JP2009161769A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2009161769A5 JP2009161769A5 JP2009091830A JP2009091830A JP2009161769A5 JP 2009161769 A5 JP2009161769 A5 JP 2009161769A5 JP 2009091830 A JP2009091830 A JP 2009091830A JP 2009091830 A JP2009091830 A JP 2009091830A JP 2009161769 A5 JP2009161769 A5 JP 2009161769A5
- Authority
- JP
- Japan
- Prior art keywords
- weight
- resin
- prepreg
- resin composition
- prepreg according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011342 resin composition Substances 0.000 claims description 14
- 239000003822 epoxy resin Substances 0.000 claims description 10
- 239000011256 inorganic filler Substances 0.000 claims description 10
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 10
- 229920000647 polyepoxide Polymers 0.000 claims description 10
- XLJMAIOERFSOGZ-UHFFFAOYSA-M cyanate Chemical compound [O-]C#N XLJMAIOERFSOGZ-UHFFFAOYSA-M 0.000 claims description 6
- 239000011347 resin Substances 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
- 239000005011 phenolic resin Substances 0.000 claims description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 2
- 239000005350 fused silica glass Substances 0.000 claims description 2
- 230000009477 glass transition Effects 0.000 claims description 2
- 239000000463 material Substances 0.000 claims description 2
- 239000002245 particle Substances 0.000 claims description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims 1
- 229920001568 phenolic resin Polymers 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009091830A JP5476772B2 (ja) | 2009-04-06 | 2009-04-06 | プリプレグおよび積層板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009091830A JP5476772B2 (ja) | 2009-04-06 | 2009-04-06 | プリプレグおよび積層板 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002078056A Division JP4322463B2 (ja) | 2002-03-20 | 2002-03-20 | 銅張積層板用プリプレグおよび銅張積層板 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2009161769A JP2009161769A (ja) | 2009-07-23 |
| JP2009161769A5 true JP2009161769A5 (enExample) | 2010-09-02 |
| JP5476772B2 JP5476772B2 (ja) | 2014-04-23 |
Family
ID=40964714
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009091830A Expired - Lifetime JP5476772B2 (ja) | 2009-04-06 | 2009-04-06 | プリプレグおよび積層板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5476772B2 (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012131948A (ja) * | 2010-12-24 | 2012-07-12 | Sumitomo Bakelite Co Ltd | 樹脂組成物、プリプレグ、積層板、樹脂シート、プリント配線板及び半導体装置 |
| WO2013021869A1 (ja) | 2011-08-09 | 2013-02-14 | 三菱瓦斯化学株式会社 | 新規なシアン酸エステル化合物及びその製造方法、並びに該化合物を含む硬化性樹脂組成物及びその硬化物 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5888630A (en) * | 1996-11-08 | 1999-03-30 | W. L. Gore & Associates, Inc. | Apparatus and method for unit area composition control to minimize warp in an integrated circuit chip package assembly |
| JP3659842B2 (ja) * | 1999-08-09 | 2005-06-15 | 住友ベークライト株式会社 | 積層板用難燃性樹脂組成物、プリプレグ及び積層板 |
| JP2001064340A (ja) * | 1999-08-30 | 2001-03-13 | Nippon Kayaku Co Ltd | ４，４’−ビフェニルジイルジメチレン−フェノール樹脂、エポキシ樹脂、エポキシ樹脂組成物及びその硬化物 |
| JP2001172473A (ja) * | 1999-10-07 | 2001-06-26 | Nitto Denko Corp | 半導体封止用エポキシ樹脂組成物およびそれを用いた半導体装置 |
| JP2002060514A (ja) * | 2000-08-17 | 2002-02-26 | Mitsubishi Gas Chem Co Inc | プリプレグの製造方法 |
| JP2002080560A (ja) * | 2000-09-08 | 2002-03-19 | Mitsui Chemicals Inc | 高耐熱難燃性樹脂組成物及びその積層板 |
| JP2002080565A (ja) * | 2000-09-08 | 2002-03-19 | Mitsui Chemicals Inc | 高耐熱難燃性樹脂組成物及びその加工部品 |
| JP4132703B2 (ja) * | 2001-03-26 | 2008-08-13 | 住友ベークライト株式会社 | 銅張積層板用プリプレグ及びそれを用いた銅張積層板 |
-
2009
- 2009-04-06 JP JP2009091830A patent/JP5476772B2/ja not_active Expired - Lifetime
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2016094608A5 (enExample) | ||
| JP2016040391A5 (enExample) | ||
| JP2011006710A5 (enExample) | ||
| JP2009280823A5 (enExample) | ||
| JP2013510429A5 (enExample) | ||
| RU2015122411A (ru) | Композиционные материалы из термореактивной смолы, содержащие межслойные повышающие ударопрочность частицы | |
| WO2013095908A3 (en) | Process for preparing cured epoxy composites | |
| JP2005272722A5 (enExample) | ||
| JP2013504652A5 (enExample) | ||
| JP2007314782A5 (enExample) | ||
| JP2008231237A5 (enExample) | ||
| JP2008111092A5 (enExample) | ||
| WO2018073652A3 (en) | Epoxy resin compositions and fiber-reinforced composite materials prepared therefrom | |
| TW200745194A (en) | Epoxy resin hardener and epoxy resin composition | |
| ATE287934T1 (de) | Wärmehärtende epoxydpulverbeschichtungen die verbesserte entgasungseigenschaften aufweisen | |
| JP2007039567A5 (enExample) | ||
| JP2018188611A5 (enExample) | ||
| JP2009161769A5 (enExample) | ||
| JP2006306954A5 (enExample) | ||
| JP2011184668A5 (enExample) | ||
| Hsieh et al. | Rice husk‐derived porous carbon/silica particles as green filler for electronic package application | |
| CN104194264A (zh) | Pcb用高耐热poss基环氧树脂纳米复合材料及其制备方法 | |
| JP2013530918A5 (enExample) | ||
| JP2006312751A5 (ja) | 銅張積層板用プリプレグ及びそれを用いた銅張積層板 | |
| JP2007009217A5 (enExample) |