JP2016040391A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2016040391A5 JP2016040391A5 JP2015252915A JP2015252915A JP2016040391A5 JP 2016040391 A5 JP2016040391 A5 JP 2016040391A5 JP 2015252915 A JP2015252915 A JP 2015252915A JP 2015252915 A JP2015252915 A JP 2015252915A JP 2016040391 A5 JP2016040391 A5 JP 2016040391A5
- Authority
- JP
- Japan
- Prior art keywords
- resin
- aralkyl type
- mass
- resin composition
- composition according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011342 resin composition Substances 0.000 claims 11
- 239000003822 epoxy resin Substances 0.000 claims 10
- 229920000647 polyepoxide Polymers 0.000 claims 10
- 239000005011 phenolic resin Substances 0.000 claims 9
- 235000010290 biphenyl Nutrition 0.000 claims 8
- 239000004305 biphenyl Substances 0.000 claims 8
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N phenylbenzene Natural products C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 claims 8
- 229910052736 halogen Inorganic materials 0.000 claims 7
- 150000002367 halogens Chemical class 0.000 claims 6
- -1 Maleimide compound Chemical class 0.000 claims 5
- 239000011256 inorganic filler Substances 0.000 claims 3
- 229910003475 inorganic filler Inorganic materials 0.000 claims 3
- 238000010030 laminating Methods 0.000 claims 2
- 239000002184 metal Substances 0.000 claims 2
- 229920005989 resin Polymers 0.000 claims 2
- 239000011347 resin Substances 0.000 claims 2
- 229910001593 boehmite Inorganic materials 0.000 claims 1
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 125000003700 epoxy group Chemical group 0.000 claims 1
- 239000011888 foil Substances 0.000 claims 1
- FAHBNUUHRFUEAI-UHFFFAOYSA-M hydroxidooxidoaluminium Chemical compound O[Al]=O FAHBNUUHRFUEAI-UHFFFAOYSA-M 0.000 claims 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 229920001296 polysiloxane Polymers 0.000 claims 1
- 239000000843 powder Substances 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015252915A JP6183792B2 (ja) | 2010-04-08 | 2015-12-25 | 樹脂組成物、プリプレグおよび積層板 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010089801 | 2010-04-08 | ||
| JP2010089801 | 2010-04-08 | ||
| JP2015252915A JP6183792B2 (ja) | 2010-04-08 | 2015-12-25 | 樹脂組成物、プリプレグおよび積層板 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012509697A Division JP5935690B2 (ja) | 2010-04-08 | 2011-04-07 | 樹脂組成物、プリプレグおよび積層板 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2016040391A JP2016040391A (ja) | 2016-03-24 |
| JP2016040391A5 true JP2016040391A5 (enExample) | 2016-05-12 |
| JP6183792B2 JP6183792B2 (ja) | 2017-08-23 |
Family
ID=44763005
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012509697A Active JP5935690B2 (ja) | 2010-04-08 | 2011-04-07 | 樹脂組成物、プリプレグおよび積層板 |
| JP2015252915A Active JP6183792B2 (ja) | 2010-04-08 | 2015-12-25 | 樹脂組成物、プリプレグおよび積層板 |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012509697A Active JP5935690B2 (ja) | 2010-04-08 | 2011-04-07 | 樹脂組成物、プリプレグおよび積層板 |
Country Status (8)
| Country | Link |
|---|---|
| US (2) | US10212813B2 (enExample) |
| EP (1) | EP2557121B1 (enExample) |
| JP (2) | JP5935690B2 (enExample) |
| KR (2) | KR101784541B1 (enExample) |
| CN (3) | CN105400142A (enExample) |
| SG (2) | SG184504A1 (enExample) |
| TW (2) | TWI658058B (enExample) |
| WO (1) | WO2011126070A1 (enExample) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20130136930A1 (en) | 2010-08-31 | 2013-05-30 | Mitsubishi Gas Chemical Company, Inc. | Resin composition, prepreg, and laminate |
| JP5832444B2 (ja) * | 2010-10-29 | 2015-12-16 | エア・ウォーター株式会社 | 樹脂組成物、それを用いたプリプレグ及び積層板 |
| JP6115225B2 (ja) * | 2013-03-22 | 2017-04-19 | 三菱瓦斯化学株式会社 | 樹脂組成物、プリプレグ、積層板及びプリント配線板 |
| JP6436378B2 (ja) * | 2014-02-06 | 2018-12-12 | 三菱瓦斯化学株式会社 | プリント配線板用樹脂組成物、プリプレグ、積層板及びプリント配線板 |
| JP2015159177A (ja) * | 2014-02-24 | 2015-09-03 | 住友ベークライト株式会社 | 樹脂基板、金属張積層板、プリント配線基板、および半導体装置 |
| JP6602563B2 (ja) * | 2015-06-11 | 2019-11-06 | ソマール株式会社 | 粉体塗料 |
| WO2018003314A1 (ja) * | 2016-06-29 | 2018-01-04 | 三菱瓦斯化学株式会社 | 樹脂組成物、樹脂シート、多層プリント配線板及び半導体装置 |
| CN111263782A (zh) * | 2017-10-27 | 2020-06-09 | 积水化学工业株式会社 | 固化性树脂组合物、固化物、粘接剂和粘接膜 |
| WO2019083006A1 (ja) * | 2017-10-27 | 2019-05-02 | 積水化学工業株式会社 | 硬化性樹脂組成物、硬化物、接着剤、及び、接着フィルム |
| JP6896591B2 (ja) * | 2017-11-14 | 2021-06-30 | Ｅｎｅｏｓ株式会社 | プリプレグ、繊維強化複合材料及び成形体 |
| KR102199879B1 (ko) | 2017-12-27 | 2021-01-07 | 미츠비시 가스 가가쿠 가부시키가이샤 | 수지 조성물, 프리프레그, 적층판, 금속박 피복 적층판, 프린트 배선판 및 다층 프린트 배선판 |
| CN112513180A (zh) * | 2018-08-09 | 2021-03-16 | 三菱瓦斯化学株式会社 | 印刷电路板用树脂组合物、预浸料、层叠板、覆金属箔层叠板、印刷电路板和多层印刷电路板 |
| WO2020121734A1 (ja) * | 2018-12-12 | 2020-06-18 | パナソニックＩｐマネジメント株式会社 | 樹脂組成物、プリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板及びプリント配線板 |
| CN113874416A (zh) * | 2019-05-27 | 2021-12-31 | 三菱瓦斯化学株式会社 | 光刻用下层膜形成用组合物、光刻用下层膜及图案形成方法和纯化方法 |
| CN115551918A (zh) | 2020-05-11 | 2022-12-30 | 日铁化学材料株式会社 | 热固性树脂组合物及其固化物 |
| CN114672166B (zh) * | 2020-12-24 | 2023-08-15 | 广东生益科技股份有限公司 | 一种无卤阻燃型树脂组合物及其制成的预浸料和印制电路用层压板 |
| CN117836346A (zh) | 2021-08-30 | 2024-04-05 | 日铁化学材料株式会社 | 烯丙基醚化合物、树脂组合物及其固化物 |
| JPWO2023063282A1 (enExample) * | 2021-10-15 | 2023-04-20 | ||
| WO2023063277A1 (ja) * | 2021-10-15 | 2023-04-20 | 三菱瓦斯化学株式会社 | 樹脂組成物、積層体、樹脂組成物層付き半導体チップ、樹脂組成物層付き半導体チップ搭載用基板、及び半導体装置 |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH093167A (ja) * | 1995-04-21 | 1997-01-07 | Toshiba Corp | 樹脂組成物及びこれを用いた樹脂封止型半導体装置 |
| JP3611435B2 (ja) | 1997-10-22 | 2005-01-19 | 住友ベークライト株式会社 | 難燃性樹脂組成物、これを用いたプリプレグ及び積層板 |
| JP3460820B2 (ja) | 1999-12-08 | 2003-10-27 | 日本電気株式会社 | 難燃性エポキシ樹脂組成物 |
| TW587094B (en) | 2000-01-17 | 2004-05-11 | Sumitomo Bakelite Co | Flame-retardant resin composition comprising no halogen-containing flame retardant, and prepregs and laminates using such composition |
| JP4027560B2 (ja) * | 2000-03-09 | 2007-12-26 | 住友ベークライト株式会社 | 難燃性樹脂組成物、これを用いたプリプレグ及び積層板 |
| JP2001283639A (ja) | 2000-03-30 | 2001-10-12 | Fujitsu Ltd | ビルドアップ基板用絶縁樹脂組成物 |
| JP2002179772A (ja) * | 2000-12-08 | 2002-06-26 | Mitsui Mining & Smelting Co Ltd | プリント配線板の層間絶縁層構成用の樹脂化合物、その樹脂化合物を用いた絶縁層形成用樹脂シート及び樹脂付銅箔、並びにそれらを用いた銅張積層板 |
| JP3824065B2 (ja) * | 2001-11-06 | 2006-09-20 | 信越化学工業株式会社 | 半導体封止用エポキシ樹脂組成物及び半導体装置 |
| JP2004067968A (ja) | 2002-08-09 | 2004-03-04 | Sumitomo Bakelite Co Ltd | 樹脂組成物、プリプレグおよび積層板 |
| JP2006249343A (ja) | 2005-03-14 | 2006-09-21 | Mitsui Chemicals Inc | エポキシ樹脂組成物および半導体素子収納用パッケージ |
| JP4793565B2 (ja) | 2005-03-24 | 2011-10-12 | 信越化学工業株式会社 | 半導体封止用エポキシ樹脂組成物及び半導体装置 |
| CN101268146B (zh) * | 2005-09-15 | 2012-01-25 | 积水化学工业株式会社 | 树脂组合物、片状成型体、预浸料、固化体、层叠板及多层层叠板 |
| US20070295607A1 (en) * | 2005-11-29 | 2007-12-27 | Ajinomoto Co. Inc | Resin composition for interlayer insulating layer of multi-layer printed wiring board |
| US8084130B2 (en) * | 2006-10-02 | 2011-12-27 | Hitachi Chemical Co., Ltd. | Epoxy resin molding material for sealing and electronic component device |
| JP2008127530A (ja) | 2006-11-24 | 2008-06-05 | Matsushita Electric Works Ltd | エポキシ樹脂組成物、プリプレグ、金属張積層体、プリント配線板、及び多層プリント配線板 |
| JP5263705B2 (ja) * | 2007-02-07 | 2013-08-14 | 三菱瓦斯化学株式会社 | プリプレグ及び積層板 |
| US7601429B2 (en) | 2007-02-07 | 2009-10-13 | Mitsubishi Gas Chemical Company, Inc. | Prepreg and laminate |
| JP5024205B2 (ja) | 2007-07-12 | 2012-09-12 | 三菱瓦斯化学株式会社 | プリプレグ及び積層板 |
| JP2009231790A (ja) * | 2008-02-27 | 2009-10-08 | Ajinomoto Co Inc | 多層プリント配線板の製造方法 |
| JP2010229227A (ja) | 2009-03-26 | 2010-10-14 | Sekisui Chem Co Ltd | エポキシ樹脂組成物、シート状成形体、プリプレグ、硬化体及び積層板 |
| US8815986B2 (en) * | 2009-03-27 | 2014-08-26 | Mitsubishi Gas Chemical Company, Inc. | Method for storing resin solution, and method for producing prepreg and laminate |
-
2011
- 2011-04-07 WO PCT/JP2011/058791 patent/WO2011126070A1/ja not_active Ceased
- 2011-04-07 SG SG2012074712A patent/SG184504A1/en unknown
- 2011-04-07 JP JP2012509697A patent/JP5935690B2/ja active Active
- 2011-04-07 CN CN201510886163.9A patent/CN105400142A/zh active Pending
- 2011-04-07 KR KR1020127028085A patent/KR101784541B1/ko active Active
- 2011-04-07 CN CN201710660698.3A patent/CN107298925B/zh active Active
- 2011-04-07 SG SG10201502708PA patent/SG10201502708PA/en unknown
- 2011-04-07 KR KR1020177027248A patent/KR101876697B1/ko active Active
- 2011-04-07 EP EP11765970.6A patent/EP2557121B1/en active Active
- 2011-04-07 CN CN2011800280083A patent/CN102947388A/zh active Pending
- 2011-04-07 US US13/639,351 patent/US10212813B2/en active Active
- 2011-04-08 TW TW107120387A patent/TWI658058B/zh active
- 2011-04-08 TW TW100112329A patent/TWI642719B/zh active
-
2014
- 2014-12-23 US US14/580,970 patent/US20150111044A1/en not_active Abandoned
-
2015
- 2015-12-25 JP JP2015252915A patent/JP6183792B2/ja active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2012031428A5 (ja) | 樹脂組成物 | |
| RU2017103513A (ru) | Амин для низкоэмиссионных композиций эпоксидных смол | |
| ES2539601T3 (es) | Composición de resina epoxídica 1C con toxicidad reducida | |
| JP2014009322A5 (enExample) | ||
| AR091348A1 (es) | Agente de curado para resina epoxi, composicion de resina epoxi y adhesivo para barrera de gas y laminado con barrera de gas | |
| EP4559963A3 (en) | Polycarbonate resin composition | |
| TW201612232A (en) | Photosensitive resin composition, resist laminate and cured product thereof | |
| RU2015132864A (ru) | Магнитный тонер | |
| JP2010138379A5 (enExample) | ||
| JP2011219736A5 (enExample) | ||
| JP2014513191A5 (enExample) | ||
| JP2015525275A5 (enExample) | ||
| EP2772923A3 (en) | Resin composition, seamless belt, and image forming apparatus | |
| JP2010285602A5 (enExample) | ||
| MY156450A (en) | Curable resin composition, cured product thereof, phenolic resin, epoxy resin, and semiconductor sealing material | |
| JP2015158628A5 (enExample) | ||
| MY183470A (en) | Polyamide composition for led reflection plate, led reflection plate, and light-emitting device including reflection plate | |
| JP2016225551A5 (enExample) | ||
| JP2016509615A (ja) | エポキシ樹脂の硬化剤または可塑剤として有効なスチレン化フェノール | |
| JP2011184668A5 (enExample) | ||
| MY189303A (en) | Polyamide composition for led reflection plate, led reflection plate, and light-emitting device including reflection plate | |
| EP2586806A3 (en) | Modified novolak phenolic resin, making method, and resist composition | |
| MY157470A (en) | Prepreg, metal foil-clad laminate, and printecd wiring board | |
| JP2016069501A5 (enExample) | ||
| JP2015011256A5 (enExample) |