JP2009065191A5 - - Google Patents
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- Publication number
- JP2009065191A5 JP2009065191A5 JP2008286870A JP2008286870A JP2009065191A5 JP 2009065191 A5 JP2009065191 A5 JP 2009065191A5 JP 2008286870 A JP2008286870 A JP 2008286870A JP 2008286870 A JP2008286870 A JP 2008286870A JP 2009065191 A5 JP2009065191 A5 JP 2009065191A5
- Authority
- JP
- Japan
- Prior art keywords
- film
- dicing
- die bonding
- adhesive
- adhesive film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000002313 adhesive film Substances 0.000 claims description 165
- 229920000642 polymer Polymers 0.000 claims description 72
- 238000004519 manufacturing process Methods 0.000 claims description 41
- 229920000647 polyepoxide Polymers 0.000 claims description 41
- 239000003795 chemical substances by application Substances 0.000 claims description 40
- 239000003822 epoxy resin Substances 0.000 claims description 39
- 239000004925 Acrylic resin Substances 0.000 claims description 29
- 125000003700 epoxy group Chemical group 0.000 claims description 29
- 229920001187 thermosetting polymer Polymers 0.000 claims description 29
- 229920000178 Acrylic resin Polymers 0.000 claims description 26
- 125000005396 acrylic acid ester group Chemical group 0.000 claims description 24
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid Chemical compound OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 23
- 239000000203 mixture Substances 0.000 claims description 15
- 239000002253 acid Substances 0.000 claims description 12
- 238000003860 storage Methods 0.000 claims description 10
- 230000001678 irradiating Effects 0.000 claims description 9
- 239000011342 resin composition Substances 0.000 claims description 9
- 125000000524 functional group Chemical group 0.000 claims description 8
- 238000010438 heat treatment Methods 0.000 claims description 6
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 claims description 4
- 125000006702 (C1-C18) alkyl group Chemical group 0.000 claims description 3
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 claims description 3
- 230000000379 polymerizing Effects 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 description 130
- 239000000853 adhesive Substances 0.000 description 50
- 230000001070 adhesive Effects 0.000 description 50
- XEKOWRVHYACXOJ-UHFFFAOYSA-N acetic acid ethyl ester Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 48
- 239000010410 layer Substances 0.000 description 35
- -1 polypropylene Polymers 0.000 description 29
- 229920005989 resin Polymers 0.000 description 28
- 239000011347 resin Substances 0.000 description 28
- 238000005520 cutting process Methods 0.000 description 27
- RAXXELZNTBOGNW-UHFFFAOYSA-N Imidazole Chemical compound C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 17
- 210000002356 Skeleton Anatomy 0.000 description 15
- 239000000178 monomer Substances 0.000 description 15
- 239000000463 material Substances 0.000 description 13
- 239000000758 substrate Substances 0.000 description 13
- 239000002699 waste material Substances 0.000 description 13
- UFWIBTONFRDIAS-UHFFFAOYSA-N naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 12
- 230000002829 reduced Effects 0.000 description 12
- 229940114077 Acrylic acid Drugs 0.000 description 11
- 238000011156 evaluation Methods 0.000 description 11
- HECLRDQVFMWTQS-UHFFFAOYSA-N Dicyclopentadiene Chemical group C1C2C3CC=CC3C1C=C2 HECLRDQVFMWTQS-UHFFFAOYSA-N 0.000 description 10
- 150000008065 acid anhydrides Chemical class 0.000 description 10
- 229920000139 polyethylene terephthalate Polymers 0.000 description 9
- 239000005020 polyethylene terephthalate Substances 0.000 description 9
- 239000004698 Polyethylene (PE) Substances 0.000 description 8
- NIXOWILDQLNWCW-UHFFFAOYSA-M acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 8
- 229940048053 acrylate Drugs 0.000 description 8
- 239000000945 filler Substances 0.000 description 8
- 238000002156 mixing Methods 0.000 description 8
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-Dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 7
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 7
- 125000000217 alkyl group Chemical group 0.000 description 7
- 125000004432 carbon atoms Chemical group C* 0.000 description 7
- 238000006116 polymerization reaction Methods 0.000 description 7
- 239000004721 Polyphenylene oxide Substances 0.000 description 6
- 229920000728 polyester Polymers 0.000 description 6
- 229920000570 polyether Polymers 0.000 description 6
- 229920000573 polyethylene Polymers 0.000 description 6
- 239000007787 solid Substances 0.000 description 6
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 5
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 5
- RBQRWNWVPQDTJJ-UHFFFAOYSA-N Methacryloyloxyethyl isocyanate Chemical compound CC(=C)C(=O)OCCN=C=O RBQRWNWVPQDTJJ-UHFFFAOYSA-N 0.000 description 5
- 239000004743 Polypropylene Substances 0.000 description 5
- 229920001577 copolymer Polymers 0.000 description 5
- 230000002093 peripheral Effects 0.000 description 5
- 229920000058 polyacrylate Polymers 0.000 description 5
- 229920000098 polyolefin Polymers 0.000 description 5
- 229920001155 polypropylene Polymers 0.000 description 5
- 229920005992 thermoplastic resin Polymers 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 4
- 229920001721 Polyimide Polymers 0.000 description 4
- 229920001451 Polypropylene glycol Polymers 0.000 description 4
- 150000001412 amines Chemical class 0.000 description 4
- 150000008064 anhydrides Chemical class 0.000 description 4
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- WNAHIZMDSQCWRP-UHFFFAOYSA-N dodecane-1-thiol Chemical compound CCCCCCCCCCCCS WNAHIZMDSQCWRP-UHFFFAOYSA-N 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 229920001225 Polyester resin Polymers 0.000 description 3
- OBFQBDOLCADBTP-UHFFFAOYSA-N aminosilicon Chemical compound [Si]N OBFQBDOLCADBTP-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229920001971 elastomer Polymers 0.000 description 3
- 239000003999 initiator Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000000704 physical effect Effects 0.000 description 3
- 239000004645 polyester resin Substances 0.000 description 3
- 229920002689 polyvinyl acetate Polymers 0.000 description 3
- 239000011118 polyvinyl acetate Substances 0.000 description 3
- 229920000915 polyvinyl chloride Polymers 0.000 description 3
- 239000004800 polyvinyl chloride Substances 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- 230000001681 protective Effects 0.000 description 3
- 239000005060 rubber Substances 0.000 description 3
- 150000003839 salts Chemical class 0.000 description 3
- 239000011780 sodium chloride Substances 0.000 description 3
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- 230000001629 suppression Effects 0.000 description 3
- 229920003002 synthetic resin Polymers 0.000 description 3
- 239000000057 synthetic resin Substances 0.000 description 3
- 229920002803 Thermoplastic polyurethane Polymers 0.000 description 2
- 239000006096 absorbing agent Substances 0.000 description 2
- 239000003522 acrylic cement Substances 0.000 description 2
- 150000001336 alkenes Chemical class 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- 125000002091 cationic group Chemical group 0.000 description 2
- 239000003153 chemical reaction reagent Substances 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-M chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 2
- 239000000460 chlorine Substances 0.000 description 2
- 229910052801 chlorine Inorganic materials 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- QGBSISYHAICWAH-UHFFFAOYSA-N cyanoguanidine Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 2
- 125000004386 diacrylate group Chemical group 0.000 description 2
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 238000010828 elution Methods 0.000 description 2
- 230000002708 enhancing Effects 0.000 description 2
- 238000005755 formation reaction Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- RRHGJUQNOFWUDK-UHFFFAOYSA-N isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 239000002985 plastic film Substances 0.000 description 2
- 229920000306 polymethylpentene Polymers 0.000 description 2
- 239000011116 polymethylpentene Substances 0.000 description 2
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 2
- 239000004810 polytetrafluoroethylene Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- QNODIIQQMGDSEF-UHFFFAOYSA-N (1-hydroxycyclohexyl)-phenylmethanone Chemical compound C=1C=CC=CC=1C(=O)C1(O)CCCCC1 QNODIIQQMGDSEF-UHFFFAOYSA-N 0.000 description 1
- MSAHTMIQULFMRG-UHFFFAOYSA-N 1,2-diphenyl-2-propan-2-yloxyethanone Chemical compound C=1C=CC=CC=1C(OC(C)C)C(=O)C1=CC=CC=C1 MSAHTMIQULFMRG-UHFFFAOYSA-N 0.000 description 1
- LGJCFVYMIJLQJO-UHFFFAOYSA-N 1-dodecylperoxydodecane Chemical compound CCCCCCCCCCCCOOCCCCCCCCCCCC LGJCFVYMIJLQJO-UHFFFAOYSA-N 0.000 description 1
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 1
- UAFNNYNGQVOTOM-UHFFFAOYSA-N 2-(2-phenyl-1H-imidazol-5-yl)propanenitrile Chemical compound N1C(C(C#N)C)=CN=C1C1=CC=CC=C1 UAFNNYNGQVOTOM-UHFFFAOYSA-N 0.000 description 1
- SLWOPZBLNKPZCQ-UHFFFAOYSA-N 2-(naphthalen-1-ylmethyl)oxirane Chemical compound C=1C=CC2=CC=CC=C2C=1CC1CO1 SLWOPZBLNKPZCQ-UHFFFAOYSA-N 0.000 description 1
- UKFXIJGSHYFEJE-UHFFFAOYSA-N 2-(naphthalen-2-ylmethyl)oxirane Chemical compound C=1C=C2C=CC=CC2=CC=1CC1CO1 UKFXIJGSHYFEJE-UHFFFAOYSA-N 0.000 description 1
- WYGWHHGCAGTUCH-UHFFFAOYSA-N 2-[(2-cyano-4-methylpentan-2-yl)diazenyl]-2,4-dimethylpentanenitrile Chemical compound CC(C)CC(C)(C#N)N=NC(C)(C#N)CC(C)C WYGWHHGCAGTUCH-UHFFFAOYSA-N 0.000 description 1
- XILAHTKSHOZAMU-UHFFFAOYSA-N 2-[[1,5,6-tris(oxiran-2-ylmethyl)naphthalen-2-yl]methyl]oxirane Chemical compound C=1C=C2C(CC3OC3)=C(CC3OC3)C=CC2=C(CC2OC2)C=1CC1CO1 XILAHTKSHOZAMU-UHFFFAOYSA-N 0.000 description 1
- LHIWDXPDEOCBIG-UHFFFAOYSA-N 2-[[1-(oxiran-2-ylmethyl)naphthalen-2-yl]methyl]oxirane Chemical compound C=1C=C2C=CC=CC2=C(CC2OC2)C=1CC1CO1 LHIWDXPDEOCBIG-UHFFFAOYSA-N 0.000 description 1
- STHCTMWQPJVCGN-UHFFFAOYSA-N 2-[[2-[1,1,2-tris[2-(oxiran-2-ylmethoxy)phenyl]ethyl]phenoxy]methyl]oxirane Chemical compound C1OC1COC1=CC=CC=C1CC(C=1C(=CC=CC=1)OCC1OC1)(C=1C(=CC=CC=1)OCC1OC1)C1=CC=CC=C1OCC1CO1 STHCTMWQPJVCGN-UHFFFAOYSA-N 0.000 description 1
- YQAYPSKEWNBJHH-UHFFFAOYSA-N 2-[[5-(oxiran-2-ylmethyl)naphthalen-1-yl]methyl]oxirane Chemical compound C=1C=CC2=C(CC3OC3)C=CC=C2C=1CC1CO1 YQAYPSKEWNBJHH-UHFFFAOYSA-N 0.000 description 1
- JENBVMYWZLPMNV-UHFFFAOYSA-N 2-[[5-(oxiran-2-ylmethyl)naphthalen-2-yl]methyl]oxirane Chemical compound C=1C=C2C(CC3OC3)=CC=CC2=CC=1CC1CO1 JENBVMYWZLPMNV-UHFFFAOYSA-N 0.000 description 1
- HKIITRNSRXSLTO-UHFFFAOYSA-N 2-[[7-(oxiran-2-ylmethyl)naphthalen-1-yl]methyl]oxirane Chemical compound C=1C=C2C=CC=C(CC3OC3)C2=CC=1CC1CO1 HKIITRNSRXSLTO-UHFFFAOYSA-N 0.000 description 1
- RTGRMEPDCLTWID-UHFFFAOYSA-N 2-[[7-(oxiran-2-ylmethyl)naphthalen-2-yl]methyl]oxirane Chemical compound C=1C=C2C=CC(CC3OC3)=CC2=CC=1CC1CO1 RTGRMEPDCLTWID-UHFFFAOYSA-N 0.000 description 1
- 125000001731 2-cyanoethyl group Chemical group [H]C([H])(*)C([H])([H])C#N 0.000 description 1
- KMNCBSZOIQAUFX-UHFFFAOYSA-N 2-ethoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCC)C(=O)C1=CC=CC=C1 KMNCBSZOIQAUFX-UHFFFAOYSA-N 0.000 description 1
- GJKGAPPUXSSCFI-UHFFFAOYSA-N 2-hydroxy-1-[4-(2-hydroxyethoxy)phenyl]-2-methylpropan-1-one Chemical compound CC(C)(O)C(=O)C1=CC=C(OCCO)C=C1 GJKGAPPUXSSCFI-UHFFFAOYSA-N 0.000 description 1
- BQZJOQXSCSZQPS-UHFFFAOYSA-N 2-methoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OC)C(=O)C1=CC=CC=C1 BQZJOQXSCSZQPS-UHFFFAOYSA-N 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N 2-methyl-2-propenoic acid methyl ester Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- IFXDUNDBQDXPQZ-UHFFFAOYSA-N 2-methylbutan-2-yl 2-ethylhexaneperoxoate Chemical compound CCCCC(CC)C(=O)OOC(C)(C)CC IFXDUNDBQDXPQZ-UHFFFAOYSA-N 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- BQARUDWASOOSRH-UHFFFAOYSA-M 2-tert-butylperoxypropan-2-yl carbonate Chemical compound CC(C)(C)OOC(C)(C)OC([O-])=O BQARUDWASOOSRH-UHFFFAOYSA-M 0.000 description 1
- CSHJJWDAZSZQBT-UHFFFAOYSA-N 7a-methyl-4,5-dihydro-3aH-2-benzofuran-1,3-dione Chemical compound C1=CCCC2C(=O)OC(=O)C21C CSHJJWDAZSZQBT-UHFFFAOYSA-N 0.000 description 1
- KYIKRXIYLAGAKQ-UHFFFAOYSA-N ABCN Chemical compound C1CCCCC1(C#N)N=NC1(C#N)CCCCC1 KYIKRXIYLAGAKQ-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N AI2O3 Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229920000800 Acrylic rubber Polymers 0.000 description 1
- 239000004342 Benzoyl peroxide Substances 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N Bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- BIOVHAGGCRHDRO-UHFFFAOYSA-N C(O)(O)=O.O1C2CC(C(CC21)C)C2CC1C(CC2C)O1 Chemical compound C(O)(O)=O.O1C2CC(C(CC21)C)C2CC1C(CC2C)O1 BIOVHAGGCRHDRO-UHFFFAOYSA-N 0.000 description 1
- 241000013987 Colletes Species 0.000 description 1
- YQHLDYVWEZKEOX-UHFFFAOYSA-N Cumene hydroperoxide Chemical compound OOC(C)(C)C1=CC=CC=C1 YQHLDYVWEZKEOX-UHFFFAOYSA-N 0.000 description 1
- ZFSLODLOARCGLH-UHFFFAOYSA-N Cyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 1
- LSXWFXONGKSEMY-UHFFFAOYSA-N Di-tert-butyl peroxide Chemical compound CC(C)(C)OOC(C)(C)C LSXWFXONGKSEMY-UHFFFAOYSA-N 0.000 description 1
- 241001050985 Disco Species 0.000 description 1
- 239000004831 Hot glue Substances 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Incidol Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- 210000000088 Lip Anatomy 0.000 description 1
- 229920001730 Moisture cure polyurethane Polymers 0.000 description 1
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 1
- 229920002845 Poly(methacrylic acid) Polymers 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 229920002397 Thermoplastic olefin Polymers 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 125000005233 alkylalcohol group Chemical group 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 125000000751 azo group Chemical group [*]N=N[*] 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000000875 corresponding Effects 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000010931 ester hydrolysis Methods 0.000 description 1
- 238000005886 esterification reaction Methods 0.000 description 1
- MKGWPYNKNRHHCA-UHFFFAOYSA-N ethoxycarbonyl(oxido)azanium Chemical compound CCOC(=O)[NH2]=O MKGWPYNKNRHHCA-UHFFFAOYSA-N 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- SHZIWNPUGXLXDT-UHFFFAOYSA-N ethyl hexanoate Chemical compound CCCCCC(=O)OCC SHZIWNPUGXLXDT-UHFFFAOYSA-N 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 125000002883 imidazolyl group Chemical group 0.000 description 1
- 125000005462 imide group Chemical group 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 125000005641 methacryl group Chemical group 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- ZQMHJBXHRFJKOT-UHFFFAOYSA-N methyl 2-[(1-methoxy-2-methyl-1-oxopropan-2-yl)diazenyl]-2-methylpropanoate Chemical compound COC(=O)C(C)(C)N=NC(C)(C)C(=O)OC ZQMHJBXHRFJKOT-UHFFFAOYSA-N 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- VYKXQOYUCMREIS-UHFFFAOYSA-N methylhexahydrophthalic anhydride Chemical compound C1CCCC2C(=O)OC(=O)C21C VYKXQOYUCMREIS-UHFFFAOYSA-N 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- 239000004843 novolac epoxy resin Substances 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000002524 organometallic group Chemical group 0.000 description 1
- 230000036961 partial Effects 0.000 description 1
- 125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 description 1
- 238000000016 photochemical curing Methods 0.000 description 1
- 239000003211 photoinitiator Substances 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920000193 polymethacrylate Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000003847 radiation curing Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000007142 ring opening reaction Methods 0.000 description 1
- BPQQTUXANYXVAA-UHFFFAOYSA-N silicate Chemical group [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
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| JP2010192856A (ja) | 2009-02-20 | 2010-09-02 | Furukawa Electric Co Ltd:The | ウエハ加工用フィルム |
| US9305769B2 (en) | 2009-06-30 | 2016-04-05 | Taiwan Semiconductor Manufacturing Company, Ltd. | Thin wafer handling method |
| US8871609B2 (en) * | 2009-06-30 | 2014-10-28 | Taiwan Semiconductor Manufacturing Company, Ltd. | Thin wafer handling structure and method |
| JP5512262B2 (ja) * | 2009-12-26 | 2014-06-04 | 株式会社朝日ラバー | レンズアレイシート及びそれのダイシング方法 |
| JP5566141B2 (ja) * | 2010-03-15 | 2014-08-06 | リンテック株式会社 | 粘接着剤組成物、粘接着シートおよび半導体装置の製造方法 |
| JP2012129473A (ja) * | 2010-12-17 | 2012-07-05 | Sekisui Chem Co Ltd | ダイシング−ダイボンディングテープ |
| JP5946650B2 (ja) * | 2012-02-21 | 2016-07-06 | 積水化学工業株式会社 | ダイシング−ダイボンディングテープ及び粘接着剤層付き半導体チップの製造方法 |
| JP6107230B2 (ja) * | 2013-02-28 | 2017-04-05 | 住友ベークライト株式会社 | ダイシングフィルム |
| WO2014157426A1 (fr) * | 2013-03-27 | 2014-10-02 | リンテック株式会社 | Feuille composite pour former un film de protection |
| JP6480583B2 (ja) * | 2014-08-05 | 2019-03-13 | ユニカルタ・インコーポレイテッド | 組み立てが容易な超小型または超薄型離散コンポーネントの構成 |
| KR20160095526A (ko) | 2015-02-03 | 2016-08-11 | 도레이첨단소재 주식회사 | 반도체용 다이싱 다이본딩 필름 |
| SG11201808291YA (en) * | 2016-03-30 | 2018-10-30 | Lintec Corp | Semiconductor processing sheet |
| WO2017188202A1 (fr) * | 2016-04-28 | 2017-11-02 | リンテック株式会社 | Film pour former un film de protection et feuille composite pour former un film de protection |
| JP7280661B2 (ja) * | 2017-12-28 | 2023-05-24 | 日東電工株式会社 | ダイシングダイボンドフィルム |
| JP6719489B2 (ja) * | 2018-01-31 | 2020-07-08 | 古河電気工業株式会社 | マスク一体型表面保護テープおよびマスク一体型表面保護テープを用いる半導体チップの製造方法 |
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| JP3280876B2 (ja) * | 1996-01-22 | 2002-05-13 | 日本テキサス・インスツルメンツ株式会社 | ウェハダイシング・接着用シートおよび半導体装置の製造方法 |
| JP4623694B2 (ja) * | 2000-12-28 | 2011-02-02 | 日東電工株式会社 | ダイシング用粘着シート |
| JP2003142505A (ja) * | 2001-10-31 | 2003-05-16 | Lintec Corp | ウエハダイシング・接着用シートおよび半導体装置の製造方法 |
| JP4107417B2 (ja) * | 2002-10-15 | 2008-06-25 | 日東電工株式会社 | チップ状ワークの固定方法 |
| JP2005019841A (ja) * | 2003-06-27 | 2005-01-20 | Nitto Denko Corp | 紫外線硬化型粘着テープの貼付け方法およびその装置並びにそれを用いて形成した物品 |
| JP4934284B2 (ja) * | 2004-03-15 | 2012-05-16 | 日立化成工業株式会社 | ダイシングダイボンドシート |
| JP4443962B2 (ja) * | 2004-03-17 | 2010-03-31 | 日東電工株式会社 | ダイシング・ダイボンドフィルム |
| KR101165131B1 (ko) * | 2004-04-20 | 2012-07-12 | 히다치 가세고교 가부시끼가이샤 | 접착시트, 반도체장치, 및 반도체장치의 제조방법 |
| JP2006165074A (ja) | 2004-12-03 | 2006-06-22 | Sumitomo Bakelite Co Ltd | ダイシングシート機能付きダイアタッチフィルム及びそれを用いた半導体装置の製造方法 |
| JP2006203000A (ja) * | 2005-01-20 | 2006-08-03 | Sekisui Chem Co Ltd | ダイシング用粘着テープおよび半導体チップの製造方法 |
| JP2006216773A (ja) * | 2005-02-03 | 2006-08-17 | Lintec Corp | ダイシングシートおよび電子部品の製造方法 |
| JP2007012670A (ja) * | 2005-06-28 | 2007-01-18 | Furukawa Electric Co Ltd:The | 粘接着テープ |
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