JP2009065201A5 - - Google Patents
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- Publication number
- JP2009065201A5 JP2009065201A5 JP2008297133A JP2008297133A JP2009065201A5 JP 2009065201 A5 JP2009065201 A5 JP 2009065201A5 JP 2008297133 A JP2008297133 A JP 2008297133A JP 2008297133 A JP2008297133 A JP 2008297133A JP 2009065201 A5 JP2009065201 A5 JP 2009065201A5
- Authority
- JP
- Japan
- Prior art keywords
- island
- manufacturing
- semiconductor device
- islands
- element mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims 8
- 238000004519 manufacturing process Methods 0.000 claims 5
- 239000011159 matrix material Substances 0.000 claims 2
- 239000011347 resin Substances 0.000 claims 2
- 229920005989 resin Polymers 0.000 claims 2
- 239000002184 metal Substances 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 238000004806 packaging method and process Methods 0.000 claims 1
- 238000009751 slip forming Methods 0.000 claims 1
- 239000010409 thin film Substances 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008297133A JP4784945B2 (ja) | 2008-11-20 | 2008-11-20 | 半導体装置の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008297133A JP4784945B2 (ja) | 2008-11-20 | 2008-11-20 | 半導体装置の製造方法 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006243624A Division JP4383436B2 (ja) | 2006-09-08 | 2006-09-08 | 半導体装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2009065201A JP2009065201A (ja) | 2009-03-26 |
| JP2009065201A5 true JP2009065201A5 (cg-RX-API-DMAC7.html) | 2010-10-14 |
| JP4784945B2 JP4784945B2 (ja) | 2011-10-05 |
Family
ID=40559433
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008297133A Expired - Fee Related JP4784945B2 (ja) | 2008-11-20 | 2008-11-20 | 半導体装置の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4784945B2 (cg-RX-API-DMAC7.html) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6744149B2 (ja) * | 2016-06-20 | 2020-08-19 | ローム株式会社 | 半導体装置およびその製造方法 |
| JP7268988B2 (ja) * | 2018-11-08 | 2023-05-08 | 新光電気工業株式会社 | 電子部品及び電子部品の製造方法 |
| CN116313940B (zh) * | 2023-05-18 | 2023-08-11 | 上海聚跃检测技术有限公司 | 一种引线键合结构的切割方法及切割辅助装置 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6022822B2 (ja) * | 1979-06-13 | 1985-06-04 | 日本電気株式会社 | リ−ドフレ−ム |
| JPS62150868A (ja) * | 1985-12-25 | 1987-07-04 | Hitachi Micro Comput Eng Ltd | 半導体装置用リ−ドフレ−ムとそれを使用する樹脂封止方法 |
| JPH04129233A (ja) * | 1990-09-19 | 1992-04-30 | Fujitsu Ltd | 半導体ｈブリッジ回路 |
| JP3304705B2 (ja) * | 1995-09-19 | 2002-07-22 | セイコーエプソン株式会社 | チップキャリアの製造方法 |
| JP3261965B2 (ja) * | 1996-02-21 | 2002-03-04 | 富士電機株式会社 | 半導体装置 |
| JP3209696B2 (ja) * | 1996-03-07 | 2001-09-17 | 松下電器産業株式会社 | 電子部品の製造方法 |
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2008
- 2008-11-20 JP JP2008297133A patent/JP4784945B2/ja not_active Expired - Fee Related