JP2009105068A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2009105068A5 JP2009105068A5 JP2009027076A JP2009027076A JP2009105068A5 JP 2009105068 A5 JP2009105068 A5 JP 2009105068A5 JP 2009027076 A JP2009027076 A JP 2009027076A JP 2009027076 A JP2009027076 A JP 2009027076A JP 2009105068 A5 JP2009105068 A5 JP 2009105068A5
- Authority
- JP
- Japan
- Prior art keywords
- electro
- optical device
- layer
- conductive layer
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000010410 layer Substances 0.000 claims 50
- 239000000758 substrate Substances 0.000 claims 14
- 239000010936 titanium Substances 0.000 claims 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 6
- 229910045601 alloy Inorganic materials 0.000 claims 6
- 239000000956 alloy Substances 0.000 claims 6
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims 6
- 239000011241 protective layer Substances 0.000 claims 6
- 229910021332 silicide Inorganic materials 0.000 claims 6
- 238000004519 manufacturing process Methods 0.000 claims 5
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims 4
- 229910052750 molybdenum Inorganic materials 0.000 claims 4
- 239000011733 molybdenum Substances 0.000 claims 4
- 229910052715 tantalum Inorganic materials 0.000 claims 4
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims 4
- 229910052719 titanium Inorganic materials 0.000 claims 4
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims 4
- 229910052721 tungsten Inorganic materials 0.000 claims 4
- 239000010937 tungsten Substances 0.000 claims 4
- 229910052782 aluminium Inorganic materials 0.000 claims 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 2
- 239000010949 copper Substances 0.000 claims 2
- 229910052759 nickel Inorganic materials 0.000 claims 2
- 229910052697 platinum Inorganic materials 0.000 claims 2
- 238000007789 sealing Methods 0.000 claims 2
- 235000012239 silicon dioxide Nutrition 0.000 claims 2
- 239000000377 silicon dioxide Substances 0.000 claims 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 claims 1
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- VSZWPYCFIRKVQL-UHFFFAOYSA-N selanylidenegallium;selenium Chemical compound [Se].[Se]=[Ga].[Se]=[Ga] VSZWPYCFIRKVQL-UHFFFAOYSA-N 0.000 claims 1
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 claims 1
- 238000004544 sputter deposition Methods 0.000 claims 1
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009027076A JP2009105068A (ja) | 2009-02-09 | 2009-02-09 | 電気光学装置、電気光学装置の製造方法及び電子機器 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009027076A JP2009105068A (ja) | 2009-02-09 | 2009-02-09 | 電気光学装置、電気光学装置の製造方法及び電子機器 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003198128A Division JP4380242B2 (ja) | 2003-07-16 | 2003-07-16 | 電気光学装置、電気光学装置の製造方法及び電子機器 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2009105068A JP2009105068A (ja) | 2009-05-14 |
| JP2009105068A5 true JP2009105068A5 (enExample) | 2009-08-06 |
Family
ID=40706501
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009027076A Withdrawn JP2009105068A (ja) | 2009-02-09 | 2009-02-09 | 電気光学装置、電気光学装置の製造方法及び電子機器 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2009105068A (enExample) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5685855B2 (ja) * | 2009-09-08 | 2015-03-18 | 株式会社リコー | 表示装置および表示装置の製造方法 |
| JP5341701B2 (ja) * | 2009-10-02 | 2013-11-13 | キヤノン株式会社 | 表示装置およびデジタルカメラ |
| KR101889918B1 (ko) | 2010-12-14 | 2018-09-21 | 삼성디스플레이 주식회사 | 유기 발광 디스플레이 장치 및 이의 제조 방법 |
| TWI555436B (zh) * | 2011-04-08 | 2016-10-21 | 半導體能源研究所股份有限公司 | 發光裝置及其製造方法 |
| JP6098017B2 (ja) * | 2014-02-17 | 2017-03-22 | エバーディスプレイ オプトロニクス（シャンハイ） リミテッド | 薄膜トランジスタアレイ基板及びその製造方法 |
| KR102769206B1 (ko) | 2016-12-29 | 2025-02-20 | 엘지디스플레이 주식회사 | 보조 전극을 포함하는 디스플레이 장치 |
| JP7179517B2 (ja) * | 2018-03-01 | 2022-11-29 | Ｔｉａｎｍａ Ｊａｐａｎ株式会社 | 表示装置 |
| US20230110063A1 (en) * | 2020-03-03 | 2023-04-13 | Sony Group Corporation | Display device, method of manufacturing display device, and electronic device |
| CN121080153A (zh) * | 2023-05-17 | 2025-12-05 | 索尼半导体解决方案公司 | 显示装置及电子设备 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002164181A (ja) * | 2000-09-18 | 2002-06-07 | Semiconductor Energy Lab Co Ltd | 表示装置及びその作製方法 |
| JP3951701B2 (ja) * | 2001-12-18 | 2007-08-01 | セイコーエプソン株式会社 | 表示装置の製造方法、電子機器の製造方法、表示装置および電子機器 |
| JP4095830B2 (ja) * | 2002-01-29 | 2008-06-04 | 統寶光電股▲ふん▼有限公司 | 有機ｌｅｄデバイスおよびその製造方法 |
-
2009
- 2009-02-09 JP JP2009027076A patent/JP2009105068A/ja not_active Withdrawn
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2009105068A5 (enExample) | ||
| CN101645488B (zh) | 有机薄膜晶体管、其制造方法和电子装置 | |
| TWI574398B (zh) | 顯示裝置 | |
| JP4279391B2 (ja) | 発光ディスプレイパネル及びその製造方法 | |
| JP2018501650A5 (enExample) | ||
| JP2007013120A5 (enExample) | ||
| JP2014104600A5 (enExample) | ||
| JP2015106638A5 (enExample) | ||
| KR102138280B1 (ko) | 표시 패널 및 이를 구비하는 표시 장치 | |
| JP2006310799A5 (enExample) | ||
| JP2010118637A5 (ja) | 半導体装置 | |
| WO2022077714A1 (zh) | 一种阵列基板及其制备方法、显示面板 | |
| JP6788847B2 (ja) | キャパシタ | |
| JP2008066678A5 (enExample) | ||
| CN103681284B (zh) | 形成低电阻线的方法和使用该方法制造薄膜晶体管的方法 | |
| JP7528557B2 (ja) | 量子デバイス及びその製造方法 | |
| JP2007158129A5 (enExample) | ||
| JP2005311299A5 (enExample) | ||
| JP2006119564A5 (enExample) | ||
| CN112366223A (zh) | Oled面板的制作方法、oled面板 | |
| CN103698952B (zh) | 一种阵列基板及其制备方法 | |
| JP2010153487A5 (enExample) | ||
| US20050277281A1 (en) | Compliant interconnect and method of formation | |
| JP2008091457A (ja) | 半導体装置及び半導体装置の製造方法 | |
| CN111051975A (zh) | 驱动基板及其制备方法、发光基板和显示装置 |