JP2009214278A - 研削用砥石 - Google Patents

研削用砥石 Download PDF

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Publication number
JP2009214278A
JP2009214278A JP2008063432A JP2008063432A JP2009214278A JP 2009214278 A JP2009214278 A JP 2009214278A JP 2008063432 A JP2008063432 A JP 2008063432A JP 2008063432 A JP2008063432 A JP 2008063432A JP 2009214278 A JP2009214278 A JP 2009214278A
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JP
Japan
Prior art keywords
grinding
layer
grindstone
wafer
grinding wheel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2008063432A
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English (en)
Japanese (ja)
Other versions
JP2009214278A5 (enExample
Inventor
Susumu Hoshino
進 星野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nikon Corp
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Priority to JP2008063432A priority Critical patent/JP2009214278A/ja
Publication of JP2009214278A publication Critical patent/JP2009214278A/ja
Publication of JP2009214278A5 publication Critical patent/JP2009214278A5/ja
Pending legal-status Critical Current

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  • Polishing Bodies And Polishing Tools (AREA)
JP2008063432A 2008-03-13 2008-03-13 研削用砥石 Pending JP2009214278A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008063432A JP2009214278A (ja) 2008-03-13 2008-03-13 研削用砥石

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008063432A JP2009214278A (ja) 2008-03-13 2008-03-13 研削用砥石

Publications (2)

Publication Number Publication Date
JP2009214278A true JP2009214278A (ja) 2009-09-24
JP2009214278A5 JP2009214278A5 (enExample) 2011-10-13

Family

ID=41186702

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008063432A Pending JP2009214278A (ja) 2008-03-13 2008-03-13 研削用砥石

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JP (1) JP2009214278A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8901703B2 (en) 2004-05-06 2014-12-02 Nxp, B.V. Electronic device
US9095953B2 (en) 2010-06-17 2015-08-04 Tokyo Electron Limited Apparatus for polishing rear surface of substrate, system for polishing rear surface of substrate, method for polishing rear surface of substrate and recording medium having program for polishing rear surface of substrate

Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59105365U (ja) * 1982-12-29 1984-07-16 三和研磨工業株式会社 石材研磨板
JPS62184970U (enExample) * 1986-05-14 1987-11-25
JPS6438256U (enExample) * 1987-08-31 1989-03-07
JPH0740069U (ja) * 1993-12-27 1995-07-18 柳瀬株式会社 研磨用ディスク
JPH0885067A (ja) * 1994-09-14 1996-04-02 Nippon Electric Glass Co Ltd 板ガラス等の研磨装置用研磨工具
JP2000084856A (ja) * 1998-09-09 2000-03-28 Osaka Diamond Ind Co Ltd 弾性体を介して超砥粒層を設けた鏡面加工用超砥粒砥石
JP2001205548A (ja) * 2000-01-28 2001-07-31 Nippei Toyama Corp 片面研削装置および片面研削方法
JP2004349675A (ja) * 2003-04-30 2004-12-09 Nippei Toyama Corp 鏡面仕上げ装置
JP2005040899A (ja) * 2003-07-22 2005-02-17 Fanuc Ltd ダイヤモンド砥石
JP2005205543A (ja) * 2004-01-22 2005-08-04 Shin Etsu Handotai Co Ltd ウエーハの研削方法及びウエーハ
JP2006055964A (ja) * 2004-08-23 2006-03-02 Olympus Corp スムージング工具
JP2006159323A (ja) * 2004-12-03 2006-06-22 Asahi Diamond Industrial Co Ltd 回転砥石
JP2006218577A (ja) * 2005-02-10 2006-08-24 Read Co Ltd 研磨布用ドレッサー

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59105365U (ja) * 1982-12-29 1984-07-16 三和研磨工業株式会社 石材研磨板
JPS62184970U (enExample) * 1986-05-14 1987-11-25
JPS6438256U (enExample) * 1987-08-31 1989-03-07
JPH0740069U (ja) * 1993-12-27 1995-07-18 柳瀬株式会社 研磨用ディスク
JPH0885067A (ja) * 1994-09-14 1996-04-02 Nippon Electric Glass Co Ltd 板ガラス等の研磨装置用研磨工具
JP2000084856A (ja) * 1998-09-09 2000-03-28 Osaka Diamond Ind Co Ltd 弾性体を介して超砥粒層を設けた鏡面加工用超砥粒砥石
JP2001205548A (ja) * 2000-01-28 2001-07-31 Nippei Toyama Corp 片面研削装置および片面研削方法
JP2004349675A (ja) * 2003-04-30 2004-12-09 Nippei Toyama Corp 鏡面仕上げ装置
JP2005040899A (ja) * 2003-07-22 2005-02-17 Fanuc Ltd ダイヤモンド砥石
JP2005205543A (ja) * 2004-01-22 2005-08-04 Shin Etsu Handotai Co Ltd ウエーハの研削方法及びウエーハ
JP2006055964A (ja) * 2004-08-23 2006-03-02 Olympus Corp スムージング工具
JP2006159323A (ja) * 2004-12-03 2006-06-22 Asahi Diamond Industrial Co Ltd 回転砥石
JP2006218577A (ja) * 2005-02-10 2006-08-24 Read Co Ltd 研磨布用ドレッサー

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8901703B2 (en) 2004-05-06 2014-12-02 Nxp, B.V. Electronic device
US9095953B2 (en) 2010-06-17 2015-08-04 Tokyo Electron Limited Apparatus for polishing rear surface of substrate, system for polishing rear surface of substrate, method for polishing rear surface of substrate and recording medium having program for polishing rear surface of substrate

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