JP2008539473A - 印刷された要素を有する積層構造 - Google Patents

印刷された要素を有する積層構造 Download PDF

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Publication number
JP2008539473A
JP2008539473A JP2008506558A JP2008506558A JP2008539473A JP 2008539473 A JP2008539473 A JP 2008539473A JP 2008506558 A JP2008506558 A JP 2008506558A JP 2008506558 A JP2008506558 A JP 2008506558A JP 2008539473 A JP2008539473 A JP 2008539473A
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JP
Japan
Prior art keywords
layer
component
display
integrated circuit
laminated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2008506558A
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English (en)
Japanese (ja)
Other versions
JP2008539473A5 (enExample
Inventor
ジェイ． ペナツ，トーマス
エフ． クィンドレン，スティーブン
ジー． サイム，デイビッド
ピー． マクドウガル，ジェイムズ
Original Assignee
アベソ，インコーポレイティド
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by アベソ，インコーポレイティド filed Critical アベソ，インコーポレイティド
Publication of JP2008539473A publication Critical patent/JP2008539473A/ja
Publication of JP2008539473A5 publication Critical patent/JP2008539473A5/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M6/00—Primary cells; Manufacture thereof
    • H01M6/40—Printed batteries, e.g. thin film batteries
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/42—Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
    • H01M10/425—Structural combination with electronic components, e.g. electronic circuits integrated to the outside of the casing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/06—Arrangements of circuit components or wiring on supporting structure on insulating boards, e.g. wiring harnesses
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10037—Printed or non-printed battery
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1311—Foil encapsulation, e.g. of mounted components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24926—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including ceramic, glass, porcelain or quartz layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
JP2008506558A 2005-04-11 2006-04-10 印刷された要素を有する積層構造 Pending JP2008539473A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US67007605P 2005-04-11 2005-04-11
US11/209,345 US7599192B2 (en) 2005-04-11 2005-08-22 Layered structure with printed elements
PCT/US2006/013225 WO2006110616A2 (en) 2005-04-11 2006-04-10 Layered structure with printed elements

Publications (2)

Publication Number Publication Date
JP2008539473A true JP2008539473A (ja) 2008-11-13
JP2008539473A5 JP2008539473A5 (enExample) 2009-06-04

Family

ID=37082943

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008506558A Pending JP2008539473A (ja) 2005-04-11 2006-04-10 印刷された要素を有する積層構造

Country Status (6)

Country Link
US (1) US7599192B2 (enExample)
EP (1) EP1872641A4 (enExample)
JP (1) JP2008539473A (enExample)
KR (1) KR20070119747A (enExample)
BR (1) BRPI0610500A2 (enExample)
WO (1) WO2006110616A2 (enExample)

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JP2010186375A (ja) * 2009-02-13 2010-08-26 Toppan Forms Co Ltd Ｉｃカードおよびその製造方法
JP2011134290A (ja) * 2009-12-22 2011-07-07 Anica Corp ディスプレイ機能を有するフレキシブル・カード
WO2012077632A1 (ja) * 2010-12-06 2012-06-14 大日本印刷株式会社 電子部品内蔵カード
JP2013519964A (ja) * 2010-02-16 2013-05-30 ダイナミックス インコーポレイテッド 動的磁気ストライプ通信装置の駆動回路のためのシステム及び方法
KR20140025436A (ko) * 2011-06-01 2014-03-04 분데스드룩커라이 게엠베하 보안 또는 유가 문서 및 이의 생산 방법
KR101991177B1 (ko) * 2016-10-13 2019-06-19 프로로지움 테크놀로지 코., 엘티디. 논리 배터리
WO2020032386A1 (ko) * 2018-08-06 2020-02-13 삼성전자 주식회사 디스플레이의 후면에 배치된 센서 및 탄성 부재 사이의 높이 차를 보상하는 구조를 포함하는 전자 장치
KR20200074159A (ko) * 2017-10-18 2020-06-24 컴포시큐어 엘엘씨 윈도우 또는 윈도우 패턴 및 선택적인 백라이팅을 갖는 금속, 세라믹, 또는 세라믹 코팅된 트랜잭션 카드
WO2023027075A1 (ja) * 2021-08-27 2023-03-02 日本碍子株式会社 通信装置、スマートメーター、二次電池
US12254367B2 (en) 2017-09-07 2025-03-18 Composecure, Llc Metal, ceramic, or ceramic-coated transaction card with window or window pattern and optional backlighting

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US8722233B2 (en) 2005-05-06 2014-05-13 Blue Spark Technologies, Inc. RFID antenna-battery assembly and the method to make the same
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US7456498B2 (en) * 2006-08-18 2008-11-25 Lsi Logic Corporation Integrated circuit package and system interface
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CN101321195B (zh) * 2007-06-08 2011-11-16 深圳富泰宏精密工业有限公司 便携式电子装置
CN101802848A (zh) 2007-07-18 2010-08-11 蓝色火花科技有限公司 集成电子器件及其制造方法
US8294973B2 (en) * 2007-12-20 2012-10-23 Gemalto, S.A. Electrochromic display substrate
US9010630B2 (en) * 2007-12-24 2015-04-21 Dynamics Inc. Systems and methods for programmable payment cards and devices with loyalty-based payment applications
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US8141780B2 (en) 2008-02-23 2012-03-27 Cedar Ridge Research Llc System and method for data card emulation
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JP5181759B2 (ja) * 2008-03-21 2013-04-10 ソニー株式会社 Ｉｃカード
US9892663B2 (en) * 2008-07-03 2018-02-13 Chromera, Inc. Intelligent label device and method
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DE102008051110B4 (de) * 2008-10-09 2017-09-21 Giesecke+Devrient Mobile Security Gmbh Batteriesystem für einen tragbaren Datenträger
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JP6178428B2 (ja) 2012-11-27 2017-08-09 ブルー スパーク テクノロジーズ，インク． バッテリセル構成
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