JP2009049342A - 発光装置 - Google Patents
発光装置 Download PDFInfo
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- JP2009049342A JP2009049342A JP2007216799A JP2007216799A JP2009049342A JP 2009049342 A JP2009049342 A JP 2009049342A JP 2007216799 A JP2007216799 A JP 2007216799A JP 2007216799 A JP2007216799 A JP 2007216799A JP 2009049342 A JP2009049342 A JP 2009049342A
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Abstract
【解決手段】フリップチップ型のGaN系半導体材料からなる発光素子としてのLED素子2と、LED素子2を搭載する搭載部としての素子搭載基板3と、素子搭載基板3に形成され、n側電極27及び基板接合電極としての低光学損失のp側パッド電極28を介してLED素子2へ電力を供給するための回路パターン4と、LED素子2を素子搭載基板3上にて封止するガラス封止部5とを備えており、LED素子2と、素子搭載基板3と、回路パターン4と、ガラス封止部5と、によりガラス封止LEDを構成している。
【選択図】図1
Description
ビアホール3aが形成された素子搭載基板3を用意し、素子搭載基板3の表面に回路パターンに応じてWペーストをスクリーン印刷する。次いで、Wペーストを印刷された素子搭載基板3を1000℃余で熱処理することによりWを素子搭載基板3に焼き付け、さらに、W上にNiめっきを施し、表面側についてはAgめっき、裏面側についてはAuめっきを施すことで回路パターン4を形成する。
Claims (11)
- 透明導電膜からなるコンタクト電極と、前記コンタクト電極の表面に設けられて前記コンタクト電極より小なる屈折率を有する透光性誘電体層と、前記コンタクト電極に接続されるパッド電極とを有し、
前記コンタクト電極と前記パッド電極との間の少なくとも一部に前記屈折率誘電体層が介在している発光素子と、
素子搭載面に配線層を有し、前記配線層上に前記発光素子をフリップ実装される基板と、
前記素子搭載面の前記配線層上に搭載された前記発光素子を前記配線層とともに封止する封止部と、
を有することを特徴とする発光装置。 - 前記封止部は、無機材料からなることを特徴とする請求項1に記載の発光装置。
- 前記封止部は、無機材料である熱融着ガラスからなることを特徴とする請求項2に記載の発光装置。
- 前記透光性誘電体層は、前記コンタクト電極と前記パッド電極の面積未満で形成されていることを特徴とする請求項3に記載の発光装置。
- 前記パッド電極は、前記透光性誘電体層を中央に配置して前記コンタクト電極との接合部が環状に設けられることを特徴とする請求項4項に記載の発光装置。
- 前記パッド電極は、前記コンタクト電極の表面に設けられる前記透光性誘電体層の中央から前記コンタクト電極との接合部が放射状に形成されていることを特徴とする請求項4に記載の発光装置。
- 前記透光性誘電体層は、前記パッド電極の表面を覆うように形成されていることを特徴とする請求項3に記載の発光装置。
- 前記パッド電極は、NiとAuを備えることを特徴とする請求項3項に記載の発光装置。
- 前記パッド電極は、Agを備えることを特徴とする請求項3項に記載の発光装置。
- 前記コンタクト電極は、ITO(Indium Tin Oxide)からなることを特徴とする請求項3に記載の発光装置。
- 前記配線層は、表面にAg層が設けられることを特徴とする請求項3に記載の発光装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
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JP2007216799A JP5251038B2 (ja) | 2007-08-23 | 2007-08-23 | 発光装置 |
US12/222,183 US8129743B2 (en) | 2007-08-23 | 2008-08-04 | Light emitting device |
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Application Number | Priority Date | Filing Date | Title |
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JP2007216799A JP5251038B2 (ja) | 2007-08-23 | 2007-08-23 | 発光装置 |
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JP2009049342A true JP2009049342A (ja) | 2009-03-05 |
JP5251038B2 JP5251038B2 (ja) | 2013-07-31 |
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JP2007216799A Active JP5251038B2 (ja) | 2007-08-23 | 2007-08-23 | 発光装置 |
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US (1) | US8129743B2 (ja) |
JP (1) | JP5251038B2 (ja) |
Cited By (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011066053A (ja) * | 2009-09-15 | 2011-03-31 | Toyoda Gosei Co Ltd | 発光素子の製造方法及び発光素子 |
JP2012527116A (ja) * | 2009-05-11 | 2012-11-01 | クリー インコーポレイテッド | 反射構造を有する半導体発光ダイオードおよびその製造方法 |
JP2012227230A (ja) * | 2011-04-15 | 2012-11-15 | Citizen Electronics Co Ltd | 半導体発光装置 |
JP2013120945A (ja) | 2013-03-21 | 2013-06-17 | Napura:Kk | 発光素子及び発光デバイス |
JP2014041999A (ja) * | 2013-06-18 | 2014-03-06 | Toshiba Corp | 半導体発光素子 |
US8878245B2 (en) | 2006-11-30 | 2014-11-04 | Cree, Inc. | Transistors and method for making ohmic contact to transistors |
US9484499B2 (en) | 2007-04-20 | 2016-11-01 | Cree, Inc. | Transparent ohmic contacts on light emitting diodes with carrier substrates |
JP2017054845A (ja) * | 2015-09-07 | 2017-03-16 | Shマテリアル株式会社 | 光半導体素子搭載用リードフレーム及び光半導体装置、並びにそれらの製造方法 |
US9741904B2 (en) | 2015-03-30 | 2017-08-22 | Samsung Display Co., Ltd. | Light emitting device |
JP2018049959A (ja) * | 2016-09-21 | 2018-03-29 | 豊田合成株式会社 | 発光素子及びその製造方法 |
JP2018085533A (ja) * | 2013-07-19 | 2018-05-31 | 日亜化学工業株式会社 | 発光装置 |
USD826871S1 (en) | 2014-12-11 | 2018-08-28 | Cree, Inc. | Light emitting diode device |
JP2018206818A (ja) * | 2017-05-30 | 2018-12-27 | 豊田合成株式会社 | 発光素子及びその製造方法 |
US10522729B2 (en) | 2013-07-19 | 2019-12-31 | Nichia Corporation | Light emitting device |
JP2020068264A (ja) * | 2018-10-23 | 2020-04-30 | 旭化成エレクトロニクス株式会社 | 光デバイス |
US11309465B2 (en) | 2013-07-19 | 2022-04-19 | Nichia Corporation | Method of manufacturing light emitting device |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100880638B1 (ko) * | 2007-07-06 | 2009-01-30 | 엘지전자 주식회사 | 발광 소자 패키지 |
US20100327300A1 (en) * | 2009-06-25 | 2010-12-30 | Koninklijke Philips Electronics N.V. | Contact for a semiconductor light emitting device |
JP5095785B2 (ja) * | 2010-08-09 | 2012-12-12 | 株式会社東芝 | 半導体発光素子及びその製造方法 |
JP4778107B1 (ja) * | 2010-10-19 | 2011-09-21 | 有限会社ナプラ | 発光デバイス、及び、その製造方法 |
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