, and a manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102008014653A DE102008014653A1 (de) 2008-03-17 2008-03-17 Vorrichtung mit Halbleiterbauelement sowie Herstellungsverfahren

Publications (1)

Publication Number Publication Date
DE102008014653A1 true DE102008014653A1 (de) 2009-09-24

Family

ID=40983899

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102008014653A Withdrawn DE102008014653A1 (de) 2008-03-17 2008-03-17 Vorrichtung mit Halbleiterbauelement sowie Herstellungsverfahren

Country Status (4)

Country Link
US (1) US8039975B2 (enExample)
JP (1) JP2009224783A (enExample)
DE (1) DE102008014653A1 (enExample)
IT (1) IT1393346B1 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG150404A1 (en) * 2007-08-28 2009-03-30 Micron Technology Inc Semiconductor assemblies and methods of manufacturing such assemblies
JP2009170476A (ja) * 2008-01-11 2009-07-30 Panasonic Corp 半導体装置および半導体装置の製造方法
US7863722B2 (en) 2008-10-20 2011-01-04 Micron Technology, Inc. Stackable semiconductor assemblies and methods of manufacturing such assemblies
US9230878B2 (en) 2013-04-12 2016-01-05 Lenovo Enterprise Solutions (Singapore) Pte. Ltd. Integrated circuit package for heat dissipation
CN116868335A (zh) * 2021-01-20 2023-10-10 捷控技术有限公司 用于多晶粒电子组件的具有基板防流体的共形冷却组件

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19951945A1 (de) 1999-10-28 2001-05-03 Daimler Chrysler Ag Halbleiterbauelement mit Seitenwandmetallisierung
DE10249205B3 (de) 2002-10-22 2004-08-05 Siemens Ag Leistungsbauelementanordnung zur mechatronischen Integration von Leistungsbauelementen
US20060005952A1 (en) 2004-06-29 2006-01-12 Lan-Kai Yeh Heat dissipating appatatus having micro-structure layer and method of fabricating the same

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06120295A (ja) * 1992-10-02 1994-04-28 Mitsubishi Electric Corp 半導体装置
JPH09232482A (ja) * 1996-02-23 1997-09-05 Denso Corp 半導体の表面処理方法および半導体装置
JP3410651B2 (ja) * 1998-02-06 2003-05-26 松下電器産業株式会社 半導体装置及びその製造方法
US6731012B1 (en) * 1999-12-23 2004-05-04 International Business Machines Corporation Non-planar surface for semiconductor chips
US7288839B2 (en) * 2004-02-27 2007-10-30 International Business Machines Corporation Apparatus and methods for cooling semiconductor integrated circuit package structures
JP2005260128A (ja) * 2004-03-15 2005-09-22 Yamaha Corp 半導体素子及びそれを備えたウエハレベル・チップサイズ・パッケージ
US7002247B2 (en) * 2004-06-18 2006-02-21 International Business Machines Corporation Thermal interposer for thermal management of semiconductor devices

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19951945A1 (de) 1999-10-28 2001-05-03 Daimler Chrysler Ag Halbleiterbauelement mit Seitenwandmetallisierung
DE10249205B3 (de) 2002-10-22 2004-08-05 Siemens Ag Leistungsbauelementanordnung zur mechatronischen Integration von Leistungsbauelementen
US20060005952A1 (en) 2004-06-29 2006-01-12 Lan-Kai Yeh Heat dissipating appatatus having micro-structure layer and method of fabricating the same

Also Published As

Publication number Publication date
ITMI20090377A1 (it) 2009-09-18
US8039975B2 (en) 2011-10-18
IT1393346B1 (it) 2012-04-20
US20090230569A1 (en) 2009-09-17
JP2009224783A (ja) 2009-10-01

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Legal Events

Date Code Title Description
R119 Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee
R119 Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee

Effective date: 20141001