JP2009044600A5 - - Google Patents

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Publication number
JP2009044600A5
JP2009044600A5 JP2007209123A JP2007209123A JP2009044600A5 JP 2009044600 A5 JP2009044600 A5 JP 2009044600A5 JP 2007209123 A JP2007209123 A JP 2007209123A JP 2007209123 A JP2007209123 A JP 2007209123A JP 2009044600 A5 JP2009044600 A5 JP 2009044600A5
Authority
JP
Japan
Prior art keywords
microphone device
case
microphone
sound
processing unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007209123A
Other languages
English (en)
Japanese (ja)
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JP2009044600A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2007209123A priority Critical patent/JP2009044600A/ja
Priority claimed from JP2007209123A external-priority patent/JP2009044600A/ja
Priority to PCT/JP2008/002181 priority patent/WO2009022459A1/ja
Priority to CN200880020602A priority patent/CN101690255A/zh
Publication of JP2009044600A publication Critical patent/JP2009044600A/ja
Publication of JP2009044600A5 publication Critical patent/JP2009044600A5/ja
Priority to US12/610,811 priority patent/US20100119097A1/en
Pending legal-status Critical Current

Links

JP2007209123A 2007-08-10 2007-08-10 マイクロホン装置およびその製造方法 Pending JP2009044600A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2007209123A JP2009044600A (ja) 2007-08-10 2007-08-10 マイクロホン装置およびその製造方法
PCT/JP2008/002181 WO2009022459A1 (ja) 2007-08-10 2008-08-08 マイクロホン装置およびその製造方法
CN200880020602A CN101690255A (zh) 2007-08-10 2008-08-08 麦克风设备及其制造方法
US12/610,811 US20100119097A1 (en) 2007-08-10 2009-11-02 Microphone device and manufacturing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007209123A JP2009044600A (ja) 2007-08-10 2007-08-10 マイクロホン装置およびその製造方法

Publications (2)

Publication Number Publication Date
JP2009044600A JP2009044600A (ja) 2009-02-26
JP2009044600A5 true JP2009044600A5 (enExample) 2009-06-18

Family

ID=40350517

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007209123A Pending JP2009044600A (ja) 2007-08-10 2007-08-10 マイクロホン装置およびその製造方法

Country Status (4)

Country Link
US (1) US20100119097A1 (enExample)
JP (1) JP2009044600A (enExample)
CN (1) CN101690255A (enExample)
WO (1) WO2009022459A1 (enExample)

Families Citing this family (59)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8450817B2 (en) * 2008-08-14 2013-05-28 Knowles Electronics Llc Microelectromechanical system package with strain relief bridge
US20110254111A1 (en) * 2010-04-19 2011-10-20 Avago Technologies Wireless Ip (Singapore) Pte. Ltd Packaged acoustic transducer device with shielding from electromagnetic interference
US9420378B1 (en) 2010-07-12 2016-08-16 Amkor Technology, Inc. Top port MEMS microphone package and method
JP5636795B2 (ja) * 2010-08-02 2014-12-10 船井電機株式会社 マイクロホンユニット
US8340735B2 (en) 2010-08-06 2012-12-25 Research In Motion Limited Electromagnetic shielding and an acoustic chamber for a microphone in a mobile electronic device
EP2416544B1 (en) * 2010-08-06 2015-04-29 BlackBerry Limited Electromagnetic Shielding and an Acoustic Chamber for a Microphone in a Mobile Electronic Device
DE112010006098T5 (de) * 2010-12-28 2014-03-20 Knowles Electronics, Llc Package mit einem unter einem MEMS-Chip angeordneten CMOS-Chip
US20120161258A1 (en) 2010-12-28 2012-06-28 Loeppert Peter V Package with a cmos die positioned underneath a mems die
JP5721452B2 (ja) * 2011-01-27 2015-05-20 ローム株式会社 静電容量型memsセンサ
US8618619B1 (en) 2011-01-28 2013-12-31 Amkor Technology, Inc. Top port with interposer MEMS microphone package and method
US9013011B1 (en) 2011-03-11 2015-04-21 Amkor Technology, Inc. Stacked and staggered die MEMS package and method
US8536663B1 (en) * 2011-04-28 2013-09-17 Amkor Technology, Inc. Metal mesh lid MEMS package and method
US9078063B2 (en) * 2012-08-10 2015-07-07 Knowles Electronics, Llc Microphone assembly with barrier to prevent contaminant infiltration
US8724841B2 (en) * 2012-08-30 2014-05-13 Apple Inc. Microphone with acoustic mesh to protect against sudden acoustic shock
US20140071594A1 (en) * 2012-09-07 2014-03-13 Sawyer I. Cohen Components Having Breakaway Installation Handles
JP6426620B2 (ja) * 2012-12-18 2018-11-21 Tdk株式会社 トップポートmemsマイクロフォン及びその製造方法
CN103974170B (zh) * 2013-02-06 2018-06-22 宏达国际电子股份有限公司 多传感器录音装置与方法
US9294839B2 (en) 2013-03-01 2016-03-22 Clearone, Inc. Augmentation of a beamforming microphone array with non-beamforming microphones
DE112015004268T5 (de) * 2014-09-19 2017-11-02 Murata Manufacturing Co., Ltd. Drucksensormodul
US9554207B2 (en) 2015-04-30 2017-01-24 Shure Acquisition Holdings, Inc. Offset cartridge microphones
US9565493B2 (en) 2015-04-30 2017-02-07 Shure Acquisition Holdings, Inc. Array microphone system and method of assembling the same
CN106210968B (zh) * 2016-08-29 2019-06-07 陈立康 一种全息立体拾音器
CN106358129B (zh) * 2016-08-29 2019-06-11 陈立康 一种全息立体扬声器
US20180077477A1 (en) * 2016-09-15 2018-03-15 Nokia Technologies Oy Porous audio device housing
US10367948B2 (en) 2017-01-13 2019-07-30 Shure Acquisition Holdings, Inc. Post-mixing acoustic echo cancellation systems and methods
GB2561020B (en) * 2017-03-30 2020-04-22 Cirrus Logic Int Semiconductor Ltd Apparatus and methods for monitoring a microphone
CN107222821B (zh) * 2017-06-09 2019-09-17 京东方科技集团股份有限公司 复合电极、使用其的声学传感器及制造方法
US11769510B2 (en) 2017-09-29 2023-09-26 Cirrus Logic Inc. Microphone authentication
GB2567018B (en) 2017-09-29 2020-04-01 Cirrus Logic Int Semiconductor Ltd Microphone authentication
WO2019133644A1 (en) * 2017-12-28 2019-07-04 Knowles Electronics, Llc Back volume free sensor package
JP2019145934A (ja) * 2018-02-19 2019-08-29 新日本無線株式会社 Memsトランスデューサ装置及びその製造方法
US11523212B2 (en) 2018-06-01 2022-12-06 Shure Acquisition Holdings, Inc. Pattern-forming microphone array
US11297423B2 (en) 2018-06-15 2022-04-05 Shure Acquisition Holdings, Inc. Endfire linear array microphone
US11310596B2 (en) 2018-09-20 2022-04-19 Shure Acquisition Holdings, Inc. Adjustable lobe shape for array microphones
CN109171700B (zh) * 2018-10-11 2021-12-28 南京大学 一种生理电检测用屏蔽有源电极
US11558693B2 (en) 2019-03-21 2023-01-17 Shure Acquisition Holdings, Inc. Auto focus, auto focus within regions, and auto placement of beamformed microphone lobes with inhibition and voice activity detection functionality
TWI865506B (zh) 2019-03-21 2024-12-11 美商舒爾獲得控股公司 具有抑制功能的波束形成麥克風瓣之自動對焦、區域內自動對焦、及自動配置
WO2020191354A1 (en) 2019-03-21 2020-09-24 Shure Acquisition Holdings, Inc. Housings and associated design features for ceiling array microphones
EP3973716A1 (en) 2019-05-23 2022-03-30 Shure Acquisition Holdings, Inc. Steerable speaker array, system, and method for the same
CN114051637B (zh) 2019-05-31 2025-10-28 舒尔获得控股公司 集成语音及噪声活动检测的低延时自动混波器
JP7283695B2 (ja) * 2019-07-12 2023-05-30 日清紡マイクロデバイス株式会社 音波センサの製造方法
CN114173978B (zh) * 2019-07-26 2024-08-27 株式会社欧利生 焊接制品制造装置及焊接制品的制造方法
EP4018680A1 (en) 2019-08-23 2022-06-29 Shure Acquisition Holdings, Inc. Two-dimensional microphone array with improved directivity
US11805342B2 (en) 2019-09-22 2023-10-31 xMEMS Labs, Inc. Sound producing package structure and manufacturing method thereof
WO2021087377A1 (en) 2019-11-01 2021-05-06 Shure Acquisition Holdings, Inc. Proximity microphone
US11395073B2 (en) 2020-04-18 2022-07-19 xMEMS Labs, Inc. Sound producing package structure and method for packaging sound producing package structure
US11252511B2 (en) 2019-12-27 2022-02-15 xMEMS Labs, Inc. Package structure and methods of manufacturing sound producing chip, forming package structure and forming sound producing apparatus
US11057716B1 (en) * 2019-12-27 2021-07-06 xMEMS Labs, Inc. Sound producing device
US11304005B2 (en) 2020-02-07 2022-04-12 xMEMS Labs, Inc. Crossover circuit
US11552611B2 (en) 2020-02-07 2023-01-10 Shure Acquisition Holdings, Inc. System and method for automatic adjustment of reference gain
US11172300B2 (en) 2020-02-07 2021-11-09 xMEMS Labs, Inc. Sound producing device
USD944776S1 (en) 2020-05-05 2022-03-01 Shure Acquisition Holdings, Inc. Audio device
WO2021243368A2 (en) 2020-05-29 2021-12-02 Shure Acquisition Holdings, Inc. Transducer steering and configuration systems and methods using a local positioning system
US11323823B1 (en) * 2021-01-18 2022-05-03 Knowles Electronics, Llc MEMS device with a diaphragm having a slotted layer
EP4285605A1 (en) 2021-01-28 2023-12-06 Shure Acquisition Holdings, Inc. Hybrid audio beamforming system
US12452584B2 (en) 2021-01-29 2025-10-21 Shure Acquisition Holdings, Inc. Scalable conferencing systems and methods
US12289584B2 (en) 2021-10-04 2025-04-29 Shure Acquisition Holdings, Inc. Networked automixer systems and methods
WO2023060082A1 (en) 2021-10-05 2023-04-13 Shure Acquisition Holdings, Inc. Microphone assembly, filter for microphone, process for assembly and manufacturing microphone and filter for microphone, and method for filtering microphone
WO2023133513A1 (en) 2022-01-07 2023-07-13 Shure Acquisition Holdings, Inc. Audio beamforming with nulling control system and methods

Family Cites Families (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2694462A (en) * 1951-09-19 1954-11-16 Robbins Frank Acoustic system for loud-speakers
US6870938B2 (en) * 2000-04-26 2005-03-22 Mitsubishi Denki Kabushiki Kaisha Semiconductor electret capacitor microphone
JP4659300B2 (ja) * 2000-09-13 2011-03-30 浜松ホトニクス株式会社 レーザ加工方法及び半導体チップの製造方法
US7439616B2 (en) * 2000-11-28 2008-10-21 Knowles Electronics, Llc Miniature silicon condenser microphone
US7434305B2 (en) * 2000-11-28 2008-10-14 Knowles Electronics, Llc. Method of manufacturing a microphone
US7166910B2 (en) * 2000-11-28 2007-01-23 Knowles Electronics Llc Miniature silicon condenser microphone
WO2002074686A2 (en) * 2000-12-05 2002-09-26 Analog Devices, Inc. A method and device for protecting micro electromechanical systems structures during dicing of a wafer
US7298856B2 (en) * 2001-09-05 2007-11-20 Nippon Hoso Kyokai Chip microphone and method of making same
US7146016B2 (en) * 2001-11-27 2006-12-05 Center For National Research Initiatives Miniature condenser microphone and fabrication method therefor
AU2003211581A1 (en) * 2002-03-12 2003-09-22 Hamamatsu Photonics K.K. Method of cutting processed object
US7135070B2 (en) * 2002-04-23 2006-11-14 Sharp Laboratories Of America, Inc. Monolithic stacked/layered crystal-structure-processed mechanical, and combined mechanical and electrical, devices and methods and systems for making
US7039593B2 (en) * 2002-06-20 2006-05-02 Robert David Sager Payment convergence system and method
US6822326B2 (en) * 2002-09-25 2004-11-23 Ziptronix Wafer bonding hermetic encapsulation
JP2004328232A (ja) * 2003-04-23 2004-11-18 Matsushita Electric Ind Co Ltd 風防兼静電遮蔽機能付きマイクロホン及びこれに用いる風防兼静電遮蔽スクリーン
JP2005039652A (ja) * 2003-07-17 2005-02-10 Hosiden Corp 音響検出機構
JP4191555B2 (ja) * 2003-07-29 2008-12-03 シチズン電子株式会社 動電型発音体の製造方法
US7235495B2 (en) * 2003-07-31 2007-06-26 Fsi International, Inc. Controlled growth of highly uniform, oxide layers, especially ultrathin layers
US6936524B2 (en) * 2003-11-05 2005-08-30 Akustica, Inc. Ultrathin form factor MEMS microphones and microspeakers
JP3875240B2 (ja) * 2004-03-31 2007-01-31 株式会社東芝 電子部品の製造方法
US7155024B2 (en) * 2004-12-13 2006-12-26 Taiwan Carol Electronics Co., Ltd. Microphone
JP4560424B2 (ja) * 2005-02-24 2010-10-13 株式会社オーディオテクニカ コンデンサマイクロホン
US7334901B2 (en) * 2005-04-22 2008-02-26 Ostendo Technologies, Inc. Low profile, large screen display using a rear projection array system
US20060280319A1 (en) * 2005-06-08 2006-12-14 General Mems Corporation Micromachined Capacitive Microphone
JP2007006149A (ja) * 2005-06-23 2007-01-11 Hosiden Corp 電子部品
US7202552B2 (en) * 2005-07-15 2007-04-10 Silicon Matrix Pte. Ltd. MEMS package using flexible substrates, and method thereof
JP4701032B2 (ja) * 2005-07-28 2011-06-15 日本製紙株式会社 印刷用紙の裏抜け評価方法及び評価装置
SG130158A1 (en) * 2005-08-20 2007-03-20 Bse Co Ltd Silicon based condenser microphone and packaging method for the same
JP4655017B2 (ja) * 2005-11-25 2011-03-23 パナソニック電工株式会社 音響センサ
JP4787648B2 (ja) * 2006-03-29 2011-10-05 パナソニック株式会社 コンデンサマイクロホンの製造方法およびコンデンサマイクロホン
US8040587B2 (en) * 2006-05-17 2011-10-18 Qualcomm Mems Technologies, Inc. Desiccant in a MEMS device
US8005250B2 (en) * 2007-12-21 2011-08-23 Josephson Engineering, Inc. Microphone housing

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