CN101690255A - 麦克风设备及其制造方法 - Google Patents

麦克风设备及其制造方法 Download PDF

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Publication number
CN101690255A
CN101690255A CN200880020602A CN200880020602A CN101690255A CN 101690255 A CN101690255 A CN 101690255A CN 200880020602 A CN200880020602 A CN 200880020602A CN 200880020602 A CN200880020602 A CN 200880020602A CN 101690255 A CN101690255 A CN 101690255A
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CN
China
Prior art keywords
microphone
cover
sound
microphone device
forming
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN200880020602A
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English (en)
Chinese (zh)
Inventor
大塚泰雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Publication of CN101690255A publication Critical patent/CN101690255A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H04R1/04—Structural association of microphone with electric circuitry therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/005—Electrostatic transducers using semiconductor materials
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2499/00—Aspects covered by H04R or H04S not otherwise provided for in their subgroups
    • H04R2499/10—General applications
    • H04R2499/11—Transducers incorporated or for use in hand-held devices, e.g. mobile phones, PDA's, camera's

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
  • Details Of Audible-Bandwidth Transducers (AREA)
  • Circuit For Audible Band Transducer (AREA)
  • Piezo-Electric Transducers For Audible Bands (AREA)
CN200880020602A 2007-08-10 2008-08-08 麦克风设备及其制造方法 Pending CN101690255A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP209123/2007 2007-08-10
JP2007209123A JP2009044600A (ja) 2007-08-10 2007-08-10 マイクロホン装置およびその製造方法
PCT/JP2008/002181 WO2009022459A1 (ja) 2007-08-10 2008-08-08 マイクロホン装置およびその製造方法

Publications (1)

Publication Number Publication Date
CN101690255A true CN101690255A (zh) 2010-03-31

Family

ID=40350517

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200880020602A Pending CN101690255A (zh) 2007-08-10 2008-08-08 麦克风设备及其制造方法

Country Status (4)

Country Link
US (1) US20100119097A1 (enExample)
JP (1) JP2009044600A (enExample)
CN (1) CN101690255A (enExample)
WO (1) WO2009022459A1 (enExample)

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CN102223593A (zh) * 2010-04-19 2011-10-19 安华高科技无线Ip（新加坡）私人有限公司 具有对电磁干扰的屏蔽的封装式声学换能器装置
CN103385010A (zh) * 2010-12-28 2013-11-06 美商楼氏电子有限公司 具有位于mems裸片下面的coms裸片的封装
CN103974170A (zh) * 2013-02-06 2014-08-06 宏达国际电子股份有限公司 多传感器录音装置与方法
CN106716095A (zh) * 2014-09-19 2017-05-24 株式会社村田制作所 压力传感器模块
CN109171700A (zh) * 2018-10-11 2019-01-11 南京大学 一种生理电检测用屏蔽有源电极
CN110463225A (zh) * 2017-03-30 2019-11-15 思睿逻辑国际半导体有限公司 用于监控麦克风的装置和方法
US11024317B2 (en) 2017-09-29 2021-06-01 Cirrus Logic, Inc. Microphone authentication
US11769510B2 (en) 2017-09-29 2023-09-26 Cirrus Logic Inc. Microphone authentication

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TWI865506B (zh) 2019-03-21 2024-12-11 美商舒爾獲得控股公司 具有抑制功能的波束形成麥克風瓣之自動對焦、區域內自動對焦、及自動配置
WO2020191354A1 (en) 2019-03-21 2020-09-24 Shure Acquisition Holdings, Inc. Housings and associated design features for ceiling array microphones
EP3973716A1 (en) 2019-05-23 2022-03-30 Shure Acquisition Holdings, Inc. Steerable speaker array, system, and method for the same
CN114051637B (zh) 2019-05-31 2025-10-28 舒尔获得控股公司 集成语音及噪声活动检测的低延时自动混波器
JP7283695B2 (ja) * 2019-07-12 2023-05-30 日清紡マイクロデバイス株式会社 音波センサの製造方法
CN114173978B (zh) * 2019-07-26 2024-08-27 株式会社欧利生 焊接制品制造装置及焊接制品的制造方法
EP4018680A1 (en) 2019-08-23 2022-06-29 Shure Acquisition Holdings, Inc. Two-dimensional microphone array with improved directivity
US11805342B2 (en) 2019-09-22 2023-10-31 xMEMS Labs, Inc. Sound producing package structure and manufacturing method thereof
WO2021087377A1 (en) 2019-11-01 2021-05-06 Shure Acquisition Holdings, Inc. Proximity microphone
US11395073B2 (en) 2020-04-18 2022-07-19 xMEMS Labs, Inc. Sound producing package structure and method for packaging sound producing package structure
US11252511B2 (en) 2019-12-27 2022-02-15 xMEMS Labs, Inc. Package structure and methods of manufacturing sound producing chip, forming package structure and forming sound producing apparatus
US11057716B1 (en) * 2019-12-27 2021-07-06 xMEMS Labs, Inc. Sound producing device
US11304005B2 (en) 2020-02-07 2022-04-12 xMEMS Labs, Inc. Crossover circuit
US11552611B2 (en) 2020-02-07 2023-01-10 Shure Acquisition Holdings, Inc. System and method for automatic adjustment of reference gain
US11172300B2 (en) 2020-02-07 2021-11-09 xMEMS Labs, Inc. Sound producing device
USD944776S1 (en) 2020-05-05 2022-03-01 Shure Acquisition Holdings, Inc. Audio device
WO2021243368A2 (en) 2020-05-29 2021-12-02 Shure Acquisition Holdings, Inc. Transducer steering and configuration systems and methods using a local positioning system
US11323823B1 (en) * 2021-01-18 2022-05-03 Knowles Electronics, Llc MEMS device with a diaphragm having a slotted layer
EP4285605A1 (en) 2021-01-28 2023-12-06 Shure Acquisition Holdings, Inc. Hybrid audio beamforming system
US12452584B2 (en) 2021-01-29 2025-10-21 Shure Acquisition Holdings, Inc. Scalable conferencing systems and methods
US12289584B2 (en) 2021-10-04 2025-04-29 Shure Acquisition Holdings, Inc. Networked automixer systems and methods
WO2023060082A1 (en) 2021-10-05 2023-04-13 Shure Acquisition Holdings, Inc. Microphone assembly, filter for microphone, process for assembly and manufacturing microphone and filter for microphone, and method for filtering microphone
WO2023133513A1 (en) 2022-01-07 2023-07-13 Shure Acquisition Holdings, Inc. Audio beamforming with nulling control system and methods

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Cited By (11)

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Publication number Priority date Publication date Assignee Title
CN102223593A (zh) * 2010-04-19 2011-10-19 安华高科技无线Ip（新加坡）私人有限公司 具有对电磁干扰的屏蔽的封装式声学换能器装置
CN103385010A (zh) * 2010-12-28 2013-11-06 美商楼氏电子有限公司 具有位于mems裸片下面的coms裸片的封装
CN103385010B (zh) * 2010-12-28 2016-08-10 美商楼氏电子有限公司 具有位于mems裸片下面的cmos裸片的封装
CN103974170A (zh) * 2013-02-06 2014-08-06 宏达国际电子股份有限公司 多传感器录音装置与方法
CN103974170B (zh) * 2013-02-06 2018-06-22 宏达国际电子股份有限公司 多传感器录音装置与方法
CN106716095A (zh) * 2014-09-19 2017-05-24 株式会社村田制作所 压力传感器模块
CN110463225A (zh) * 2017-03-30 2019-11-15 思睿逻辑国际半导体有限公司 用于监控麦克风的装置和方法
CN110463225B (zh) * 2017-03-30 2021-09-03 思睿逻辑国际半导体有限公司 用于监控麦克风的装置和方法
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Publication number Publication date
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US20100119097A1 (en) 2010-05-13
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Application publication date: 20100331