JP2009158787A - 電力半導体装置 - Google Patents
電力半導体装置 Download PDFInfo
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 85
- 229910000679 solder Inorganic materials 0.000 claims abstract description 82
- 229910052751 metal Inorganic materials 0.000 claims abstract description 38
- 239000002184 metal Substances 0.000 claims abstract description 38
- 230000004907 flux Effects 0.000 abstract description 12
- 238000005201 scrubbing Methods 0.000 description 7
- 230000004048 modification Effects 0.000 description 6
- 238000012986 modification Methods 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- JRBRVDCKNXZZGH-UHFFFAOYSA-N alumane;copper Chemical compound [AlH3].[Cu] JRBRVDCKNXZZGH-UHFFFAOYSA-N 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000002309 gasification Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
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- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
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- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
- H01L2224/45124—Aluminium (Al) as principal constituent
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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Abstract
【解決手段】放熱板の一方主面に絶縁層を介し載置される金属パターン上に電力半導体素子が半田接合され、前記金属パターンは半田レジストによって電力半導体素子搭載領域と配線中継領域とに隔てられ、前記半田レジストは溶融半田の逃げ部分を有する形状であることを特徴とする電力半導体装置である。
【選択図】 図1
Description
スクラブ作業に際して溶融半田やフラックスの飛び散りをも防止することができ、ワイヤボンド不良の増加を防ぐといった効果がある。
また、前記溶融半田の逃げ部分は、あらかじめ設定した半田レジストの形状によって実現するため、余分な工数や材料を追加することなく、低コストにて実現可能であるといった効果がある。
この発明を実施するための実施の形態1における電力半導体装置について以下説明する。電力半導体装置の内部平面図を図1に、本実施の形態1における電力半導体装置の回路図を図2に示す。同図において、各電極端子2a〜2c、IGBT9a〜9dおよびダイオード10a〜10dは、図1に示す各電極端子2a〜2c、IGBT9a〜9dおよびダイオード10a〜10dとそれぞれ対応している。
この発明を実施するための実施の形態2における電力半導体装置の内部平面図を図5に示す。図5において、前記実施の形態1と同じ構成には同じ符号を付し、重複する説明は省略する。
この発明を実施するための実施の形態3における電力半導体装置の内部平面図を図7に示す。図7において、前記実施の形態1、2と同じ構成には同じ符号を付し重複する説明は省略する。
Claims (6)
- 表面側および裏面側に電極を有する少なくとも一つの電力半導体素子と、放熱板と、絶縁層と、電極端子と、前記絶縁層を介して前記放熱板の一方主面に載置される金属パターンと、前記金属パターンを、電力半導体素子搭載領域と配線中継領域とに隔てる半田レジストとを有し、前記電力半導体素子の裏面側電極は前記電力素子搭載領域に半田接合され、
前記電極端子は前記配線中継領域または前記電力半導体素子の表面側電極とボンディングワイヤにて電気的に接続され、前記半田レジストは、溶融半田の逃げ部分を有する形状であることを特徴とする電力半導体装置。 - 前記溶融半田の逃げ部分においては、前記半田レジストと前記電力半導体素子との間隔が、前記電力半導体と前記電力素子搭載領域とを接合している半田層の厚さより大であり、前記溶融半田の逃げ部分以外においては、前記半田レジストと前記電力半導体との間隔が、前記電力半導体と前記電力素子搭載領域とを接合している半田層の厚さ以下であることを特徴とする請求項1に記載の電力半導体装置。
- 前記溶融半田の逃げ部分は、前記電力半導体素子搭載領域の外縁部の角部を除いた直線部分の少なくとも1箇所に設けられることを特徴とする請求項2に記載の電力半導体素子。
- 前記溶融半田の逃げ部分は、前記電力半導体素子搭載領域の外縁部の角部の少なくとも1箇所に設けられることを特徴とする請求項2に記載の電力半導体素子。
- 前記溶融半田の逃げ部分は、前記電力半導体素子搭載領域の外縁部に複数個設けられることを特徴とする請求項2に記載の電力半導体素子。
- 前記溶融半田の逃げ部分として、隣り合う前記電力半導体素子搭載領域間の前記半田レジストを部分的に除去したことを特徴とする請求項1に記載の電力半導体素子。
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JP2007336769A JP4924411B2 (ja) | 2007-12-27 | 2007-12-27 | 電力半導体装置 |
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JP4924411B2 JP4924411B2 (ja) | 2012-04-25 |
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Cited By (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010010574A (ja) * | 2008-06-30 | 2010-01-14 | Nichicon Corp | 半導体装置およびその製造方法 |
DE102012204085B4 (de) * | 2011-03-17 | 2014-01-23 | Kabushiki Kaisha Toshiba | Halbleitervorrichtung mit Wärmeverteiler und Lotlage und Verfahren zum Herstellen einer solchen |
US8664765B2 (en) | 2010-12-03 | 2014-03-04 | Fuji Electric Co., Ltd. | Semiconductor device |
EP2846356A2 (en) | 2013-09-02 | 2015-03-11 | Renesas Electronics Corporation | Electronic device |
JP2018164047A (ja) * | 2017-03-27 | 2018-10-18 | 住友電工デバイス・イノベーション株式会社 | 電子装置およびその製造方法 |
DE212018000087U1 (de) | 2017-11-20 | 2019-05-10 | Rohm Co., Ltd. | Halbleitervorrichtung |
DE212019000088U1 (de) | 2018-08-31 | 2019-12-12 | Rohm Co., Ltd. | Halbleiterbauteil |
DE212020000048U1 (de) | 2019-01-16 | 2020-05-25 | Rohm Co., Ltd. | Halbleiterbauteil |
DE112019005313T5 (de) | 2018-10-24 | 2021-07-22 | Rohm Co., Ltd. | Halbleiterbauteil |
DE212020000492U1 (de) | 2019-07-02 | 2021-07-23 | Rohm Co., Ltd. | Halbleiterbauteil |
CN113287195A (zh) * | 2019-01-16 | 2021-08-20 | 罗姆股份有限公司 | 半导体装置 |
DE112019006032T5 (de) | 2018-12-03 | 2021-10-07 | Rohm Co., Ltd. | Halbleiterbauteil |
DE112020002520T5 (de) | 2019-05-24 | 2022-03-17 | Rohm Co., Ltd. | Halbleiterbauteil |
DE212021000230U1 (de) | 2020-10-05 | 2022-05-02 | Rohm Co., Ltd. | Halbleiterbauteil |
DE112021001168T5 (de) | 2020-03-19 | 2022-12-08 | Rohm Co., Ltd. | Halbleiterbauteil |
DE112021005737T5 (de) | 2020-12-03 | 2023-08-10 | Rohm Co., Ltd. | Halbleiterbauteil |
DE112022000361T5 (de) | 2021-02-03 | 2023-10-12 | Rohm Co., Ltd. | Halbleiterbauelement |
US11955451B2 (en) | 2020-10-14 | 2024-04-09 | Rohm Co., Ltd. | Semiconductor module |
US11955414B2 (en) | 2020-10-14 | 2024-04-09 | Rohm Co., Ltd. | Semiconductor module |
US11961790B2 (en) | 2020-10-14 | 2024-04-16 | Rohm Co., Ltd. | Semiconductor module |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH038242U (ja) * | 1990-05-28 | 1991-01-25 | ||
JPH11111737A (ja) * | 1997-09-30 | 1999-04-23 | Mitsubishi Electric Corp | 半導体装置 |
JP2002353255A (ja) * | 2001-05-30 | 2002-12-06 | Moric Co Ltd | 半導体チップ半田付け用ランドパターン |
JP2005079486A (ja) * | 2003-09-03 | 2005-03-24 | Mitsubishi Electric Corp | 半導体装置およびその製造方法 |
JP2006049777A (ja) * | 2004-08-09 | 2006-02-16 | Mitsubishi Electric Corp | 半導体集積装置 |
-
2007
- 2007-12-27 JP JP2007336769A patent/JP4924411B2/ja active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH038242U (ja) * | 1990-05-28 | 1991-01-25 | ||
JPH11111737A (ja) * | 1997-09-30 | 1999-04-23 | Mitsubishi Electric Corp | 半導体装置 |
JP2002353255A (ja) * | 2001-05-30 | 2002-12-06 | Moric Co Ltd | 半導体チップ半田付け用ランドパターン |
JP2005079486A (ja) * | 2003-09-03 | 2005-03-24 | Mitsubishi Electric Corp | 半導体装置およびその製造方法 |
JP2006049777A (ja) * | 2004-08-09 | 2006-02-16 | Mitsubishi Electric Corp | 半導体集積装置 |
Cited By (34)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010010574A (ja) * | 2008-06-30 | 2010-01-14 | Nichicon Corp | 半導体装置およびその製造方法 |
US8664765B2 (en) | 2010-12-03 | 2014-03-04 | Fuji Electric Co., Ltd. | Semiconductor device |
DE102012204085B4 (de) * | 2011-03-17 | 2014-01-23 | Kabushiki Kaisha Toshiba | Halbleitervorrichtung mit Wärmeverteiler und Lotlage und Verfahren zum Herstellen einer solchen |
US8653651B2 (en) | 2011-03-17 | 2014-02-18 | Kabushiki Kaisha Toshiba | Semiconductor apparatus and method for manufacturing the same |
EP2846356A2 (en) | 2013-09-02 | 2015-03-11 | Renesas Electronics Corporation | Electronic device |
US9153563B2 (en) | 2013-09-02 | 2015-10-06 | Renesas Electronics Corporation | Electronic device |
JP2018164047A (ja) * | 2017-03-27 | 2018-10-18 | 住友電工デバイス・イノベーション株式会社 | 電子装置およびその製造方法 |
US11211312B2 (en) | 2017-11-20 | 2021-12-28 | Rohm Co., Ltd. | Semiconductor device |
DE212018000087U1 (de) | 2017-11-20 | 2019-05-10 | Rohm Co., Ltd. | Halbleitervorrichtung |
DE112018005978T5 (de) | 2017-11-20 | 2020-08-06 | Rohm Co., Ltd. | Halbleitervorrichtung |
US11670572B2 (en) | 2017-11-20 | 2023-06-06 | Rohm Co., Ltd. | Semiconductor device |
DE212019000088U1 (de) | 2018-08-31 | 2019-12-12 | Rohm Co., Ltd. | Halbleiterbauteil |
US11728237B2 (en) | 2018-10-24 | 2023-08-15 | Rohm Co., Ltd. | Semiconductor device with a supporting member and bonded metal layers |
DE112019005313T5 (de) | 2018-10-24 | 2021-07-22 | Rohm Co., Ltd. | Halbleiterbauteil |
DE112019006032T5 (de) | 2018-12-03 | 2021-10-07 | Rohm Co., Ltd. | Halbleiterbauteil |
US11972997B2 (en) | 2018-12-03 | 2024-04-30 | Rohm Co., Ltd. | Semiconductor device |
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DE212020000048U1 (de) | 2019-01-16 | 2020-05-25 | Rohm Co., Ltd. | Halbleiterbauteil |
CN113287195A (zh) * | 2019-01-16 | 2021-08-20 | 罗姆股份有限公司 | 半导体装置 |
CN113287195B (zh) * | 2019-01-16 | 2023-11-10 | 罗姆股份有限公司 | 半导体装置 |
DE112020002520T5 (de) | 2019-05-24 | 2022-03-17 | Rohm Co., Ltd. | Halbleiterbauteil |
DE112020003885T5 (de) | 2019-07-02 | 2022-04-28 | Rohm Co., Ltd. | Halbleiterbauteil |
DE212020000492U1 (de) | 2019-07-02 | 2021-07-23 | Rohm Co., Ltd. | Halbleiterbauteil |
DE112021001168T5 (de) | 2020-03-19 | 2022-12-08 | Rohm Co., Ltd. | Halbleiterbauteil |
DE212021000230U1 (de) | 2020-10-05 | 2022-05-02 | Rohm Co., Ltd. | Halbleiterbauteil |
DE112021002921B4 (de) | 2020-10-05 | 2024-02-01 | Rohm Co., Ltd. | Halbleiterbauteil |
DE112021002921T5 (de) | 2020-10-05 | 2023-03-16 | Rohm Co., Ltd. | Halbleiterbauteil |
US11955451B2 (en) | 2020-10-14 | 2024-04-09 | Rohm Co., Ltd. | Semiconductor module |
US11955414B2 (en) | 2020-10-14 | 2024-04-09 | Rohm Co., Ltd. | Semiconductor module |
US11955413B2 (en) | 2020-10-14 | 2024-04-09 | Rohm Co., Ltd. | Semiconductor module |
US11955452B2 (en) | 2020-10-14 | 2024-04-09 | Rohm Co., Ltd. | Semiconductor module |
US11961790B2 (en) | 2020-10-14 | 2024-04-16 | Rohm Co., Ltd. | Semiconductor module |
DE112021005737T5 (de) | 2020-12-03 | 2023-08-10 | Rohm Co., Ltd. | Halbleiterbauteil |
DE112022000361T5 (de) | 2021-02-03 | 2023-10-12 | Rohm Co., Ltd. | Halbleiterbauelement |
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