JP2009170543A - 電力変換装置およびその製造方法 - Google Patents
電力変換装置およびその製造方法 Download PDFInfo
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Abstract
【解決手段】電力変換装置は第1の基板(105)と、第1の基板に接合されている第1の部品(100)と、第1の基板に一端側(102)と他端側(103)が共に接続されている第1のワイヤボンディング線(101)とを具え、第1のワイヤボンディング線が、第1の部品の側面、或いは、該第1の部品の少なくとも一部と接触して第1の部品を第1の基板上で支持している。
【選択図】図1
Description
第1の基板と、
該第1の基板に接合されている第1の部品と、
前記第1の基板に一端側と他端側が共に接続されている第1のワイヤボンディング線とを具え、
該第1のワイヤボンディング線が、
前記第1の部品の側面、或いは、該第1の部品の少なくとも一部と接触して、該第1の部品を前記第1の基板上で支持している、
ことを特徴とする。
ことを特徴とする。
前記ワイヤボンディング線の一端側と他端側の少なくとも一方が、前記半導体素子と前記第1の基板との間に位置(即ち、素子の下に一端側と他端側の少なくとも一方が位置)しており、
かつ、前記ワイヤボンディング線が、前記一端側および前記他端側から前記半導体素子と前記第1の基板との間から外側に出るように屈曲しており、さらに、前記外側に出た部分から該半導体素子の側面に略沿うように屈曲している、
ことを特徴とする。
前記第1の部品が、
第1の金属板と、該第1の金属板にハンダで接合した半導体素子とを具え、
前記第1の基板が、
ハンダで前記第1の金属板に接合される、
ことを特徴とする。
第1の基板と、
第2の基板と、
前記第1の基板に接合されている第1の部品と、
前記第1の基板(その主面)に一端側と他端側が共に接続されている第1のワイヤボンディング線と、
前記第2の基板に接合されている第2の部品と、
前記第2の基板(その主面)に一端側と他端側が共に接続されている第2のワイヤボンディング線とを具え、
前記第1のワイヤボンディング線が、
前記第1の部品の側面、或いは、該第1の部品の少なくとも一部と接触して、該第1の部品を該第1の基板(主面)上で支持し、
前記第2のワイヤボンディング線が、
前記第2の部品の側面、或いは、該第2の部品の少なくとも一部が接触して、該第2の部品を該第2の基板(主面)上で支持し、
前記第1の基板に接合されている前記第1の部品の主面と、前記第2の基板に接合されている前記第2の部品の主面とが対向しており、
前記第1のワイヤボンディング線と前記第2のワイヤボンディング線とが接触して、前記第1の部品の主面と前記第2の部品の主面とが接合されている、
ことを特徴とする。
前記第1の部品が、第1の半導体素子であり、
前記第2の部品が、第2の半導体素子であり、
該第1の半導体素子の第1の上面電極に対する電気接続と、該第2の半導体素子の第2の上面電極に対する電気接続とがそれぞれワイヤボンディングにて為されている、
ことを特徴とする。
第1の基板上に第1の部品を設け、
前記第1の基板(その主面)に一端側と他端側が共に接続されている第1のワイヤボンディング線を設け、
該第1のワイヤボンディング線と、前記第1の部品の側面、或いは、該第1の部品の少なくとも一部が接触して、該第1の部品が該第1の基板の主面上に接合させる、
ことを特徴とする。
第1の基板上に第1の部品を設け、
前記第1の基板(その主面)に一端側と他端側が共に接続されている第1のワイヤボンディング線を設け、
第2の基板上に第2の部品を設け、
前記第2の基板(その主面)に一端側と他端側が共に接続されている第2のワイヤボンディング線を設け、
前記第1のワイヤボンディング線と、前記第1の部品の側面、或いは、該第1の部品の少なくとも一部を接触させ、該第1の部品を該第1の基板(その主面)上に接合し、
前記第2のワイヤボンディング線と、前記第2の部品の側面、或いは、該第2の部品の少なくとも一部を接触させ、該第2の部品を該第2の基板(その主面)上に接合し、
前記第1の基板上に設けた第1の部品の主面と、前記第2の基板上に設けた第2の部品の主面とを対向させ、
前記第1のワイヤボンディング線と前記第2のワイヤボンディング線とを接触させ、前記第1の部品の主面と前記第2の部品の主面とを接合する、
ことを特徴とする。
図1は、第1実施例による電力変換装置の概略構造を示す模式図である。図1に示すように、ワイヤボンディング線101の一端側102と他端側103が、共に基板105主面に接続(接触)している。ワイヤボンディング線101が、基板105主面上に配置・接合された半導体素子(第1の部品)100の側面或いは半導体素子100の一部とが接触した状態にて、半導体素子100を基板主面上で支持している。さらに、半導体素子100と基板105との接合にハンダ104を用いる。また、半導体素子100の裏面側から外側にはみ出したハンダ104の内部に、ワイヤボンディング線101の一部が含まれるような構成とする。
第2実施例について説明する。図3は、第2実施例による電力変換装置の概略構造を示す模式図である。図4は、第2実施例の製造工程を示す模式図である。図5は、第2実施例の変形構造を示す図である。第1実施例と同様の構成の説明は省略する。なお、以降の実施例において同様の構成要素は同様の参照符号を付し、その説明は省略する。
第3実施例について説明する。図6は、第3実施例による電力変換装置の概略構造を示す模式図である。本実施例は、第1または第2実施例の構成に対して、金属板300を加えたものである。図6に示すように、第1の金属板300の上に半導体素子100を実装したものが、基板105に載置される第1の部品となる。さらに、基板105と金属板300との実装、および第1の金属板300と半導体素子100との実装は共に、ハンダ104a,104Bによって行っている構成とする。
第4実施例について説明する。図7は、第3実施例による電力変換装置の概略構造を示す模式図である。図に示すように、一端側と他端側が共に第1の基板400主面に接続された第1のワイヤボンディング線403を有する。そして、第1のワイヤボンディング線403と、第1の基板400主面上に配置・接合されている半導体素子401の側面或いはその一部とが接触した状態にて、第1のワイヤボンディング線403が、第1の半導体素子(第1の部品)401を基板400主面上で支持している、構成とする。
101 ワイヤボンディング線
102 一端側
103 他端側
104 ハンダ
104a,104b ハンダ
105 基板
201 ワイヤボンディング線
210 錘材
300 金属板
400 第1の基板
401 第1の半導体素子
402 第1の上面電極
403 第1のワイヤボンディング線
410 第2の基板
411 第2の半導体素子
412 第2の上面電極
413 第2のワイヤボンディング線
450 熱伝導性材料
Claims (8)
- 第1の基板と、
該第1の基板に接合されている第1の部品と、
前記第1の基板に一端側と他端側が共に接続されている第1のワイヤボンディング線とを具え、
該第1のワイヤボンディング線が、
前記第1の部品の側面、或いは、該第1の部品の少なくとも一部と接触して、該第1の部品を前記第1の基板上で支持している、
ことを特徴とする電力変換装置。 - 請求項1に記載の電力変換装置において、
前記第1の部品が半導体素子であり、該半導体素子と前記第1の基板との接合にハンダを用いた、
ことを特徴とする電力変換装置。 - 請求項1または2に記載の電力変換装置において、
前記ワイヤボンディング線の一端側と他端側の少なくとも一方が、前記半導体素子と前記第1の基板との間に位置しており、
かつ、前記ワイヤボンディング線が、前記一端側および前記他端側から前記半導体素子と前記第1の基板との間から外側に出るように屈曲しており、さらに、前記外側に出た部分から該半導体素子の側面に略沿うように屈曲している、
ことを特徴とする電力変換装置。 - 請求項1〜3のいずれか1項に記載の電力変換装置において、
前記第1の部品が、
第1の金属板と、該第1の金属板にハンダで接合した半導体素子とを具え、
前記第1の基板が、
ハンダで前記第1の金属板に接合される、
ことを特徴とする電力変換装置。 - 第1の基板と、
第2の基板と、
前記第1の基板に接合されている第1の部品と、
前記第1の基板に一端側と他端側が共に接続されている第1のワイヤボンディング線と、
前記第2の基板に接合されている第2の部品と、
前記第2の基板に一端側と他端側が共に接続されている第2のワイヤボンディング線とを具え、
前記第1のワイヤボンディング線が、
前記第1の部品の側面、或いは、該第1の部品の少なくとも一部と接触して、該第1の部品を該第1の基板上で支持し、
前記第2のワイヤボンディング線が、
前記第2の部品の側面、或いは、該第2の部品の少なくとも一部が接触して、該第2の部品を該第2の基板上で支持し、
前記第1の基板に接合されている前記第1の部品の主面と、前記第2の基板に接合されている前記第2の部品の主面とが対向しており、
前記第1のワイヤボンディング線と前記第2のワイヤボンディング線とが接触して、前記第1の部品の主面と前記第2の部品の主面とが接合されている、
ことを特徴とする電力変換装置。 - 請求項5に記載の電力変換装置において、
前記第1の部品が、第1の半導体素子であり、
前記第2の部品が、第2の半導体素子であり、
該第1の半導体素子の第1の上面電極に対する電気接続と、該第2の半導体素子の第2の上面電極に対する電気接続とがそれぞれワイヤボンディングにて為されている、
ことを特徴とする電力変換装置。 - 第1の基板上に第1の部品を設け、
前記第1の基板に一端側と他端側が共に接続されている第1のワイヤボンディング線を設け、
該第1のワイヤボンディング線と、前記第1の部品の側面、或いは、該第1の部品の少なくとも一部が接触して、該第1の部品が該第1の基板の主面上に接合させる、
ことを特徴とする電力変換装置の製造方法。 - 第1の基板上に第1の部品を設け、
前記第1の基板に一端側と他端側が共に接続されている第1のワイヤボンディング線を設け、
第2の基板上に第2の部品を設け、
前記第2の基板に一端側と他端側が共に接続されている第2のワイヤボンディング線を設け、
前記第1のワイヤボンディング線と、前記第1の部品の側面、或いは、該第1の部品の少なくとも一部を接触させ、該第1の部品を該第1の基板上に接合し、
前記第2のワイヤボンディング線と、前記第2の部品の側面、或いは、該第2の部品の少なくとも一部を接触させ、該第2の部品を該第2の基板上に接合し、
前記第1の基板上に設けた第1の部品の主面と、前記第2の基板上に設けた第2の部品の主面とを対向させ、
前記第1のワイヤボンディング線と前記第2のワイヤボンディング線とを接触させ、前記第1の部品の主面と前記第2の部品の主面とを接合する、
ことを特徴とする電力変換装置の製造方法。
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JPH10321651A (ja) * | 1997-05-19 | 1998-12-04 | Mitsubishi Electric Corp | 半導体装置 |
JP2006162579A (ja) * | 2004-12-10 | 2006-06-22 | Osaka Gas Co Ltd | メータ及びメータ用アダプタの接続方法 |
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