JP2009044600A5 - - Google Patents
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- Publication number
- JP2009044600A5 JP2009044600A5 JP2007209123A JP2007209123A JP2009044600A5 JP 2009044600 A5 JP2009044600 A5 JP 2009044600A5 JP 2007209123 A JP2007209123 A JP 2007209123A JP 2007209123 A JP2007209123 A JP 2007209123A JP 2009044600 A5 JP2009044600 A5 JP 2009044600A5
- Authority
- JP
- Japan
- Prior art keywords
- microphone device
- case
- microphone
- sound
- processing unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 4
- 229910052710 silicon Inorganic materials 0.000 claims 4
- 239000010703 silicon Substances 0.000 claims 4
- 239000004020 conductor Substances 0.000 claims 3
- 238000004080 punching Methods 0.000 claims 3
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007209123A JP2009044600A (ja) | 2007-08-10 | 2007-08-10 | マイクロホン装置およびその製造方法 |
| PCT/JP2008/002181 WO2009022459A1 (ja) | 2007-08-10 | 2008-08-08 | マイクロホン装置およびその製造方法 |
| CN200880020602A CN101690255A (zh) | 2007-08-10 | 2008-08-08 | 麦克风设备及其制造方法 |
| US12/610,811 US20100119097A1 (en) | 2007-08-10 | 2009-11-02 | Microphone device and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007209123A JP2009044600A (ja) | 2007-08-10 | 2007-08-10 | マイクロホン装置およびその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2009044600A JP2009044600A (ja) | 2009-02-26 |
| JP2009044600A5 true JP2009044600A5 (enExample) | 2009-06-18 |
Family
ID=40350517
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007209123A Pending JP2009044600A (ja) | 2007-08-10 | 2007-08-10 | マイクロホン装置およびその製造方法 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20100119097A1 (enExample) |
| JP (1) | JP2009044600A (enExample) |
| CN (1) | CN101690255A (enExample) |
| WO (1) | WO2009022459A1 (enExample) |
Families Citing this family (59)
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| US8450817B2 (en) * | 2008-08-14 | 2013-05-28 | Knowles Electronics Llc | Microelectromechanical system package with strain relief bridge |
| US20110254111A1 (en) * | 2010-04-19 | 2011-10-20 | Avago Technologies Wireless Ip (Singapore) Pte. Ltd | Packaged acoustic transducer device with shielding from electromagnetic interference |
| US9420378B1 (en) | 2010-07-12 | 2016-08-16 | Amkor Technology, Inc. | Top port MEMS microphone package and method |
| JP5636795B2 (ja) * | 2010-08-02 | 2014-12-10 | 船井電機株式会社 | マイクロホンユニット |
| US8340735B2 (en) | 2010-08-06 | 2012-12-25 | Research In Motion Limited | Electromagnetic shielding and an acoustic chamber for a microphone in a mobile electronic device |
| EP2416544B1 (en) * | 2010-08-06 | 2015-04-29 | BlackBerry Limited | Electromagnetic Shielding and an Acoustic Chamber for a Microphone in a Mobile Electronic Device |
| DE112010006098T5 (de) * | 2010-12-28 | 2014-03-20 | Knowles Electronics, Llc | Package mit einem unter einem MEMS-Chip angeordneten CMOS-Chip |
| US20120161258A1 (en) | 2010-12-28 | 2012-06-28 | Loeppert Peter V | Package with a cmos die positioned underneath a mems die |
| JP5721452B2 (ja) * | 2011-01-27 | 2015-05-20 | ローム株式会社 | 静電容量型memsセンサ |
| US8618619B1 (en) | 2011-01-28 | 2013-12-31 | Amkor Technology, Inc. | Top port with interposer MEMS microphone package and method |
| US9013011B1 (en) | 2011-03-11 | 2015-04-21 | Amkor Technology, Inc. | Stacked and staggered die MEMS package and method |
| US8536663B1 (en) * | 2011-04-28 | 2013-09-17 | Amkor Technology, Inc. | Metal mesh lid MEMS package and method |
| US9078063B2 (en) * | 2012-08-10 | 2015-07-07 | Knowles Electronics, Llc | Microphone assembly with barrier to prevent contaminant infiltration |
| US8724841B2 (en) * | 2012-08-30 | 2014-05-13 | Apple Inc. | Microphone with acoustic mesh to protect against sudden acoustic shock |
| US20140071594A1 (en) * | 2012-09-07 | 2014-03-13 | Sawyer I. Cohen | Components Having Breakaway Installation Handles |
| JP6426620B2 (ja) * | 2012-12-18 | 2018-11-21 | Tdk株式会社 | トップポートmemsマイクロフォン及びその製造方法 |
| CN103974170B (zh) * | 2013-02-06 | 2018-06-22 | 宏达国际电子股份有限公司 | 多传感器录音装置与方法 |
| US9294839B2 (en) | 2013-03-01 | 2016-03-22 | Clearone, Inc. | Augmentation of a beamforming microphone array with non-beamforming microphones |
| DE112015004268T5 (de) * | 2014-09-19 | 2017-11-02 | Murata Manufacturing Co., Ltd. | Drucksensormodul |
| US9554207B2 (en) | 2015-04-30 | 2017-01-24 | Shure Acquisition Holdings, Inc. | Offset cartridge microphones |
| US9565493B2 (en) | 2015-04-30 | 2017-02-07 | Shure Acquisition Holdings, Inc. | Array microphone system and method of assembling the same |
| CN106210968B (zh) * | 2016-08-29 | 2019-06-07 | 陈立康 | 一种全息立体拾音器 |
| CN106358129B (zh) * | 2016-08-29 | 2019-06-11 | 陈立康 | 一种全息立体扬声器 |
| US20180077477A1 (en) * | 2016-09-15 | 2018-03-15 | Nokia Technologies Oy | Porous audio device housing |
| US10367948B2 (en) | 2017-01-13 | 2019-07-30 | Shure Acquisition Holdings, Inc. | Post-mixing acoustic echo cancellation systems and methods |
| GB2561020B (en) * | 2017-03-30 | 2020-04-22 | Cirrus Logic Int Semiconductor Ltd | Apparatus and methods for monitoring a microphone |
| CN107222821B (zh) * | 2017-06-09 | 2019-09-17 | 京东方科技集团股份有限公司 | 复合电极、使用其的声学传感器及制造方法 |
| US11769510B2 (en) | 2017-09-29 | 2023-09-26 | Cirrus Logic Inc. | Microphone authentication |
| GB2567018B (en) | 2017-09-29 | 2020-04-01 | Cirrus Logic Int Semiconductor Ltd | Microphone authentication |
| WO2019133644A1 (en) * | 2017-12-28 | 2019-07-04 | Knowles Electronics, Llc | Back volume free sensor package |
| JP2019145934A (ja) * | 2018-02-19 | 2019-08-29 | 新日本無線株式会社 | Memsトランスデューサ装置及びその製造方法 |
| US11523212B2 (en) | 2018-06-01 | 2022-12-06 | Shure Acquisition Holdings, Inc. | Pattern-forming microphone array |
| US11297423B2 (en) | 2018-06-15 | 2022-04-05 | Shure Acquisition Holdings, Inc. | Endfire linear array microphone |
| US11310596B2 (en) | 2018-09-20 | 2022-04-19 | Shure Acquisition Holdings, Inc. | Adjustable lobe shape for array microphones |
| CN109171700B (zh) * | 2018-10-11 | 2021-12-28 | 南京大学 | 一种生理电检测用屏蔽有源电极 |
| US11558693B2 (en) | 2019-03-21 | 2023-01-17 | Shure Acquisition Holdings, Inc. | Auto focus, auto focus within regions, and auto placement of beamformed microphone lobes with inhibition and voice activity detection functionality |
| TWI865506B (zh) | 2019-03-21 | 2024-12-11 | 美商舒爾獲得控股公司 | 具有抑制功能的波束形成麥克風瓣之自動對焦、區域內自動對焦、及自動配置 |
| WO2020191354A1 (en) | 2019-03-21 | 2020-09-24 | Shure Acquisition Holdings, Inc. | Housings and associated design features for ceiling array microphones |
| EP3973716A1 (en) | 2019-05-23 | 2022-03-30 | Shure Acquisition Holdings, Inc. | Steerable speaker array, system, and method for the same |
| CN114051637B (zh) | 2019-05-31 | 2025-10-28 | 舒尔获得控股公司 | 集成语音及噪声活动检测的低延时自动混波器 |
| JP7283695B2 (ja) * | 2019-07-12 | 2023-05-30 | 日清紡マイクロデバイス株式会社 | 音波センサの製造方法 |
| CN114173978B (zh) * | 2019-07-26 | 2024-08-27 | 株式会社欧利生 | 焊接制品制造装置及焊接制品的制造方法 |
| EP4018680A1 (en) | 2019-08-23 | 2022-06-29 | Shure Acquisition Holdings, Inc. | Two-dimensional microphone array with improved directivity |
| US11805342B2 (en) | 2019-09-22 | 2023-10-31 | xMEMS Labs, Inc. | Sound producing package structure and manufacturing method thereof |
| WO2021087377A1 (en) | 2019-11-01 | 2021-05-06 | Shure Acquisition Holdings, Inc. | Proximity microphone |
| US11395073B2 (en) | 2020-04-18 | 2022-07-19 | xMEMS Labs, Inc. | Sound producing package structure and method for packaging sound producing package structure |
| US11252511B2 (en) | 2019-12-27 | 2022-02-15 | xMEMS Labs, Inc. | Package structure and methods of manufacturing sound producing chip, forming package structure and forming sound producing apparatus |
| US11057716B1 (en) * | 2019-12-27 | 2021-07-06 | xMEMS Labs, Inc. | Sound producing device |
| US11304005B2 (en) | 2020-02-07 | 2022-04-12 | xMEMS Labs, Inc. | Crossover circuit |
| US11552611B2 (en) | 2020-02-07 | 2023-01-10 | Shure Acquisition Holdings, Inc. | System and method for automatic adjustment of reference gain |
| US11172300B2 (en) | 2020-02-07 | 2021-11-09 | xMEMS Labs, Inc. | Sound producing device |
| USD944776S1 (en) | 2020-05-05 | 2022-03-01 | Shure Acquisition Holdings, Inc. | Audio device |
| WO2021243368A2 (en) | 2020-05-29 | 2021-12-02 | Shure Acquisition Holdings, Inc. | Transducer steering and configuration systems and methods using a local positioning system |
| US11323823B1 (en) * | 2021-01-18 | 2022-05-03 | Knowles Electronics, Llc | MEMS device with a diaphragm having a slotted layer |
| EP4285605A1 (en) | 2021-01-28 | 2023-12-06 | Shure Acquisition Holdings, Inc. | Hybrid audio beamforming system |
| US12452584B2 (en) | 2021-01-29 | 2025-10-21 | Shure Acquisition Holdings, Inc. | Scalable conferencing systems and methods |
| US12289584B2 (en) | 2021-10-04 | 2025-04-29 | Shure Acquisition Holdings, Inc. | Networked automixer systems and methods |
| WO2023060082A1 (en) | 2021-10-05 | 2023-04-13 | Shure Acquisition Holdings, Inc. | Microphone assembly, filter for microphone, process for assembly and manufacturing microphone and filter for microphone, and method for filtering microphone |
| WO2023133513A1 (en) | 2022-01-07 | 2023-07-13 | Shure Acquisition Holdings, Inc. | Audio beamforming with nulling control system and methods |
Family Cites Families (31)
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|---|---|---|---|---|
| US2694462A (en) * | 1951-09-19 | 1954-11-16 | Robbins Frank | Acoustic system for loud-speakers |
| US6870938B2 (en) * | 2000-04-26 | 2005-03-22 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor electret capacitor microphone |
| JP4659300B2 (ja) * | 2000-09-13 | 2011-03-30 | 浜松ホトニクス株式会社 | レーザ加工方法及び半導体チップの製造方法 |
| US7439616B2 (en) * | 2000-11-28 | 2008-10-21 | Knowles Electronics, Llc | Miniature silicon condenser microphone |
| US7434305B2 (en) * | 2000-11-28 | 2008-10-14 | Knowles Electronics, Llc. | Method of manufacturing a microphone |
| US7166910B2 (en) * | 2000-11-28 | 2007-01-23 | Knowles Electronics Llc | Miniature silicon condenser microphone |
| WO2002074686A2 (en) * | 2000-12-05 | 2002-09-26 | Analog Devices, Inc. | A method and device for protecting micro electromechanical systems structures during dicing of a wafer |
| US7298856B2 (en) * | 2001-09-05 | 2007-11-20 | Nippon Hoso Kyokai | Chip microphone and method of making same |
| US7146016B2 (en) * | 2001-11-27 | 2006-12-05 | Center For National Research Initiatives | Miniature condenser microphone and fabrication method therefor |
| AU2003211581A1 (en) * | 2002-03-12 | 2003-09-22 | Hamamatsu Photonics K.K. | Method of cutting processed object |
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| US7039593B2 (en) * | 2002-06-20 | 2006-05-02 | Robert David Sager | Payment convergence system and method |
| US6822326B2 (en) * | 2002-09-25 | 2004-11-23 | Ziptronix | Wafer bonding hermetic encapsulation |
| JP2004328232A (ja) * | 2003-04-23 | 2004-11-18 | Matsushita Electric Ind Co Ltd | 風防兼静電遮蔽機能付きマイクロホン及びこれに用いる風防兼静電遮蔽スクリーン |
| JP2005039652A (ja) * | 2003-07-17 | 2005-02-10 | Hosiden Corp | 音響検出機構 |
| JP4191555B2 (ja) * | 2003-07-29 | 2008-12-03 | シチズン電子株式会社 | 動電型発音体の製造方法 |
| US7235495B2 (en) * | 2003-07-31 | 2007-06-26 | Fsi International, Inc. | Controlled growth of highly uniform, oxide layers, especially ultrathin layers |
| US6936524B2 (en) * | 2003-11-05 | 2005-08-30 | Akustica, Inc. | Ultrathin form factor MEMS microphones and microspeakers |
| JP3875240B2 (ja) * | 2004-03-31 | 2007-01-31 | 株式会社東芝 | 電子部品の製造方法 |
| US7155024B2 (en) * | 2004-12-13 | 2006-12-26 | Taiwan Carol Electronics Co., Ltd. | Microphone |
| JP4560424B2 (ja) * | 2005-02-24 | 2010-10-13 | 株式会社オーディオテクニカ | コンデンサマイクロホン |
| US7334901B2 (en) * | 2005-04-22 | 2008-02-26 | Ostendo Technologies, Inc. | Low profile, large screen display using a rear projection array system |
| US20060280319A1 (en) * | 2005-06-08 | 2006-12-14 | General Mems Corporation | Micromachined Capacitive Microphone |
| JP2007006149A (ja) * | 2005-06-23 | 2007-01-11 | Hosiden Corp | 電子部品 |
| US7202552B2 (en) * | 2005-07-15 | 2007-04-10 | Silicon Matrix Pte. Ltd. | MEMS package using flexible substrates, and method thereof |
| JP4701032B2 (ja) * | 2005-07-28 | 2011-06-15 | 日本製紙株式会社 | 印刷用紙の裏抜け評価方法及び評価装置 |
| SG130158A1 (en) * | 2005-08-20 | 2007-03-20 | Bse Co Ltd | Silicon based condenser microphone and packaging method for the same |
| JP4655017B2 (ja) * | 2005-11-25 | 2011-03-23 | パナソニック電工株式会社 | 音響センサ |
| JP4787648B2 (ja) * | 2006-03-29 | 2011-10-05 | パナソニック株式会社 | コンデンサマイクロホンの製造方法およびコンデンサマイクロホン |
| US8040587B2 (en) * | 2006-05-17 | 2011-10-18 | Qualcomm Mems Technologies, Inc. | Desiccant in a MEMS device |
| US8005250B2 (en) * | 2007-12-21 | 2011-08-23 | Josephson Engineering, Inc. | Microphone housing |
-
2007
- 2007-08-10 JP JP2007209123A patent/JP2009044600A/ja active Pending
-
2008
- 2008-08-08 WO PCT/JP2008/002181 patent/WO2009022459A1/ja not_active Ceased
- 2008-08-08 CN CN200880020602A patent/CN101690255A/zh active Pending
-
2009
- 2009-11-02 US US12/610,811 patent/US20100119097A1/en not_active Abandoned
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