JP2009164556A - ウエハ加工用テープ - Google Patents

ウエハ加工用テープ Download PDF

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Publication number
JP2009164556A
JP2009164556A JP2008154685A JP2008154685A JP2009164556A JP 2009164556 A JP2009164556 A JP 2009164556A JP 2008154685 A JP2008154685 A JP 2008154685A JP 2008154685 A JP2008154685 A JP 2008154685A JP 2009164556 A JP2009164556 A JP 2009164556A
Authority
JP
Japan
Prior art keywords
adhesive
tape
film
adhesive film
adhesive tape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2008154685A
Other languages
English (en)
Japanese (ja)
Inventor
Yosuke Ogawara
洋介 大河原
Hiromitsu Maruyama
弘光 丸山
Jiro Sugiyama
二朗 杉山
Yasumasa Morishima
泰正 盛島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Priority to JP2008154685A priority Critical patent/JP2009164556A/ja
Priority to CN2008801188330A priority patent/CN101883830A/zh
Priority to PCT/JP2008/070313 priority patent/WO2009075150A1/ja
Priority to KR1020107015177A priority patent/KR20100097730A/ko
Priority to TW097146653A priority patent/TWI372710B/zh
Publication of JP2009164556A publication Critical patent/JP2009164556A/ja
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/40—Adhesives in the form of films or foils characterised by release liners
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H01L2221/68336—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding involving stretching of the auxiliary support post dicing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]

Landscapes

  • Organic Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesive Tapes (AREA)
  • Dicing (AREA)
  • Adhesives Or Adhesive Processes (AREA)
JP2008154685A 2007-12-11 2008-06-12 ウエハ加工用テープ Pending JP2009164556A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2008154685A JP2009164556A (ja) 2007-12-11 2008-06-12 ウエハ加工用テープ
CN2008801188330A CN101883830A (zh) 2007-12-11 2008-11-07 晶片加工用带
PCT/JP2008/070313 WO2009075150A1 (ja) 2007-12-11 2008-11-07 ウエハ加工用テープ
KR1020107015177A KR20100097730A (ko) 2007-12-11 2008-11-07 웨이퍼 가공용 테이프
TW097146653A TWI372710B (en) 2007-12-11 2008-12-01 Wafer processing tape

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007319995 2007-12-11
JP2008154685A JP2009164556A (ja) 2007-12-11 2008-06-12 ウエハ加工用テープ

Publications (1)

Publication Number Publication Date
JP2009164556A true JP2009164556A (ja) 2009-07-23

Family

ID=40966775

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008154685A Pending JP2009164556A (ja) 2007-12-11 2008-06-12 ウエハ加工用テープ

Country Status (4)

Country Link
JP (1) JP2009164556A (zh)
KR (1) KR20100097730A (zh)
CN (1) CN101883830A (zh)
TW (1) TWI372710B (zh)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012104716A (ja) * 2010-11-11 2012-05-31 Sekisui Chem Co Ltd 半導体加工用接着シート及び半導体チップの実装方法
JP2013153088A (ja) * 2012-01-25 2013-08-08 Furukawa Electric Co Ltd:The ウエハ加工用テープ
JP2013235962A (ja) * 2012-05-09 2013-11-21 Hitachi Chemical Co Ltd 半導体装置の製造方法
KR20150113878A (ko) * 2014-03-31 2015-10-08 닛토덴코 가부시키가이샤 다이싱 필름, 다이싱·다이본드 필름 및 반도체 장치의 제조 방법
JP2015185591A (ja) * 2014-03-20 2015-10-22 日立化成株式会社 ウエハ加工用テープ
JP2015198116A (ja) * 2014-03-31 2015-11-09 日東電工株式会社 熱硬化型ダイボンドフィルム、ダイシング・ダイボンドフィルム及び半導体装置の製造方法
JP5863914B1 (ja) * 2014-09-05 2016-02-17 古河電気工業株式会社 半導体加工用テープ及びこれを使用して製造する半導体装置の製造方法
WO2017179439A1 (ja) * 2016-04-15 2017-10-19 デンカ株式会社 半導体加工用粘着テープ、及びそれを用いた半導体チップ又は半導体部品の製造方法
JP2018056289A (ja) * 2016-09-28 2018-04-05 日東電工株式会社 ダイシングダイボンディングテープおよび半導体装置の製造方法
CN107892882A (zh) * 2016-10-03 2018-04-10 日东电工株式会社 切割带一体型粘接片
KR20180127183A (ko) 2017-05-19 2018-11-28 닛토덴코 가부시키가이샤 다이싱 다이 본드 필름
KR20190004655A (ko) 2017-07-04 2019-01-14 닛토덴코 가부시키가이샤 다이싱 테이프, 다이싱 다이 본드 필름, 및 반도체 장치의 제조 방법
JP6998154B2 (ja) 2017-08-29 2022-01-18 リンテック株式会社 ダイボンディングシート

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI671799B (zh) * 2011-03-30 2019-09-11 Sumitomo Bakelite Co., Ltd. 半導體晶圓等加工用黏著帶
JP6883405B2 (ja) * 2016-11-01 2021-06-09 日東電工株式会社 ダイシングダイボンディングテープおよび半導体装置の製造方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003342393A (ja) * 2002-05-30 2003-12-03 Mitsubishi Polyester Film Copp ダイシングテープ用ポリエステル系軟質フィルム
JP2004228420A (ja) * 2003-01-24 2004-08-12 Furukawa Electric Co Ltd:The 半導体ウェハー固定用粘着テープ
JP2005019962A (ja) * 2003-06-06 2005-01-20 Hitachi Chem Co Ltd 接着シート
JP2007019151A (ja) * 2005-07-06 2007-01-25 Furukawa Electric Co Ltd:The ウエハ加工用テープおよびそれを用いたチップの製造方法
JP2007088240A (ja) * 2005-09-22 2007-04-05 Furukawa Electric Co Ltd:The 半導体ウェハダイシング用粘着テープ
JP2007109808A (ja) * 2005-10-12 2007-04-26 Furukawa Electric Co Ltd:The 半導体ウエハダイシング−ダイボンド用粘接着テープ

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100454493C (zh) * 2003-06-06 2009-01-21 日立化成工业株式会社 粘合片、与切割胶带一体化粘合片以及半导体的制造方法
JP4776188B2 (ja) * 2004-08-03 2011-09-21 古河電気工業株式会社 半導体装置製造方法およびウエハ加工用テープ

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003342393A (ja) * 2002-05-30 2003-12-03 Mitsubishi Polyester Film Copp ダイシングテープ用ポリエステル系軟質フィルム
JP2004228420A (ja) * 2003-01-24 2004-08-12 Furukawa Electric Co Ltd:The 半導体ウェハー固定用粘着テープ
JP2005019962A (ja) * 2003-06-06 2005-01-20 Hitachi Chem Co Ltd 接着シート
JP2007019151A (ja) * 2005-07-06 2007-01-25 Furukawa Electric Co Ltd:The ウエハ加工用テープおよびそれを用いたチップの製造方法
JP2007088240A (ja) * 2005-09-22 2007-04-05 Furukawa Electric Co Ltd:The 半導体ウェハダイシング用粘着テープ
JP2007109808A (ja) * 2005-10-12 2007-04-26 Furukawa Electric Co Ltd:The 半導体ウエハダイシング−ダイボンド用粘接着テープ

Cited By (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012104716A (ja) * 2010-11-11 2012-05-31 Sekisui Chem Co Ltd 半導体加工用接着シート及び半導体チップの実装方法
JP2013153088A (ja) * 2012-01-25 2013-08-08 Furukawa Electric Co Ltd:The ウエハ加工用テープ
JP2013235962A (ja) * 2012-05-09 2013-11-21 Hitachi Chemical Co Ltd 半導体装置の製造方法
JP2015185591A (ja) * 2014-03-20 2015-10-22 日立化成株式会社 ウエハ加工用テープ
KR102493750B1 (ko) * 2014-03-31 2023-02-06 닛토덴코 가부시키가이샤 다이싱·다이본드 필름 및 반도체 장치의 제조 방법
KR20150113878A (ko) * 2014-03-31 2015-10-08 닛토덴코 가부시키가이샤 다이싱 필름, 다이싱·다이본드 필름 및 반도체 장치의 제조 방법
JP2015198118A (ja) * 2014-03-31 2015-11-09 日東電工株式会社 ダイシングフィルム、ダイシング・ダイボンドフィルム及び半導体装置の製造方法
JP2015198116A (ja) * 2014-03-31 2015-11-09 日東電工株式会社 熱硬化型ダイボンドフィルム、ダイシング・ダイボンドフィルム及び半導体装置の製造方法
KR102386082B1 (ko) * 2014-03-31 2022-04-14 닛토덴코 가부시키가이샤 다이싱 필름, 다이싱·다이본드 필름 및 반도체 장치의 제조 방법
TWI660436B (zh) * 2014-03-31 2019-05-21 日商日東電工股份有限公司 切晶膜、切晶黏晶膜及半導體裝置之製造方法
KR20220050110A (ko) * 2014-03-31 2022-04-22 닛토덴코 가부시키가이샤 다이싱·다이본드 필름 및 반도체 장치의 제조 방법
WO2016035687A1 (ja) * 2014-09-05 2016-03-10 古河電気工業株式会社 半導体加工用テープ及びこれを使用して製造した半導体装置
JP2016058458A (ja) * 2014-09-05 2016-04-21 古河電気工業株式会社 半導体加工用テープ及びこれを使用して製造する半導体装置の製造方法
JP5863914B1 (ja) * 2014-09-05 2016-02-17 古河電気工業株式会社 半導体加工用テープ及びこれを使用して製造する半導体装置の製造方法
WO2017179439A1 (ja) * 2016-04-15 2017-10-19 デンカ株式会社 半導体加工用粘着テープ、及びそれを用いた半導体チップ又は半導体部品の製造方法
JPWO2017179439A1 (ja) * 2016-04-15 2019-02-28 デンカ株式会社 半導体加工用粘着テープ、及びそれを用いた半導体チップ又は半導体部品の製造方法
KR20180035149A (ko) * 2016-09-28 2018-04-05 닛토덴코 가부시키가이샤 다이싱 다이 본딩 테이프 및 반도체 장치의 제조 방법
JP2018056289A (ja) * 2016-09-28 2018-04-05 日東電工株式会社 ダイシングダイボンディングテープおよび半導体装置の製造方法
KR102401808B1 (ko) * 2016-09-28 2022-05-26 닛토덴코 가부시키가이샤 다이싱 다이 본딩 테이프 및 반도체 장치의 제조 방법
KR20180037115A (ko) 2016-10-03 2018-04-11 닛토덴코 가부시키가이샤 다이싱 테이프 일체형 접착 시트
CN107892882B (zh) * 2016-10-03 2021-08-31 日东电工株式会社 切割带一体型粘接片
TWI742171B (zh) * 2016-10-03 2021-10-11 日商日東電工股份有限公司 切割帶一體型接著片
KR102401744B1 (ko) * 2016-10-03 2022-05-26 닛토덴코 가부시키가이샤 다이싱 테이프 일체형 접착 시트
JP2018060850A (ja) * 2016-10-03 2018-04-12 日東電工株式会社 ダイシングテープ一体型接着シート
CN107892882A (zh) * 2016-10-03 2018-04-10 日东电工株式会社 切割带一体型粘接片
KR20180127183A (ko) 2017-05-19 2018-11-28 닛토덴코 가부시키가이샤 다이싱 다이 본드 필름
KR20190004655A (ko) 2017-07-04 2019-01-14 닛토덴코 가부시키가이샤 다이싱 테이프, 다이싱 다이 본드 필름, 및 반도체 장치의 제조 방법
JP6998154B2 (ja) 2017-08-29 2022-01-18 リンテック株式会社 ダイボンディングシート

Also Published As

Publication number Publication date
KR20100097730A (ko) 2010-09-03
TWI372710B (en) 2012-09-21
CN101883830A (zh) 2010-11-10
TW200934699A (en) 2009-08-16

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