JP2009164176A5 - - Google Patents
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- Publication number
- JP2009164176A5 JP2009164176A5 JP2007339330A JP2007339330A JP2009164176A5 JP 2009164176 A5 JP2009164176 A5 JP 2009164176A5 JP 2007339330 A JP2007339330 A JP 2007339330A JP 2007339330 A JP2007339330 A JP 2007339330A JP 2009164176 A5 JP2009164176 A5 JP 2009164176A5
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor light
- light emitting
- insulating substrate
- emitting device
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 31
- 239000000758 substrate Substances 0.000 claims description 25
- 239000004020 conductor Substances 0.000 claims description 21
- 238000007747 plating Methods 0.000 claims description 17
- 230000000149 penetrating Effects 0.000 claims description 6
- 229910000679 solder Inorganic materials 0.000 claims description 6
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 238000007789 sealing Methods 0.000 claims description 3
- 239000011889 copper foil Substances 0.000 claims description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical group [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 239000010931 gold Substances 0.000 claims description 2
- 230000002093 peripheral Effects 0.000 claims description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 2
- 229910052709 silver Inorganic materials 0.000 claims description 2
- 239000004332 silver Substances 0.000 claims description 2
- 238000009413 insulation Methods 0.000 claims 2
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007339330A JP2009164176A (ja) | 2007-12-28 | 2007-12-28 | 半導体発光装置 |
| KR20080129294A KR20090072969A (ko) | 2007-12-28 | 2008-12-18 | 반도체 발광장치 |
| CN 200810185048 CN101471415B (zh) | 2007-12-28 | 2008-12-26 | 半导体发光装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007339330A JP2009164176A (ja) | 2007-12-28 | 2007-12-28 | 半導体発光装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2009164176A JP2009164176A (ja) | 2009-07-23 |
| JP2009164176A5 true JP2009164176A5 (ko) | 2012-02-02 |
Family
ID=40828655
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007339330A Pending JP2009164176A (ja) | 2007-12-28 | 2007-12-28 | 半導体発光装置 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2009164176A (ko) |
| KR (1) | KR20090072969A (ko) |
| CN (1) | CN101471415B (ko) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6219586B2 (ja) | 2012-05-09 | 2017-10-25 | ローム株式会社 | 半導体発光装置 |
| KR101974354B1 (ko) | 2013-02-14 | 2019-05-02 | 삼성전자주식회사 | 발광소자 패키지 및 그 제조 방법 |
| JP2017076809A (ja) * | 2016-12-05 | 2017-04-20 | 大日本印刷株式会社 | 樹脂付リードフレーム、半導体装置、照明装置 |
| CN108807652B (zh) | 2017-04-28 | 2023-03-21 | 日亚化学工业株式会社 | 发光装置 |
| KR101971436B1 (ko) * | 2017-12-22 | 2019-04-23 | 주식회사 에이유이 | 탑뷰 및 사이드뷰 실장이 가능한 cob 타입 엘이디 패키지 및 그 제조 방법 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3447139B2 (ja) * | 1995-03-06 | 2003-09-16 | 株式会社シチズン電子 | チップ型発光ダイオード |
| JP3797636B2 (ja) * | 1997-02-21 | 2006-07-19 | シチズン電子株式会社 | 表面実装型発光ダイオード及びその製造方法 |
| JP2000036621A (ja) * | 1998-07-16 | 2000-02-02 | Shichizun Denshi:Kk | 側面型電子部品の電極構造 |
| JP3886306B2 (ja) * | 1999-10-13 | 2007-02-28 | ローム株式会社 | チップ型半導体発光装置 |
| CN1377045A (zh) * | 2001-03-27 | 2002-10-30 | 佳邦科技股份有限公司 | 表面粘着型可复式过电流保护元件端电极结构及其制法 |
| JP3939145B2 (ja) * | 2001-12-18 | 2007-07-04 | シャープ株式会社 | 側面発光型の表面実装型発光ダイオード |
-
2007
- 2007-12-28 JP JP2007339330A patent/JP2009164176A/ja active Pending
-
2008
- 2008-12-18 KR KR20080129294A patent/KR20090072969A/ko not_active Application Discontinuation
- 2008-12-26 CN CN 200810185048 patent/CN101471415B/zh not_active Expired - Fee Related
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