JP2009044600A - マイクロホン装置およびその製造方法 - Google Patents

マイクロホン装置およびその製造方法 Download PDF

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Publication number
JP2009044600A
JP2009044600A JP2007209123A JP2007209123A JP2009044600A JP 2009044600 A JP2009044600 A JP 2009044600A JP 2007209123 A JP2007209123 A JP 2007209123A JP 2007209123 A JP2007209123 A JP 2007209123A JP 2009044600 A JP2009044600 A JP 2009044600A
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JP
Japan
Prior art keywords
microphone device
sound
case
manufacturing
signal processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007209123A
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English (en)
Japanese (ja)
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JP2009044600A5 (enExample
Inventor
Yasuo Otsuka
泰雄 大塚
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Original Assignee
Panasonic Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp filed Critical Panasonic Corp
Priority to JP2007209123A priority Critical patent/JP2009044600A/ja
Priority to PCT/JP2008/002181 priority patent/WO2009022459A1/ja
Priority to CN200880020602A priority patent/CN101690255A/zh
Publication of JP2009044600A publication Critical patent/JP2009044600A/ja
Publication of JP2009044600A5 publication Critical patent/JP2009044600A5/ja
Priority to US12/610,811 priority patent/US20100119097A1/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H04R1/04—Structural association of microphone with electric circuitry therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/005—Electrostatic transducers using semiconductor materials
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2499/00—Aspects covered by H04R or H04S not otherwise provided for in their subgroups
    • H04R2499/10—General applications
    • H04R2499/11—Transducers incorporated or for use in hand-held devices, e.g. mobile phones, PDA's, camera's

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
  • Details Of Audible-Bandwidth Transducers (AREA)
  • Circuit For Audible Band Transducer (AREA)
  • Piezo-Electric Transducers For Audible Bands (AREA)
JP2007209123A 2007-08-10 2007-08-10 マイクロホン装置およびその製造方法 Pending JP2009044600A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2007209123A JP2009044600A (ja) 2007-08-10 2007-08-10 マイクロホン装置およびその製造方法
PCT/JP2008/002181 WO2009022459A1 (ja) 2007-08-10 2008-08-08 マイクロホン装置およびその製造方法
CN200880020602A CN101690255A (zh) 2007-08-10 2008-08-08 麦克风设备及其制造方法
US12/610,811 US20100119097A1 (en) 2007-08-10 2009-11-02 Microphone device and manufacturing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007209123A JP2009044600A (ja) 2007-08-10 2007-08-10 マイクロホン装置およびその製造方法

Publications (2)

Publication Number Publication Date
JP2009044600A true JP2009044600A (ja) 2009-02-26
JP2009044600A5 JP2009044600A5 (enExample) 2009-06-18

Family

ID=40350517

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007209123A Pending JP2009044600A (ja) 2007-08-10 2007-08-10 マイクロホン装置およびその製造方法

Country Status (4)

Country Link
US (1) US20100119097A1 (enExample)
JP (1) JP2009044600A (enExample)
CN (1) CN101690255A (enExample)
WO (1) WO2009022459A1 (enExample)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012039616A (ja) * 2010-08-06 2012-02-23 Research In Motion Ltd モバイル電子デバイスにおけるマイクロホンのための電磁遮蔽および音響室
US8340735B2 (en) 2010-08-06 2012-12-25 Research In Motion Limited Electromagnetic shielding and an acoustic chamber for a microphone in a mobile electronic device
JP2016500501A (ja) * 2012-12-18 2016-01-12 エプコス アクチエンゲゼルシャフトＥｐｃｏｓ Ａｇ トップポートｍｅｍｓマイクロフォン及びその製造方法
JP2019145934A (ja) * 2018-02-19 2019-08-29 新日本無線株式会社 Ｍｅｍｓトランスデューサ装置及びその製造方法
JP2021015045A (ja) * 2019-07-12 2021-02-12 新日本無線株式会社 音波センサの製造方法

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Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012039616A (ja) * 2010-08-06 2012-02-23 Research In Motion Ltd モバイル電子デバイスにおけるマイクロホンのための電磁遮蔽および音響室
US8340735B2 (en) 2010-08-06 2012-12-25 Research In Motion Limited Electromagnetic shielding and an acoustic chamber for a microphone in a mobile electronic device
US8918150B2 (en) 2010-08-06 2014-12-23 Blackberry Limited Electromagnetic shielding and an acoustic chamber for a microphone in a mobile electronic device
JP2016500501A (ja) * 2012-12-18 2016-01-12 エプコス アクチエンゲゼルシャフトＥｐｃｏｓ Ａｇ トップポートｍｅｍｓマイクロフォン及びその製造方法
US10136226B2 (en) 2012-12-18 2018-11-20 Tdk Corporation Top-port MEMS microphone and method of manufacturing the same
JP2019145934A (ja) * 2018-02-19 2019-08-29 新日本無線株式会社 Ｍｅｍｓトランスデューサ装置及びその製造方法
JP2021015045A (ja) * 2019-07-12 2021-02-12 新日本無線株式会社 音波センサの製造方法
JP7283695B2 (ja) 2019-07-12 2023-05-30 日清紡マイクロデバイス株式会社 音波センサの製造方法

Also Published As

Publication number Publication date
WO2009022459A1 (ja) 2009-02-19
CN101690255A (zh) 2010-03-31
US20100119097A1 (en) 2010-05-13

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