JP2009151297A - 光学装置および光学装置の製造方法 - Google Patents
光学装置および光学装置の製造方法 Download PDFInfo
- Publication number
- JP2009151297A JP2009151297A JP2008305984A JP2008305984A JP2009151297A JP 2009151297 A JP2009151297 A JP 2009151297A JP 2008305984 A JP2008305984 A JP 2008305984A JP 2008305984 A JP2008305984 A JP 2008305984A JP 2009151297 A JP2009151297 A JP 2009151297A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- optical
- optical device
- light transmissive
- wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000003287 optical effect Effects 0.000 title claims abstract description 115
- 238000004519 manufacturing process Methods 0.000 title claims description 14
- 238000000034 method Methods 0.000 title description 17
- 239000000758 substrate Substances 0.000 claims abstract description 125
- 239000002241 glass-ceramic Substances 0.000 claims description 30
- 239000004020 conductor Substances 0.000 claims description 29
- 239000004065 semiconductor Substances 0.000 claims description 25
- 238000007789 sealing Methods 0.000 claims description 15
- 239000002131 composite material Substances 0.000 claims description 13
- 238000010304 firing Methods 0.000 claims description 9
- 238000010030 laminating Methods 0.000 claims description 3
- 230000035699 permeability Effects 0.000 abstract 1
- 239000011521 glass Substances 0.000 description 22
- 239000000843 powder Substances 0.000 description 18
- 239000000919 ceramic Substances 0.000 description 10
- 239000000463 material Substances 0.000 description 6
- 229910000679 solder Inorganic materials 0.000 description 6
- 238000002844 melting Methods 0.000 description 5
- 230000008018 melting Effects 0.000 description 5
- 238000007650 screen-printing Methods 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 239000011230 binding agent Substances 0.000 description 4
- 229910052878 cordierite Inorganic materials 0.000 description 4
- JSKIRARMQDRGJZ-UHFFFAOYSA-N dimagnesium dioxido-bis[(1-oxido-3-oxo-2,4,6,8,9-pentaoxa-1,3-disila-5,7-dialuminabicyclo[3.3.1]nonan-7-yl)oxy]silane Chemical compound [Mg++].[Mg++].[O-][Si]([O-])(O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2)O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2 JSKIRARMQDRGJZ-UHFFFAOYSA-N 0.000 description 4
- 239000002002 slurry Substances 0.000 description 4
- 229910004298 SiO 2 Inorganic materials 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000003960 organic solvent Substances 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 3
- 239000003566 sealing material Substances 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 2
- 229910020220 Pb—Sn Inorganic materials 0.000 description 2
- CNLWCVNCHLKFHK-UHFFFAOYSA-N aluminum;lithium;dioxido(oxo)silane Chemical compound [Li+].[Al+3].[O-][Si]([O-])=O.[O-][Si]([O-])=O CNLWCVNCHLKFHK-UHFFFAOYSA-N 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 238000005459 micromachining Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 239000006104 solid solution Substances 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- 229910000500 β-quartz Inorganic materials 0.000 description 2
- 229910052644 β-spodumene Inorganic materials 0.000 description 2
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 229910007637 SnAg Inorganic materials 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 229910002065 alloy metal Inorganic materials 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000004581 coalescence Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- -1 polypropylene carbonate Polymers 0.000 description 1
- 229920000379 polypropylene carbonate Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical class O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0032—Packages or encapsulation
- B81B7/007—Interconnections between the MEMS and external electrical signals
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00261—Processes for packaging MEMS devices
- B81C1/00317—Packaging optical devices
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
- G02B26/0833—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD
- G02B26/0841—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD the reflecting element being moved or deformed by electrostatic means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/146—Mixed devices
- H01L2924/1461—MEMS
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Micromachines (AREA)
- Mechanical Light Control Or Optical Switches (AREA)
- Led Device Packages (AREA)
- Light Receiving Elements (AREA)
Abstract
【解決手段】光学装置1は、表面に光学素子2が設けられた素子基板3と、素子基板3の光学素子2が設けられた表面に接続され、光学素子2に対応する位置に貫通孔4を有する配線基板5と、貫通孔4を覆うように配線基板5に接続された光透過性部材6とを有する。また、配線基板4の光透過性部材6が接続される表面に、配線基板5に電気的に接続された外部接続端子8が設けられる。
【選択図】図1
Description
図4は、光学装置1の構成例を示す図であり、(a)は平面透視図、(b)は、(a)のA−A線における断面図である。図4に示すように、本発明の実施の形態による光学装置1は、表面に光MEMS2が設けられた素子基板3と、素子基板3の光MEMS2が設けられた表面に接続され、光MEMS2に対応する位置に貫通孔4を有する配線基板5と、貫通孔4を覆うように配線基板5に接続された光透過性部材6とを有する。ここで、光透過性部材6は、配線基板5に封止部材7を介して接続される。これにより、光MEMS2は、気密封止される。素子基板3は、例えば半導体基板であり、その表面に、マイクロマシニング技術を用いることにより光MEMS2が形成されている。
2 光MEMS
3 素子基板
4 貫通孔
5 配線基板
6 透光性部材
7 封止部材
8 外部接続端子
9 絶縁基板
10 配線導体
Claims (5)
- 表面に光学素子が設けられた素子基板と、
前記素子基板の前記光学素子が設けられた表面に接続され、前記光学素子に対応する位置に貫通孔を有する配線基板と、
前記貫通孔を覆うように前記配線基板に接続された光透過性部材と
を有する光学装置。 - 前記配線基板の前記光透過性部材が接続される表面に、前記配線基板に電気的に接続された外部接続端子を有する請求項1に記載の光学装置。
- 前記配線基板と前記光透過性部材とを接続するとともに、前記光学素子を封止する封止部材を有する請求項1または請求項2に記載の光学装置。
- 前記配線基板は、絶縁層が積層されてなる積層体と、前記積層体の内部に設けられた配線導体とを有する請求項1から請求項3のいずれかに記載の光学装置。
- 複数のガラスセラミックグリーンシートを準備する工程と、
前記複数のガラスセラミックグリーンシートに穴部を形成する工程と、
少なくとも1つの前記ガラスセラミックグリーンシートに焼成後配線導体となる導体部を形成する工程と、
前記複数のガラスセラミックグリーンシートを積層して、貫通孔を有するグリーンシート積層体を形成する工程と、
半導体基板と前記グリーンシート積層体とを密着させる工程と、
前記グリーンシート積層体を焼成して複合基板を形成する工程と、
前記貫通孔に露出した半導体基板の表面に光学素子を形成する工程と、
光透過性部材を準備する工程と、
前記光学素子と前記光透過性部材とを対向させて、前記複合基板と前記光透過性部材とを接続する工程と
を有する光学装置の製造方法。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008305984A JP5349024B2 (ja) | 2007-11-29 | 2008-12-01 | 光学装置および光学装置の製造方法 |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007308274 | 2007-11-29 | ||
JP2007308274 | 2007-11-29 | ||
JP2008305984A JP5349024B2 (ja) | 2007-11-29 | 2008-12-01 | 光学装置および光学装置の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009151297A true JP2009151297A (ja) | 2009-07-09 |
JP5349024B2 JP5349024B2 (ja) | 2013-11-20 |
Family
ID=40678694
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008305984A Expired - Fee Related JP5349024B2 (ja) | 2007-11-29 | 2008-12-01 | 光学装置および光学装置の製造方法 |
JP2009543901A Expired - Fee Related JP5292307B2 (ja) | 2007-11-29 | 2008-12-01 | 光学装置、封止用基板および光学装置の製造方法 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009543901A Expired - Fee Related JP5292307B2 (ja) | 2007-11-29 | 2008-12-01 | 光学装置、封止用基板および光学装置の製造方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US8204352B2 (ja) |
EP (1) | EP2239619A4 (ja) |
JP (2) | JP5349024B2 (ja) |
WO (1) | WO2009069807A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015046552A (ja) * | 2013-08-29 | 2015-03-12 | 京セラ株式会社 | 電子装置、多数個取り枠体および多数個取り電子装置 |
JP2016531323A (ja) * | 2013-08-28 | 2016-10-06 | カール・ツァイス・エスエムティー・ゲーエムベーハー | 光学コンポーネント |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0799214A (ja) * | 1993-05-28 | 1995-04-11 | Toshiba Corp | 光電変換素子の実装装置及びその製造方法 |
JP2001308225A (ja) * | 2000-02-22 | 2001-11-02 | Texas Instr Inc <Ti> | 保護されたマイクロメカニカル・デバイスのフリップ・チップ組立体 |
JP2002141430A (ja) * | 2000-10-31 | 2002-05-17 | Kyocera Corp | デジタルマイクロミラーデバイス収納用パッケージ |
JP2004287215A (ja) * | 2003-03-24 | 2004-10-14 | Fuji Photo Film Co Ltd | 透過型光変調装置及びその実装方法 |
JP2005317564A (ja) * | 2004-04-26 | 2005-11-10 | Matsushita Electric Ind Co Ltd | 光学デバイスおよびその製造方法 |
JP2006285230A (ja) * | 2005-04-01 | 2006-10-19 | Samsung Electro Mech Co Ltd | 光変調器モジュールパッケージ構造 |
JP2006301153A (ja) * | 2005-04-19 | 2006-11-02 | Sony Corp | 回折格子−光変調装置組立体 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0630056B1 (en) * | 1993-05-28 | 1998-02-18 | Toshiba Ave Co., Ltd | Use of anisotropically conductive film for connecting leads of wiring board with electrode pads of photoelectric converting device and mounting method of the device |
US6661084B1 (en) * | 2000-05-16 | 2003-12-09 | Sandia Corporation | Single level microelectronic device package with an integral window |
JP2002076313A (ja) * | 2000-08-28 | 2002-03-15 | Canon Inc | 固体撮像装置 |
JP4342174B2 (ja) * | 2002-12-27 | 2009-10-14 | 新光電気工業株式会社 | 電子デバイス及びその製造方法 |
US20040232535A1 (en) * | 2003-05-22 | 2004-11-25 | Terry Tarn | Microelectromechanical device packages with integral heaters |
JP4170950B2 (ja) * | 2003-10-10 | 2008-10-22 | 松下電器産業株式会社 | 光学デバイスおよびその製造方法 |
EP1978555B1 (en) * | 2005-12-26 | 2016-12-28 | Kyocera Corporation | Microelectronic machine and method for manufacturing same |
US8138588B2 (en) * | 2006-12-21 | 2012-03-20 | Texas Instruments Incorporated | Package stiffener and a packaged device using the same |
-
2008
- 2008-12-01 JP JP2008305984A patent/JP5349024B2/ja not_active Expired - Fee Related
- 2008-12-01 WO PCT/JP2008/071829 patent/WO2009069807A1/ja active Application Filing
- 2008-12-01 JP JP2009543901A patent/JP5292307B2/ja not_active Expired - Fee Related
- 2008-12-01 US US12/745,634 patent/US8204352B2/en not_active Expired - Fee Related
- 2008-12-01 EP EP08853336.9A patent/EP2239619A4/en not_active Withdrawn
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0799214A (ja) * | 1993-05-28 | 1995-04-11 | Toshiba Corp | 光電変換素子の実装装置及びその製造方法 |
JP2001308225A (ja) * | 2000-02-22 | 2001-11-02 | Texas Instr Inc <Ti> | 保護されたマイクロメカニカル・デバイスのフリップ・チップ組立体 |
JP2002141430A (ja) * | 2000-10-31 | 2002-05-17 | Kyocera Corp | デジタルマイクロミラーデバイス収納用パッケージ |
JP2004287215A (ja) * | 2003-03-24 | 2004-10-14 | Fuji Photo Film Co Ltd | 透過型光変調装置及びその実装方法 |
JP2005317564A (ja) * | 2004-04-26 | 2005-11-10 | Matsushita Electric Ind Co Ltd | 光学デバイスおよびその製造方法 |
JP2006285230A (ja) * | 2005-04-01 | 2006-10-19 | Samsung Electro Mech Co Ltd | 光変調器モジュールパッケージ構造 |
JP2006301153A (ja) * | 2005-04-19 | 2006-11-02 | Sony Corp | 回折格子−光変調装置組立体 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016531323A (ja) * | 2013-08-28 | 2016-10-06 | カール・ツァイス・エスエムティー・ゲーエムベーハー | 光学コンポーネント |
JP2015046552A (ja) * | 2013-08-29 | 2015-03-12 | 京セラ株式会社 | 電子装置、多数個取り枠体および多数個取り電子装置 |
Also Published As
Publication number | Publication date |
---|---|
JP5349024B2 (ja) | 2013-11-20 |
WO2009069807A1 (ja) | 2009-06-04 |
EP2239619A4 (en) | 2013-04-24 |
US8204352B2 (en) | 2012-06-19 |
US20100310216A1 (en) | 2010-12-09 |
JPWO2009069807A1 (ja) | 2011-04-21 |
EP2239619A1 (en) | 2010-10-13 |
JP5292307B2 (ja) | 2013-09-18 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4938779B2 (ja) | 微小電子機械機構装置およびその製造方法 | |
JP4675973B2 (ja) | 微小電子機械装置およびその製造方法ならびに配線基板 | |
US20160297675A1 (en) | Semiconductor device, and method of manufacturing device | |
WO2008066087A1 (fr) | Dispositif de structure fine pour fabrication du dispositif de structure fine et substrat de scellement | |
JP4619201B2 (ja) | ウェハレベル気密パッケージの製造方法および気密パッケージ | |
JP5349024B2 (ja) | 光学装置および光学装置の製造方法 | |
JP4268480B2 (ja) | 電子部品封止用基板およびそれを用いた電子装置 | |
JP2005262382A (ja) | 電子装置およびその製造方法 | |
JP3842751B2 (ja) | 電子部品封止用基板およびそれを用いた電子装置の製造方法 | |
JP2009238976A (ja) | セラミック積層基板およびセラミック積層体の製造方法 | |
JP4116954B2 (ja) | 電子部品封止用基板およびそれを用いた電子装置 | |
JP2007335468A (ja) | 中空封止素子およびその製造方法 | |
JP4731291B2 (ja) | 電子部品封止用基板およびそれを用いた電子装置、電子装置の製造方法 | |
JP2005212016A (ja) | 電子部品封止用基板および多数個取り用電子部品封止用基板ならびに電子装置の製造方法 | |
JP2002228891A (ja) | 光通信用パッケージ及びその製造方法 | |
JP4404647B2 (ja) | 電子装置および電子部品封止用基板 | |
JPWO2009016862A1 (ja) | 複合基板および複合基板を用いた機能デバイス、並びに複合基板および機能デバイスの製造方法 | |
JP6815875B2 (ja) | 配線基板および電子部品収納用パッケージおよび電子装置 | |
JP2006041312A (ja) | 多数個取り電子部品封止用基板および電子装置ならびに電子装置の製造方法 | |
JP2002311303A (ja) | 光通信用パッケージ | |
JP2009160677A (ja) | Memsおよびmems製造方法 | |
JP2006295213A (ja) | 電子部品封止用基板および多数個取り形態の電子部品封止用基板、並びに電子装置 | |
JP2018176421A (ja) | デバイス | |
JP2009160674A (ja) | Mems製造方法およびmems | |
JP2010010360A (ja) | 電子装置および電子装置の製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20110818 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20120724 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20120807 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20121005 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20130507 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20130701 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20130723 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20130820 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5349024 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
LAPS | Cancellation because of no payment of annual fees |