JP2009212078A5 - - Google Patents

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Publication number
JP2009212078A5
JP2009212078A5 JP2008329271A JP2008329271A JP2009212078A5 JP 2009212078 A5 JP2009212078 A5 JP 2009212078A5 JP 2008329271 A JP2008329271 A JP 2008329271A JP 2008329271 A JP2008329271 A JP 2008329271A JP 2009212078 A5 JP2009212078 A5 JP 2009212078A5
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film
functional film
layer
substrate
refractive index
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JP2008329271A
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English (en)
Japanese (ja)
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JP5112281B2 (ja
JP2009212078A (ja
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Priority claimed from JP2008329271A external-priority patent/JP5112281B2/ja
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Publication of JP2009212078A5 publication Critical patent/JP2009212078A5/ja
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JP2008329271A 2007-12-28 2008-12-25 成膜用基板 Expired - Fee Related JP5112281B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008329271A JP5112281B2 (ja) 2007-12-28 2008-12-25 成膜用基板

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2007338575 2007-12-28
JP2007338575 2007-12-28
JP2008026119 2008-02-06
JP2008026119 2008-02-06
JP2008329271A JP5112281B2 (ja) 2007-12-28 2008-12-25 成膜用基板

Publications (3)

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JP2009212078A JP2009212078A (ja) 2009-09-17
JP2009212078A5 true JP2009212078A5 (enExample) 2012-01-19
JP5112281B2 JP5112281B2 (ja) 2013-01-09

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JP2008329271A Expired - Fee Related JP5112281B2 (ja) 2007-12-28 2008-12-25 成膜用基板

Country Status (4)

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US (2) US8080811B2 (enExample)
JP (1) JP5112281B2 (enExample)
CN (1) CN101471423B (enExample)
TW (1) TWI481733B (enExample)

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TWI749726B (zh) 2015-03-09 2021-12-11 日商半導體能源研究所股份有限公司 發光元件、顯示裝置、電子裝置及照明設備
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CN110431251A (zh) * 2017-12-14 2019-11-08 京东方科技集团股份有限公司 用于将沉积材料沉积在受体基板上的供体基板、用于沉积沉积材料的方法、以及制造供体基板的方法
CN109962149B (zh) * 2017-12-14 2020-10-27 Tcl科技集团股份有限公司 一种封装薄膜及其制备方法、光电器件
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