JP4958655B2 - 電子部品実装装置および電子装置の製造方法 - Google Patents

電子部品実装装置および電子装置の製造方法 Download PDF

Info

Publication number
JP4958655B2
JP4958655B2 JP2007168502A JP2007168502A JP4958655B2 JP 4958655 B2 JP4958655 B2 JP 4958655B2 JP 2007168502 A JP2007168502 A JP 2007168502A JP 2007168502 A JP2007168502 A JP 2007168502A JP 4958655 B2 JP4958655 B2 JP 4958655B2
Authority
JP
Japan
Prior art keywords
electronic component
mounting
mounting substrate
substrate
mounting apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2007168502A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009010074A (ja
JP2009010074A5 (enExample
Inventor
俊幸 倉持
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2007168502A priority Critical patent/JP4958655B2/ja
Priority to KR1020080058249A priority patent/KR20080114531A/ko
Priority to US12/146,936 priority patent/US7712649B2/en
Priority to CNA2008101261380A priority patent/CN101335222A/zh
Publication of JP2009010074A publication Critical patent/JP2009010074A/ja
Publication of JP2009010074A5 publication Critical patent/JP2009010074A5/ja
Application granted granted Critical
Publication of JP4958655B2 publication Critical patent/JP4958655B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H01L2224/13001—Core members of the bump connector
    • H01L2224/13099—Material
    • H01L2224/131—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/757—Means for aligning
    • H01L2224/75753—Means for optical alignment, e.g. sensors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/758—Means for moving parts
    • H01L2224/75841—Means for moving parts of the bonding head
    • H01L2224/75842—Rotational mechanism
    • H01L2224/75843—Pivoting mechanism
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
    • H01L2224/92—Specific sequence of method steps
    • H01L2224/921—Connecting a surface with connectors of different types
    • H01L2224/9212—Sequential connecting processes
    • H01L2224/92122—Sequential connecting processes the first connecting process involving a bump connector
    • H01L2224/92125—Sequential connecting processes the first connecting process involving a bump connector the second connecting process involving a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base
    • Y10T29/49149—Assembling terminal to base by metal fusion bonding

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP2007168502A 2007-06-27 2007-06-27 電子部品実装装置および電子装置の製造方法 Expired - Fee Related JP4958655B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2007168502A JP4958655B2 (ja) 2007-06-27 2007-06-27 電子部品実装装置および電子装置の製造方法
KR1020080058249A KR20080114531A (ko) 2007-06-27 2008-06-20 전자 부품 실장 장치 및 전자 장치의 제조 방법
US12/146,936 US7712649B2 (en) 2007-06-27 2008-06-26 Using a simultaneously tilting and moving bonding apparatus
CNA2008101261380A CN101335222A (zh) 2007-06-27 2008-06-27 电子元件安装装置及制造电子器件的方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007168502A JP4958655B2 (ja) 2007-06-27 2007-06-27 電子部品実装装置および電子装置の製造方法

Publications (3)

Publication Number Publication Date
JP2009010074A JP2009010074A (ja) 2009-01-15
JP2009010074A5 JP2009010074A5 (enExample) 2010-04-22
JP4958655B2 true JP4958655B2 (ja) 2012-06-20

Family

ID=40159163

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007168502A Expired - Fee Related JP4958655B2 (ja) 2007-06-27 2007-06-27 電子部品実装装置および電子装置の製造方法

Country Status (4)

Country Link
US (1) US7712649B2 (enExample)
JP (1) JP4958655B2 (enExample)
KR (1) KR20080114531A (enExample)
CN (1) CN101335222A (enExample)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8052029B1 (en) * 2010-09-01 2011-11-08 GM Global Technology Operations LLC Method of calibrating a friction stir spot welding system
US9314869B2 (en) * 2012-01-13 2016-04-19 Asm Technology Singapore Pte. Ltd. Method of recovering a bonding apparatus from a bonding failure
US8870051B2 (en) 2012-05-03 2014-10-28 International Business Machines Corporation Flip chip assembly apparatus employing a warpage-suppressor assembly
CH707480B1 (de) * 2013-01-21 2016-08-31 Besi Switzerland Ag Bondkopf mit einem heiz- und kühlbaren Saugorgan.
CH707934B1 (de) * 2013-04-19 2017-04-28 Besi Switzerland Ag Verfahren zum Montieren von elektronischen oder optischen Bauelementen auf einem Substrat.
JP5608829B1 (ja) * 2014-03-31 2014-10-15 アルファーデザイン株式会社 部品実装装置
CN104439777B (zh) * 2014-11-10 2016-03-30 深圳市鹏煜威科技有限公司 一种机脚夹持装置
US9929121B2 (en) 2015-08-31 2018-03-27 Kulicke And Soffa Industries, Inc. Bonding machines for bonding semiconductor elements, methods of operating bonding machines, and techniques for improving UPH on such bonding machines
WO2018146880A1 (ja) * 2017-02-09 2018-08-16 ボンドテック株式会社 部品実装システム、樹脂成形装置、部品実装方法および樹脂成形方法
US10571682B2 (en) 2017-08-10 2020-02-25 Infineon Technologies Ag Tilted chip assembly for optical devices
JP6831478B2 (ja) * 2017-12-07 2021-02-24 ヤマハ発動機株式会社 被実装物作業装置
DE102018115144A1 (de) * 2018-06-23 2019-12-24 Besi Switzerland Ag Stellantrieb für einen Bondkopf
US12266556B2 (en) * 2022-04-12 2025-04-01 Kulicke And Soffa Industries, Inc. Methods of adjusting a tilt between a bonding tool assembly and a support structure assembly of a bonding system
CN117198896B (zh) * 2022-05-31 2024-07-19 长沙瑶华半导体科技有限公司 一种曲面法兰表面多点测高贴片方法
CN118046150B (zh) * 2024-04-11 2024-06-21 潍坊鸿洋机械科技有限公司 一种汽车排气管制作加工焊接装置

Family Cites Families (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3722062A (en) * 1971-11-04 1973-03-27 Warwick Electronics Inc Component insertion system
JPS5638892A (en) * 1979-09-06 1981-04-14 Matsushita Electric Industrial Co Ltd Apparatus for mounting electronic part
US4600228A (en) * 1984-05-31 1986-07-15 Sperry Corporation Lockable compliant end effector apparatus
US4899921A (en) * 1988-10-28 1990-02-13 The American Optical Corporation Aligner bonder
JPH02296400A (ja) * 1989-05-11 1990-12-06 Nippondenso Co Ltd 異形部品自動組付装置
US5029383A (en) * 1990-06-07 1991-07-09 Universal Instruments Corporation Articulating tip for pick and place head
US5262355A (en) * 1990-06-19 1993-11-16 Sumitomo Electric Industries, Ltd. Method for packaging a semiconductor device
US5185509A (en) * 1991-02-19 1993-02-09 Toddco General, Inc. Robotic arm tool mounting apparatus
US5127573A (en) * 1991-05-22 1992-07-07 Industrial Technology Research Institute Tape automated bonding apparatus with automatic leveling stage
JPH05326638A (ja) * 1992-05-15 1993-12-10 Sumitomo Electric Ind Ltd 半導体チップ実装方法および実装装置
JPH05326633A (ja) * 1992-05-15 1993-12-10 Sumitomo Electric Ind Ltd 半導体チップ実装方法および実装装置
TW278212B (enExample) * 1992-05-06 1996-06-11 Sumitomo Electric Industries
CA2096551A1 (en) * 1992-05-22 1993-11-23 Masanori Nishiguchi Semiconductor device
JPH06210475A (ja) * 1993-01-14 1994-08-02 Fanuc Ltd レーザロボットのハイトセンサ装置
US5368217A (en) * 1993-08-25 1994-11-29 Microelectronics And Computer Technology Corporation High force compression flip chip bonding method and system
US5642056A (en) * 1993-12-22 1997-06-24 Tokyo Electron Limited Probe apparatus for correcting the probe card posture before testing
US5435482A (en) * 1994-02-04 1995-07-25 Lsi Logic Corporation Integrated circuit having a coplanar solder ball contact array
JPH07302817A (ja) * 1994-05-06 1995-11-14 Matsushita Electric Ind Co Ltd 半導体素子の接続装置
US5590456A (en) * 1994-12-07 1997-01-07 Lucent Technologies Inc. Apparatus for precise alignment and placement of optoelectric components
US6041996A (en) * 1996-11-22 2000-03-28 Matsushita Electric Industrial Co., Ltd. Method of pressure bonding a bumped electronic part and an apparatus for pressure bonding a bumped electronic part
EP0852983B1 (de) * 1997-01-08 2002-09-04 ESEC Trading SA Einrichtung zum Formen von flüssigen Lotportionen beim Weichlöten von Halbleiterchips
US6006978A (en) * 1997-02-25 1999-12-28 Swanson; David W. Pressure head with pivot rod gimbal horn with zero adjust
US6010056A (en) * 1997-06-18 2000-01-04 Swanson; David W. Gimbal horn pressure head with shape of pivot rod bearing corresponding to shape of contact surface
DE59711263D1 (de) * 1997-10-30 2004-03-04 Esec Trading Sa Verfahren und Einrichtung für die Justierung des Bondkopfs einer Maschine für das Bonden von Halbleiterchips auf ein Trägermaterial
US6048750A (en) * 1997-11-24 2000-04-11 Micron Technology, Inc. Method for aligning and connecting semiconductor components to substrates
JP3400340B2 (ja) * 1998-02-20 2003-04-28 株式会社新川 フリップチップボンディング方法及び装置
US6048656A (en) * 1999-05-11 2000-04-11 Micron Technology, Inc. Void-free underfill of surface mounted chips
JP2002050861A (ja) * 2000-08-01 2002-02-15 Matsushita Electric Ind Co Ltd 常温接合装置及び方法
JP4544755B2 (ja) * 2001-01-17 2010-09-15 パナソニック株式会社 ボンディングヘッド及び部品装着装置
JP3780214B2 (ja) * 2002-01-25 2006-05-31 キヤノン株式会社 Ｉｃの加圧圧着方法
JP2004047670A (ja) 2002-07-11 2004-02-12 Sony Corp フリップチップ実装方法及びフリップチップ実装装置
JP3795024B2 (ja) * 2003-03-04 2006-07-12 東レエンジニアリング株式会社 接合方法および装置
US6756687B1 (en) * 2003-03-05 2004-06-29 Altera Corporation Interfacial strengthening for electroless nickel immersion gold substrates
US6981312B2 (en) * 2003-03-31 2006-01-03 Intel Corporation System for handling microelectronic dies having a non-piercing die ejector
CH696615A5 (de) * 2003-09-22 2007-08-15 Esec Trading Sa Verfahren für die Justierung des Bondkopfs eines Die Bonders.
US7147735B2 (en) * 2004-07-22 2006-12-12 Intel Corporation Vibratable die attachment tool
TWI234804B (en) * 2004-08-03 2005-06-21 Chunghwa Picture Tubes Ltd Chip compressing mechanism and chip compressing process
JP4589160B2 (ja) * 2005-03-28 2010-12-01 芝浦メカトロニクス株式会社 電子部品の実装装置及び実装方法
US7355386B2 (en) * 2005-11-18 2008-04-08 Delta Design, Inc. Method of automatically carrying IC-chips, on a planar array of vacuum nozzles, to a variable target in a chip tester
US7368930B2 (en) * 2006-08-04 2008-05-06 Formfactor, Inc. Adjustment mechanism

Also Published As

Publication number Publication date
US7712649B2 (en) 2010-05-11
CN101335222A (zh) 2008-12-31
KR20080114531A (ko) 2008-12-31
JP2009010074A (ja) 2009-01-15
US20090001133A1 (en) 2009-01-01

Similar Documents

Publication Publication Date Title
JP4958655B2 (ja) 電子部品実装装置および電子装置の製造方法
CN100461358C (zh) 元器件安装方法及元器件安装装置
JP6029245B2 (ja) 圧着装置および圧着方法
KR20120109963A (ko) 접합장치 및 접합방법
US7828193B2 (en) Method of mounting an electronic component and mounting apparatus
WO2010053454A1 (en) In-situ melt and reflow process for forming flip-chip interconnections and system thereof
WO2009122711A1 (ja) 部品実装装置および方法
WO2019054284A1 (ja) 圧着ヘッドおよび実装装置
JP2002110744A (ja) 半導体実装装置、および半導体実装方法
JP2011066027A (ja) 矯正キャップ
US7306133B2 (en) System for fabricating an integrated circuit package on a printed circuit board
US7687314B2 (en) Electronic apparatus manufacturing method
JPWO2014188768A1 (ja) 電子部品実装装置および電子部品の製造方法
JP5013318B2 (ja) 電子部品の実装装置及び実装方法
JP4515813B2 (ja) 部品実装機
JP2010103270A (ja) 半導体装置および半導体装置の製造方法
JP4619209B2 (ja) 半導体素子実装方法および半導体素子実装装置
KR101330225B1 (ko) 기판 접합 방법 및 기판 리플로우 처리 장치
KR102217826B1 (ko) 실장 장치 및 실장 방법
JP6770832B2 (ja) 接合方法、プログラム、コンピュータ記憶媒体、接合装置及び接合システム
JP5277894B2 (ja) 樹脂塗布方法及び樹脂塗布装置
JP2010278250A (ja) 半導体装置の製造方法
JP2012243951A (ja) マスクを用いてワークに導電性ボールを搭載する方法
JP2007115873A (ja) 電子部品実装方法及び実装装置
JP5627057B1 (ja) 部品実装装置

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20100301

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20100304

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20111209

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20111220

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20120213

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20120306

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20120319

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20150330

Year of fee payment: 3

R150 Certificate of patent or registration of utility model

Ref document number: 4958655

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

LAPS Cancellation because of no payment of annual fees