JP2009010074A5 - - Google Patents

Download PDF

Info

Publication number
JP2009010074A5
JP2009010074A5 JP2007168502A JP2007168502A JP2009010074A5 JP 2009010074 A5 JP2009010074 A5 JP 2009010074A5 JP 2007168502 A JP2007168502 A JP 2007168502A JP 2007168502 A JP2007168502 A JP 2007168502A JP 2009010074 A5 JP2009010074 A5 JP 2009010074A5
Authority
JP
Japan
Prior art keywords
mounting
electronic component
mounting substrate
bonding
bonding head
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2007168502A
Other languages
English (en)
Japanese (ja)
Other versions
JP4958655B2 (ja
JP2009010074A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2007168502A priority Critical patent/JP4958655B2/ja
Priority claimed from JP2007168502A external-priority patent/JP4958655B2/ja
Priority to KR1020080058249A priority patent/KR20080114531A/ko
Priority to US12/146,936 priority patent/US7712649B2/en
Priority to CNA2008101261380A priority patent/CN101335222A/zh
Publication of JP2009010074A publication Critical patent/JP2009010074A/ja
Publication of JP2009010074A5 publication Critical patent/JP2009010074A5/ja
Application granted granted Critical
Publication of JP4958655B2 publication Critical patent/JP4958655B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2007168502A 2007-06-27 2007-06-27 電子部品実装装置および電子装置の製造方法 Expired - Fee Related JP4958655B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2007168502A JP4958655B2 (ja) 2007-06-27 2007-06-27 電子部品実装装置および電子装置の製造方法
KR1020080058249A KR20080114531A (ko) 2007-06-27 2008-06-20 전자 부품 실장 장치 및 전자 장치의 제조 방법
US12/146,936 US7712649B2 (en) 2007-06-27 2008-06-26 Using a simultaneously tilting and moving bonding apparatus
CNA2008101261380A CN101335222A (zh) 2007-06-27 2008-06-27 电子元件安装装置及制造电子器件的方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007168502A JP4958655B2 (ja) 2007-06-27 2007-06-27 電子部品実装装置および電子装置の製造方法

Publications (3)

Publication Number Publication Date
JP2009010074A JP2009010074A (ja) 2009-01-15
JP2009010074A5 true JP2009010074A5 (enExample) 2010-04-22
JP4958655B2 JP4958655B2 (ja) 2012-06-20

Family

ID=40159163

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007168502A Expired - Fee Related JP4958655B2 (ja) 2007-06-27 2007-06-27 電子部品実装装置および電子装置の製造方法

Country Status (4)

Country Link
US (1) US7712649B2 (enExample)
JP (1) JP4958655B2 (enExample)
KR (1) KR20080114531A (enExample)
CN (1) CN101335222A (enExample)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8052029B1 (en) * 2010-09-01 2011-11-08 GM Global Technology Operations LLC Method of calibrating a friction stir spot welding system
US9314869B2 (en) * 2012-01-13 2016-04-19 Asm Technology Singapore Pte. Ltd. Method of recovering a bonding apparatus from a bonding failure
US8870051B2 (en) 2012-05-03 2014-10-28 International Business Machines Corporation Flip chip assembly apparatus employing a warpage-suppressor assembly
CH707480B1 (de) * 2013-01-21 2016-08-31 Besi Switzerland Ag Bondkopf mit einem heiz- und kühlbaren Saugorgan.
CH707934B1 (de) * 2013-04-19 2017-04-28 Besi Switzerland Ag Verfahren zum Montieren von elektronischen oder optischen Bauelementen auf einem Substrat.
JP5608829B1 (ja) * 2014-03-31 2014-10-15 アルファーデザイン株式会社 部品実装装置
CN104439777B (zh) * 2014-11-10 2016-03-30 深圳市鹏煜威科技有限公司 一种机脚夹持装置
US9929121B2 (en) 2015-08-31 2018-03-27 Kulicke And Soffa Industries, Inc. Bonding machines for bonding semiconductor elements, methods of operating bonding machines, and techniques for improving UPH on such bonding machines
WO2018146880A1 (ja) * 2017-02-09 2018-08-16 ボンドテック株式会社 部品実装システム、樹脂成形装置、部品実装方法および樹脂成形方法
US10571682B2 (en) 2017-08-10 2020-02-25 Infineon Technologies Ag Tilted chip assembly for optical devices
JP6831478B2 (ja) * 2017-12-07 2021-02-24 ヤマハ発動機株式会社 被実装物作業装置
DE102018115144A1 (de) * 2018-06-23 2019-12-24 Besi Switzerland Ag Stellantrieb für einen Bondkopf
US12266556B2 (en) * 2022-04-12 2025-04-01 Kulicke And Soffa Industries, Inc. Methods of adjusting a tilt between a bonding tool assembly and a support structure assembly of a bonding system
CN117198896B (zh) * 2022-05-31 2024-07-19 长沙瑶华半导体科技有限公司 一种曲面法兰表面多点测高贴片方法
CN118046150B (zh) * 2024-04-11 2024-06-21 潍坊鸿洋机械科技有限公司 一种汽车排气管制作加工焊接装置

Family Cites Families (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3722062A (en) * 1971-11-04 1973-03-27 Warwick Electronics Inc Component insertion system
JPS5638892A (en) * 1979-09-06 1981-04-14 Matsushita Electric Industrial Co Ltd Apparatus for mounting electronic part
US4600228A (en) * 1984-05-31 1986-07-15 Sperry Corporation Lockable compliant end effector apparatus
US4899921A (en) * 1988-10-28 1990-02-13 The American Optical Corporation Aligner bonder
JPH02296400A (ja) * 1989-05-11 1990-12-06 Nippondenso Co Ltd 異形部品自動組付装置
US5029383A (en) * 1990-06-07 1991-07-09 Universal Instruments Corporation Articulating tip for pick and place head
US5262355A (en) * 1990-06-19 1993-11-16 Sumitomo Electric Industries, Ltd. Method for packaging a semiconductor device
US5185509A (en) * 1991-02-19 1993-02-09 Toddco General, Inc. Robotic arm tool mounting apparatus
US5127573A (en) * 1991-05-22 1992-07-07 Industrial Technology Research Institute Tape automated bonding apparatus with automatic leveling stage
JPH05326638A (ja) * 1992-05-15 1993-12-10 Sumitomo Electric Ind Ltd 半導体チップ実装方法および実装装置
JPH05326633A (ja) * 1992-05-15 1993-12-10 Sumitomo Electric Ind Ltd 半導体チップ実装方法および実装装置
TW278212B (enExample) * 1992-05-06 1996-06-11 Sumitomo Electric Industries
CA2096551A1 (en) * 1992-05-22 1993-11-23 Masanori Nishiguchi Semiconductor device
JPH06210475A (ja) * 1993-01-14 1994-08-02 Fanuc Ltd レーザロボットのハイトセンサ装置
US5368217A (en) * 1993-08-25 1994-11-29 Microelectronics And Computer Technology Corporation High force compression flip chip bonding method and system
US5642056A (en) * 1993-12-22 1997-06-24 Tokyo Electron Limited Probe apparatus for correcting the probe card posture before testing
US5435482A (en) * 1994-02-04 1995-07-25 Lsi Logic Corporation Integrated circuit having a coplanar solder ball contact array
JPH07302817A (ja) * 1994-05-06 1995-11-14 Matsushita Electric Ind Co Ltd 半導体素子の接続装置
US5590456A (en) * 1994-12-07 1997-01-07 Lucent Technologies Inc. Apparatus for precise alignment and placement of optoelectric components
US6041996A (en) * 1996-11-22 2000-03-28 Matsushita Electric Industrial Co., Ltd. Method of pressure bonding a bumped electronic part and an apparatus for pressure bonding a bumped electronic part
EP0852983B1 (de) * 1997-01-08 2002-09-04 ESEC Trading SA Einrichtung zum Formen von flüssigen Lotportionen beim Weichlöten von Halbleiterchips
US6006978A (en) * 1997-02-25 1999-12-28 Swanson; David W. Pressure head with pivot rod gimbal horn with zero adjust
US6010056A (en) * 1997-06-18 2000-01-04 Swanson; David W. Gimbal horn pressure head with shape of pivot rod bearing corresponding to shape of contact surface
DE59711263D1 (de) * 1997-10-30 2004-03-04 Esec Trading Sa Verfahren und Einrichtung für die Justierung des Bondkopfs einer Maschine für das Bonden von Halbleiterchips auf ein Trägermaterial
US6048750A (en) * 1997-11-24 2000-04-11 Micron Technology, Inc. Method for aligning and connecting semiconductor components to substrates
JP3400340B2 (ja) * 1998-02-20 2003-04-28 株式会社新川 フリップチップボンディング方法及び装置
US6048656A (en) * 1999-05-11 2000-04-11 Micron Technology, Inc. Void-free underfill of surface mounted chips
JP2002050861A (ja) * 2000-08-01 2002-02-15 Matsushita Electric Ind Co Ltd 常温接合装置及び方法
JP4544755B2 (ja) * 2001-01-17 2010-09-15 パナソニック株式会社 ボンディングヘッド及び部品装着装置
JP3780214B2 (ja) * 2002-01-25 2006-05-31 キヤノン株式会社 Ｉｃの加圧圧着方法
JP2004047670A (ja) 2002-07-11 2004-02-12 Sony Corp フリップチップ実装方法及びフリップチップ実装装置
JP3795024B2 (ja) * 2003-03-04 2006-07-12 東レエンジニアリング株式会社 接合方法および装置
US6756687B1 (en) * 2003-03-05 2004-06-29 Altera Corporation Interfacial strengthening for electroless nickel immersion gold substrates
US6981312B2 (en) * 2003-03-31 2006-01-03 Intel Corporation System for handling microelectronic dies having a non-piercing die ejector
CH696615A5 (de) * 2003-09-22 2007-08-15 Esec Trading Sa Verfahren für die Justierung des Bondkopfs eines Die Bonders.
US7147735B2 (en) * 2004-07-22 2006-12-12 Intel Corporation Vibratable die attachment tool
TWI234804B (en) * 2004-08-03 2005-06-21 Chunghwa Picture Tubes Ltd Chip compressing mechanism and chip compressing process
JP4589160B2 (ja) * 2005-03-28 2010-12-01 芝浦メカトロニクス株式会社 電子部品の実装装置及び実装方法
US7355386B2 (en) * 2005-11-18 2008-04-08 Delta Design, Inc. Method of automatically carrying IC-chips, on a planar array of vacuum nozzles, to a variable target in a chip tester
US7368930B2 (en) * 2006-08-04 2008-05-06 Formfactor, Inc. Adjustment mechanism

Similar Documents

Publication Publication Date Title
JP2009010074A5 (enExample)
JP4958655B2 (ja) 電子部品実装装置および電子装置の製造方法
WO2008024821A3 (en) Apparatus and method for thermal stabilization of pcb-mounted electronic components within an enclosed housing
US11772306B2 (en) Method for producing porous devices
JP2012156539A5 (ja) 露光装置、デバイス製造方法、及びクリーニング方法
CN102449749A (zh) 半导体晶片全通导孔内的金属填充装置和利用该装置的填充方法
JP4628964B2 (ja) 基板処理装置
JP2005354025A5 (enExample)
TW201340246A (zh) 用於重工製程之夾持治具及設備
JP5251456B2 (ja) 半田付け用真空加熱装置
KR101593833B1 (ko) 기판 히팅 유닛 및 이를 포함하는 다이 본딩 장치
JP2017041642A (ja) 半導体ウェーハの検査装置及び半導体ウェーハの検査方法
JP2007088344A5 (enExample)
BR112023001410A2 (pt) Unidade de acoplamento e método de acoplamento para acoplamento de um componente em um contêiner e aparelho para produzir artigos correlacionados aos mesmos
JP5798212B2 (ja) 基板の反りを調整する方法および装置
CN107846788A (zh) 收音机电路板用多工位锡膏涂覆限位套件及限位设备
CN219087335U (zh) 仿芯片测试加热装置
JP2006319345A5 (enExample)
US9908296B2 (en) Apparatus and process for producing porous devices
KR101574392B1 (ko) 곡면유리 몰딩 장치
KR102221257B1 (ko) 기판 히팅 장치
JP2011070085A (ja) 表面加熱装置
CN101183630A (zh) 荧光灯制造装置及利用该装置的外部电极制造方法
JP2011255559A (ja) ラミネート装置
JP4379212B2 (ja) 液晶注入装置