JP2009206510A - 光熱作用を利用した基板の表面構造の製造方法 - Google Patents
光熱作用を利用した基板の表面構造の製造方法 Download PDFInfo
- Publication number
- JP2009206510A JP2009206510A JP2009018172A JP2009018172A JP2009206510A JP 2009206510 A JP2009206510 A JP 2009206510A JP 2009018172 A JP2009018172 A JP 2009018172A JP 2009018172 A JP2009018172 A JP 2009018172A JP 2009206510 A JP2009206510 A JP 2009206510A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- nanoparticles
- manufacturing
- surface structure
- observed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/102—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding of conductive powder, i.e. metallic powder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0242—Shape of an individual particle
- H05K2201/0257—Nanoparticles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
- H05K2203/128—Molten metals, e.g. casting thereof, or melting by heating and excluding molten solder
Abstract
【解決手段】光エネルギーを熱エネルギーに変換させる光線により、基板の表面のナノ粒子を励起する。基板上の表面構造は励起されたナノ粒子の熱エネルギーにより形成される。これにより、既定のパターンの層を持つ基板が形成される。
【選択図】図1
Description
実施例 1
実施例 2
実施例 3
実施例 4
実施例 5
実施例 6
実施例 7
実施例 8、9、10
実施例 11
実施例 12
Claims (14)
- 光熱作用を利用した表面構造を持つ基板の製造方法であって、
a.基板の提供、
b.提供された基板への複数のナノ粒子の配布、
c.ナノ粒子が励起して、照射エネルギーを熱エネルギーに変換する様に特定の波長での提供された基板のナノ粒子の照射、及び
d.ナノ粒子が形成した熱エネルギーにより、提供された基板の表面への既定のパターンの層の形成により構成される、光熱作用を利用した基板の表面構造の製造方法。 - 気孔を持つ基板を得られるように、ナノ粒子を提供された基板から除去されることを含む、請求項1に記載の製造方法。
- 提供された基板の溶融温度は粒子が発生させた温度より低いか同じであることを、特徴とする請求項2に記載の製造方法。
- 提供された基板は表面を有し、この表面の溶融温度は粒子が発生させた温度より低いか同じであることを、特徴とする請求項2に記載の製造方法。
- 上記提供された基板は有機素材、無機素材、或いはハイブリッド素材の内の少なくとも一つの素材を持つことを、特徴とする請求項4に記載の製造方法。
- 上記表面構造は有機素材、無機素材、或いはハイブリッド素材の内の少なくとも一つの素材を持つことを、特徴とする請求項4に記載の製造方法。
- 上記ステップbは、
ナノ粒子を透明な基板に固定すること、及び
ナノ粒子を持つ透明な基板102の片面は提供された基板に隣接するように、透明な基板を提供された基板に置くこと、を特徴とする請求項1に記載の製造方法。 - 気孔を成形する後、気孔を持つ基板を得られるように、提供された基板から透明な基板を外すこと、を特徴とする請求項7に記載の製造方法。
- 提供された基板は表面を有し、この表面の溶融温度は粒子が発生させた温度より低いか同じであることを、特徴とする請求項7に記載の製造方法。
- 上記提供された基板は有機素材、無機素材、或いはハイブリッド素材の内の少なくとも一つの素材を持つ提供された基板であることを、特徴とする請求項9に記載の製造方法。
- 上記表面構造は有機素材、無機素材、或いはハイブリッド素材の内の少なくとも一つの素材を持つことを、特徴とする請求項9に記載の製造方法。
- 上記提供された基板は有機素材、無機素材、或いはハイブリッド素材の内の少なくとも一つの素材を持つことを、特徴とする請求項1に記載の製造方法。
- 上記ナノ粒子の素材は、少なくとも一つの金属素材よりなること、を特徴とする請求項1の方法。
- 金属素材はAu,Cu,Ag,Cd,Te,CdSe,及びそれ等の組み合わせより選択されること、を特徴とする請求項12に記載の製造方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW97103802 | 2008-01-31 | ||
TW097151822A TWI401205B (zh) | 2008-01-31 | 2008-12-31 | 利用光熱效應製作應用基板的方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2009206510A true JP2009206510A (ja) | 2009-09-10 |
Family
ID=40931950
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009018192A Pending JP2009200485A (ja) | 2008-01-31 | 2009-01-29 | 光熱作用を利用した基板の表面構造の製造方法 |
JP2009018172A Pending JP2009206510A (ja) | 2008-01-31 | 2009-01-29 | 光熱作用を利用した基板の表面構造の製造方法 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009018192A Pending JP2009200485A (ja) | 2008-01-31 | 2009-01-29 | 光熱作用を利用した基板の表面構造の製造方法 |
Country Status (3)
Country | Link |
---|---|
US (2) | US20090269505A1 (ja) |
JP (2) | JP2009200485A (ja) |
TW (1) | TWI401205B (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011192832A (ja) * | 2010-03-15 | 2011-09-29 | Fujikura Ltd | 回路基板の製造方法、およびその回路基板 |
JP2011198923A (ja) * | 2010-03-18 | 2011-10-06 | Fujikura Ltd | 回路基板の製造方法、その回路基板、及び回路基板の製造方法 |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8062738B2 (en) * | 2007-09-07 | 2011-11-22 | Samsung Electronics Co., Ltd. | Heat transfer medium and heat transfer method using the same |
EP2513571A2 (en) | 2009-12-15 | 2012-10-24 | William Marsh Rice University | Electricity generation using electromagnetic radiation |
US9863662B2 (en) * | 2010-12-15 | 2018-01-09 | William Marsh Rice University | Generating a heated fluid using an electromagnetic radiation-absorbing complex |
US9222665B2 (en) | 2010-12-15 | 2015-12-29 | William Marsh Rice University | Waste remediation |
TWI494541B (zh) * | 2013-09-10 | 2015-08-01 | Globalmems Co Ltd | 具有耐摔保護功能的共振裝置 |
JP2015111563A (ja) * | 2013-11-06 | 2015-06-18 | Dowaエレクトロニクス株式会社 | 銅粒子分散液およびそれを用いた導電膜の製造方法 |
WO2016198657A1 (en) * | 2015-06-12 | 2016-12-15 | Danmarks Tekniske Universitet | Photothermal modification of plasmonic structures |
CN105487296B (zh) * | 2016-01-06 | 2019-01-22 | 京东方科技集团股份有限公司 | 取向膜材料及其制备方法、取向膜、显示基板制备方法 |
CN105798328B (zh) * | 2016-05-18 | 2018-01-30 | 深圳市国华光电科技有限公司 | 银纳米颗粒的制备方法 |
WO2018175873A1 (en) * | 2017-03-24 | 2018-09-27 | Nano-Dimension Technologies, Ltd. | Pulsed light emitting diode sintering |
CN110182877A (zh) * | 2019-05-16 | 2019-08-30 | 中山大学 | Te纳米颗粒的应用 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004119686A (ja) * | 2002-09-26 | 2004-04-15 | Harima Chem Inc | 微細配線パターンの形成方法 |
JP2004143571A (ja) * | 2001-11-22 | 2004-05-20 | Fuji Photo Film Co Ltd | 導電パターン描画用基板およびインク、ならびに導電パターンの形成方法 |
JP2005135982A (ja) * | 2003-10-28 | 2005-05-26 | Matsushita Electric Works Ltd | 回路基板の製造方法及び回路基板 |
JP2006038999A (ja) * | 2004-07-23 | 2006-02-09 | Sumitomo Electric Ind Ltd | レーザ照射を用いた導電性回路形成方法と導電性回路 |
JP2007123450A (ja) * | 2005-10-26 | 2007-05-17 | Matsushita Electric Works Ltd | 光学部品の製造方法及び発光素子 |
Family Cites Families (57)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0730362B2 (ja) * | 1987-03-20 | 1995-04-05 | 株式会社日立製作所 | 電子部品及びその製造方法 |
WO1994008912A2 (en) * | 1992-10-13 | 1994-04-28 | Ushers Inc. | Improved aggregates, and apparatus and method for making same |
IL106958A (en) * | 1993-09-09 | 1996-06-18 | Ultrafine Techn Ltd | Method of producing high-purity ultra-fine metal powder |
US6652967B2 (en) * | 2001-08-08 | 2003-11-25 | Nanoproducts Corporation | Nano-dispersed powders and methods for their manufacture |
JP3248505B2 (ja) * | 1999-02-12 | 2002-01-21 | 相田化学工業株式会社 | 貴金属焼結品及びその製造方法 |
EP1223615A1 (en) | 2001-01-10 | 2002-07-17 | Eidgenössische Technische Hochschule Zürich | A method for producing a structure using nanoparticles |
WO2003026481A2 (en) * | 2001-09-26 | 2003-04-03 | Rice University | Optically-absorbing nanoparticles for enhanced tissue repair |
US6951666B2 (en) * | 2001-10-05 | 2005-10-04 | Cabot Corporation | Precursor compositions for the deposition of electrically conductive features |
US20030146019A1 (en) * | 2001-11-22 | 2003-08-07 | Hiroyuki Hirai | Board and ink used for forming conductive pattern, and method using thereof |
AU2003241128A1 (en) * | 2002-06-13 | 2003-12-31 | Nanopowders Industries Ltd. | A method for the production of conductive and transparent nano-coatings and nano-inks and nano-powder coatings and inks produced thereby |
CN1671805B (zh) * | 2002-07-03 | 2010-05-26 | 耐诺泡德斯工业有限公司 | 烧结温度低的导电纳米油墨及其制备方法 |
US20070128905A1 (en) * | 2003-06-12 | 2007-06-07 | Stuart Speakman | Transparent conducting structures and methods of production thereof |
US7682970B2 (en) * | 2003-07-16 | 2010-03-23 | The Regents Of The University Of California | Maskless nanofabrication of electronic components |
US7462496B2 (en) * | 2003-09-08 | 2008-12-09 | American Environmental System, Inc. | Plasmon-enhanced marking of fragile materials and other applications thereof |
US7062848B2 (en) * | 2003-09-18 | 2006-06-20 | Hewlett-Packard Development Company, L.P. | Printable compositions having anisometric nanostructures for use in printed electronics |
CA2549475A1 (en) | 2003-12-15 | 2005-07-07 | Leslie Greengard | Electromagnetic control of chemical catalysis |
US7605328B2 (en) * | 2004-02-19 | 2009-10-20 | Nanosolar, Inc. | Photovoltaic thin-film cell produced from metallic blend using high-temperature printing |
US20080241262A1 (en) * | 2004-03-29 | 2008-10-02 | The University Of Houston System | Nanoshells and Discrete Polymer-Coated Nanoshells, Methods For Making and Using Same |
US20050276933A1 (en) * | 2004-06-14 | 2005-12-15 | Ravi Prasad | Method to form a conductive structure |
US20080193667A1 (en) * | 2004-08-23 | 2008-08-14 | Arkady Garbar | Ink Jet Printable Compositions |
KR20070085253A (ko) * | 2004-09-14 | 2007-08-27 | 시마 나노 테크 이스라엘 리미티드 | 잉크젯 인쇄가능한 조성물 |
JP4042737B2 (ja) * | 2004-10-27 | 2008-02-06 | セイコーエプソン株式会社 | パターン形成システム |
KR101500929B1 (ko) * | 2004-11-24 | 2015-03-11 | 엔씨씨 나노, 엘엘씨 | 나노 물질 합성물의 전기적, 도금적, 및 촉매적 이용 |
WO2007081381A2 (en) * | 2005-05-10 | 2007-07-19 | The Regents Of The University Of California | Spinodally patterned nanostructures |
US20070281136A1 (en) * | 2006-05-31 | 2007-12-06 | Cabot Corporation | Ink jet printed reflective features and processes and inks for making them |
US7973094B2 (en) * | 2006-06-29 | 2011-07-05 | University Of Central Florida Research Foundation, Inc. | Laser irradiation of metal nanoparticle/polymer composite materials for chemical and physical transformations |
US8226878B2 (en) * | 2006-07-07 | 2012-07-24 | University Of Central Florida Research Foundation, Inc. | Laser processing of metal nanoparticle/polymer composites |
JP2008041960A (ja) * | 2006-08-07 | 2008-02-21 | Nissan Chem Ind Ltd | 電子回路部品の製造方法 |
CN101680864A (zh) * | 2006-09-18 | 2010-03-24 | 应用生物系统有限责任公司 | 用于聚光机制的方法、系统和装置 |
US20080115817A1 (en) * | 2006-11-21 | 2008-05-22 | Defries Anthony | Combined Energy Conversion |
CN101622319B (zh) * | 2007-01-03 | 2013-05-08 | 内诺格雷姆公司 | 基于硅/锗的纳米颗粒油墨、掺杂型颗粒、用于半导体应用的印刷和方法 |
US10231344B2 (en) * | 2007-05-18 | 2019-03-12 | Applied Nanotech Holdings, Inc. | Metallic ink |
US8593714B2 (en) * | 2008-05-19 | 2013-11-26 | Ajjer, Llc | Composite electrode and electrolytes comprising nanoparticles and resulting devices |
US20090011143A1 (en) * | 2007-06-22 | 2009-01-08 | Matsushita Electric Industrial Co., Ltd. | Pattern forming apparatus and pattern forming method |
US7834331B2 (en) * | 2007-08-01 | 2010-11-16 | Board Of Regents, The University Of Texas System | Plasmonic laser nanoablation methods |
US8062738B2 (en) * | 2007-09-07 | 2011-11-22 | Samsung Electronics Co., Ltd. | Heat transfer medium and heat transfer method using the same |
EP2203529A1 (en) * | 2007-10-15 | 2010-07-07 | Nanoink, Inc. | Lithography of nanoparticle based inks |
WO2009099900A2 (en) * | 2008-01-31 | 2009-08-13 | Electrochromix Inc. | Environmentally safe electrochromic devices and assemblies |
US20120009353A1 (en) * | 2008-01-31 | 2012-01-12 | Industrial Technology Research Institute | Method for manufacturing a substrate with surface structure by employing photothermal effect |
CN101519184B (zh) | 2008-02-29 | 2012-05-23 | 财团法人工业技术研究院 | 利用光热效应制作应用基板的方法 |
US9730333B2 (en) * | 2008-05-15 | 2017-08-08 | Applied Nanotech Holdings, Inc. | Photo-curing process for metallic inks |
US8130438B2 (en) * | 2008-07-03 | 2012-03-06 | Ajjer Llc | Metal coatings, conductive nanoparticles and applications of the same |
US8105414B2 (en) * | 2008-09-15 | 2012-01-31 | Lockheed Martin Corporation | Lead solder-free electronics |
US20100166976A1 (en) | 2008-12-30 | 2010-07-01 | Industrial Technology Research Institute | Method of manufacturing core-shell nanostructure |
TWI383950B (zh) * | 2009-04-22 | 2013-02-01 | Ind Tech Res Inst | 奈米點狀材料的形成方法 |
TWI420540B (zh) * | 2009-09-14 | 2013-12-21 | Ind Tech Res Inst | 藉由光能或熱能成形之導電材料、導電材料之製備方法以及導電組合物 |
WO2011034570A1 (en) * | 2009-09-17 | 2011-03-24 | University Of Louisville Research Foundation, Inc. | Diagnostic and therapeutic nanoparticles |
TWI402992B (zh) * | 2009-10-23 | 2013-07-21 | Ind Tech Res Inst | 太陽能電池及其製造方法 |
TWI434883B (zh) * | 2009-11-27 | 2014-04-21 | Ind Tech Res Inst | 有機/無機混成材料及其製造方法 |
KR20130139958A (ko) * | 2010-10-06 | 2013-12-23 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 나노실리카계 코팅 및 배리어층을 갖는 반사방지 물품 |
WO2012078820A2 (en) * | 2010-12-07 | 2012-06-14 | Sun Chemical Corporation | Aerosol jet printable metal conductive inks, glass coated metal conductive inks and uv-curable dielectric inks and methods of preparing and printing the same |
KR101963801B1 (ko) * | 2011-03-29 | 2019-08-01 | 한국과학기술연구원 | 전도성 잉크 조성물, 이의 제조 방법 및 이를 이용한 전도성 박막 제조 방법 |
US8426964B2 (en) * | 2011-04-29 | 2013-04-23 | Industrial Technology Research Institute | Micro bump and method for forming the same |
TW201339279A (zh) * | 2011-11-24 | 2013-10-01 | Showa Denko Kk | 導電圖型形成方法及藉由光照射或微波加熱的導電圖型形成用組成物 |
CN103460304A (zh) * | 2011-12-19 | 2013-12-18 | 松下电器产业株式会社 | 透明导电膜、带有透明导电膜的基材及其制备方法 |
US20140287158A1 (en) * | 2013-03-21 | 2014-09-25 | Intrinsiq Materials, Inc. | Performance of conductive copper paste using copper flake |
US20140287159A1 (en) * | 2013-03-21 | 2014-09-25 | Intrinsiq Materials, Inc. | Conductive paste formulations for improving adhesion to plastic substrates |
-
2008
- 2008-12-31 TW TW097151822A patent/TWI401205B/zh not_active IP Right Cessation
-
2009
- 2009-01-29 JP JP2009018192A patent/JP2009200485A/ja active Pending
- 2009-01-29 JP JP2009018172A patent/JP2009206510A/ja active Pending
- 2009-01-29 US US12/362,131 patent/US20090269505A1/en not_active Abandoned
- 2009-01-29 US US12/362,080 patent/US8323553B2/en active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004143571A (ja) * | 2001-11-22 | 2004-05-20 | Fuji Photo Film Co Ltd | 導電パターン描画用基板およびインク、ならびに導電パターンの形成方法 |
JP2004119686A (ja) * | 2002-09-26 | 2004-04-15 | Harima Chem Inc | 微細配線パターンの形成方法 |
JP2005135982A (ja) * | 2003-10-28 | 2005-05-26 | Matsushita Electric Works Ltd | 回路基板の製造方法及び回路基板 |
JP2006038999A (ja) * | 2004-07-23 | 2006-02-09 | Sumitomo Electric Ind Ltd | レーザ照射を用いた導電性回路形成方法と導電性回路 |
JP2007123450A (ja) * | 2005-10-26 | 2007-05-17 | Matsushita Electric Works Ltd | 光学部品の製造方法及び発光素子 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011192832A (ja) * | 2010-03-15 | 2011-09-29 | Fujikura Ltd | 回路基板の製造方法、およびその回路基板 |
JP2011198923A (ja) * | 2010-03-18 | 2011-10-06 | Fujikura Ltd | 回路基板の製造方法、その回路基板、及び回路基板の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
US20090269505A1 (en) | 2009-10-29 |
US8323553B2 (en) | 2012-12-04 |
TWI401205B (zh) | 2013-07-11 |
TW200932668A (en) | 2009-08-01 |
JP2009200485A (ja) | 2009-09-03 |
US20090197011A1 (en) | 2009-08-06 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP2009206510A (ja) | 光熱作用を利用した基板の表面構造の製造方法 | |
Wu et al. | Cones fabricated by 3D nanoimprint lithography for highly sensitive surface enhanced Raman spectroscopy | |
Cui et al. | Joining and interconnect formation of nanowires and carbon nanotubes for nanoelectronics and nanosystems | |
Kwon et al. | Importance of molds for nanoimprint lithography: Hard, soft, and hybrid molds | |
JP5405574B2 (ja) | テンプレート、およびリソグラフィ用高アスペクト比テンプレートを製造する方法、ならびにナノスケールで基板を穿孔するためのテンプレートの使用 | |
CN101519184B (zh) | 利用光热效应制作应用基板的方法 | |
CA2985254A1 (en) | Integration and bonding of micro-devices into system substrate | |
KR20150014857A (ko) | 열 융착 전사를 이용한 유연 매립형 전극 필름의 제조 방법 | |
KR101039630B1 (ko) | 기판 상에 나노구조체를 선택적으로 위치시키는 방법 및 이에 의해 형성된 나노구조체를 포함하는 나노-분자 소자 | |
JP2008201635A (ja) | 微小カーボン単分子膜の形成方法及び表面コーティング方法並びにコーティング体 | |
US11639025B2 (en) | Methods for photo-induced metal printing | |
US20100166976A1 (en) | Method of manufacturing core-shell nanostructure | |
JP2015501334A (ja) | マイクロコンタクト印刷に使用するための金属ベースのナノパーティクルを含む水性インキ調合物 | |
Zhao et al. | Direct chemisorption-assisted nanotransfer printing with wafer-scale uniformity and controllability | |
Lérondel et al. | Nanofabrication for plasmonics | |
US20120009353A1 (en) | Method for manufacturing a substrate with surface structure by employing photothermal effect | |
Li et al. | Fabrication of hemispherical cavity arrays on silicon substrates using laser-assisted nanoimprinting of self-assembled particles | |
Aminuzzaman et al. | Fabrication of conductive silver micropatterns on an organic–inorganic hybrid film by laser direct writing | |
JP5002778B2 (ja) | 透明導電性膜基材の製造方法及び透明積層体の製造方法 | |
KR100841457B1 (ko) | 오산화이바나듐 나노선 패턴 및 금나노입자 패턴을 포함하는 나노회로의 제조방법 | |
JP5336140B2 (ja) | ナノ構造のクロス構造の製造 | |
JP2002353436A (ja) | シリコンナノパーティクルのパターニング方法及びこの方法に用いる有機分子 | |
Saeed et al. | Si nanowires-holes arrays with enhanced wettability | |
KR101598827B1 (ko) | 비접촉 프린팅을 이용한 미세 구조물의 패턴 형성 방법 | |
KR101568838B1 (ko) | 저 반사 및 지문방지 특성을 갖는 유리의 제조방법 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20101221 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20110913 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20111213 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20120619 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20120912 |
|
A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20120918 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20121211 |