IT1393346B1 - Dispositivo con componente semiconduttore, e procedimento di fabbricazione - Google Patents
Dispositivo con componente semiconduttore, e procedimento di fabbricazioneInfo
- Publication number
- IT1393346B1 IT1393346B1 ITMI2009A000377A ITMI20090377A IT1393346B1 IT 1393346 B1 IT1393346 B1 IT 1393346B1 IT MI2009A000377 A ITMI2009A000377 A IT MI2009A000377A IT MI20090377 A ITMI20090377 A IT MI20090377A IT 1393346 B1 IT1393346 B1 IT 1393346B1
- Authority
- IT
- Italy
- Prior art keywords
- semiconductor component
- manufacturing procedure
- procedure
- manufacturing
- semiconductor
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0657—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Ceramic Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Semiconductor Lasers (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102008014653A DE102008014653A1 (de) | 2008-03-17 | 2008-03-17 | Vorrichtung mit Halbleiterbauelement sowie Herstellungsverfahren |
Publications (2)
Publication Number | Publication Date |
---|---|
ITMI20090377A1 ITMI20090377A1 (it) | 2009-09-18 |
IT1393346B1 true IT1393346B1 (it) | 2012-04-20 |
Family
ID=40983899
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ITMI2009A000377A IT1393346B1 (it) | 2008-03-17 | 2009-03-12 | Dispositivo con componente semiconduttore, e procedimento di fabbricazione |
Country Status (4)
Country | Link |
---|---|
US (1) | US8039975B2 (it) |
JP (1) | JP2009224783A (it) |
DE (1) | DE102008014653A1 (it) |
IT (1) | IT1393346B1 (it) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SG150404A1 (en) * | 2007-08-28 | 2009-03-30 | Micron Technology Inc | Semiconductor assemblies and methods of manufacturing such assemblies |
JP2009170476A (ja) * | 2008-01-11 | 2009-07-30 | Panasonic Corp | 半導体装置および半導体装置の製造方法 |
US7863722B2 (en) * | 2008-10-20 | 2011-01-04 | Micron Technology, Inc. | Stackable semiconductor assemblies and methods of manufacturing such assemblies |
US9230878B2 (en) | 2013-04-12 | 2016-01-05 | Lenovo Enterprise Solutions (Singapore) Pte. Ltd. | Integrated circuit package for heat dissipation |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06120295A (ja) * | 1992-10-02 | 1994-04-28 | Mitsubishi Electric Corp | 半導体装置 |
JPH09232482A (ja) * | 1996-02-23 | 1997-09-05 | Denso Corp | 半導体の表面処理方法および半導体装置 |
JP3410651B2 (ja) * | 1998-02-06 | 2003-05-26 | 松下電器産業株式会社 | 半導体装置及びその製造方法 |
DE19951945A1 (de) | 1999-10-28 | 2001-05-03 | Daimler Chrysler Ag | Halbleiterbauelement mit Seitenwandmetallisierung |
US6731012B1 (en) * | 1999-12-23 | 2004-05-04 | International Business Machines Corporation | Non-planar surface for semiconductor chips |
DE10249205B3 (de) | 2002-10-22 | 2004-08-05 | Siemens Ag | Leistungsbauelementanordnung zur mechatronischen Integration von Leistungsbauelementen |
US7288839B2 (en) * | 2004-02-27 | 2007-10-30 | International Business Machines Corporation | Apparatus and methods for cooling semiconductor integrated circuit package structures |
JP2005260128A (ja) * | 2004-03-15 | 2005-09-22 | Yamaha Corp | 半導体素子及びそれを備えたウエハレベル・チップサイズ・パッケージ |
US7002247B2 (en) * | 2004-06-18 | 2006-02-21 | International Business Machines Corporation | Thermal interposer for thermal management of semiconductor devices |
TWI236870B (en) | 2004-06-29 | 2005-07-21 | Ind Tech Res Inst | Heat dissipation apparatus with microstructure layer and manufacture method thereof |
-
2008
- 2008-03-17 DE DE102008014653A patent/DE102008014653A1/de not_active Withdrawn
-
2009
- 2009-03-12 IT ITMI2009A000377A patent/IT1393346B1/it active
- 2009-03-16 JP JP2009062611A patent/JP2009224783A/ja active Pending
- 2009-03-16 US US12/404,766 patent/US8039975B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2009224783A (ja) | 2009-10-01 |
US8039975B2 (en) | 2011-10-18 |
DE102008014653A1 (de) | 2009-09-24 |
ITMI20090377A1 (it) | 2009-09-18 |
US20090230569A1 (en) | 2009-09-17 |
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