JP2008533699A - プリント回路基板のための埋め込み過渡保護の選択的な堆積 - Google Patents

プリント回路基板のための埋め込み過渡保護の選択的な堆積 Download PDF

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Publication number
JP2008533699A
JP2008533699A JP2007553397A JP2007553397A JP2008533699A JP 2008533699 A JP2008533699 A JP 2008533699A JP 2007553397 A JP2007553397 A JP 2007553397A JP 2007553397 A JP2007553397 A JP 2007553397A JP 2008533699 A JP2008533699 A JP 2008533699A
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JP
Japan
Prior art keywords
transient protection
printed circuit
circuit board
transient
conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007553397A
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English (en)
Japanese (ja)
Inventor
ジョージ ドゥドニコヴ，
フランズ ギジン，
グレゴリー スクローダー，
Original Assignee
サンミナ−エスシーアイ コーポレーション
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Publication date
Application filed by サンミナ−エスシーアイ コーポレーション filed Critical サンミナ−エスシーアイ コーポレーション
Publication of JP2008533699A publication Critical patent/JP2008533699A/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
    • H05K1/0257—Overvoltage protection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
    • H05K1/0257—Overvoltage protection
    • H05K1/0259—Electrostatic discharge [ESD] protection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/073—High voltage adaptations
    • H05K2201/0738—Use of voltage responsive materials, e.g. voltage switchable dielectric or varistor materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09309—Core having two or more power planes; Capacitive laminate of two power planes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/80—Arrangements for protection of devices protecting against overcurrent or overload, e.g. fuses or shunts

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Laminated Bodies (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2007553397A 2005-02-16 2006-02-16 プリント回路基板のための埋め込み過渡保護の選択的な堆積 Pending JP2008533699A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US65372305P 2005-02-16 2005-02-16
PCT/US2006/005984 WO2006089272A2 (en) 2005-02-16 2006-02-16 Selective deposition of embedded transient protection for printed circuit boards

Publications (1)

Publication Number Publication Date
JP2008533699A true JP2008533699A (ja) 2008-08-21

Family

ID=36917156

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2007553397A Pending JP2008533699A (ja) 2005-02-16 2006-02-16 プリント回路基板のための埋め込み過渡保護の選択的な堆積
JP2007553396A Expired - Fee Related JP5241238B2 (ja) 2005-02-16 2006-02-16 プリント回路基板のための埋め込み過渡保護の実質的に連続する層
JP2011002220A Expired - Fee Related JP5588362B2 (ja) 2005-02-16 2011-01-07 プリント回路基板のための埋め込み過渡保護の実質的に連続する層

Family Applications After (2)

Application Number Title Priority Date Filing Date
JP2007553396A Expired - Fee Related JP5241238B2 (ja) 2005-02-16 2006-02-16 プリント回路基板のための埋め込み過渡保護の実質的に連続する層
JP2011002220A Expired - Fee Related JP5588362B2 (ja) 2005-02-16 2011-01-07 プリント回路基板のための埋め込み過渡保護の実質的に連続する層

Country Status (5)

Country Link
US (2) US7688598B2 (https=)
JP (3) JP2008533699A (https=)
CN (2) CN101595769B (https=)
TW (2) TWI397356B (https=)
WO (2) WO2006089272A2 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020080419A (ja) * 2011-09-21 2020-05-28 リテルヒューズ・インク Ｅｓｄ保護のための垂直スイッチング構成

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Publication number Priority date Publication date Assignee Title
JP2020080419A (ja) * 2011-09-21 2020-05-28 リテルヒューズ・インク Ｅｓｄ保護のための垂直スイッチング構成

Also Published As

Publication number Publication date
WO2007050114A3 (en) 2007-12-21
TWI375494B (en) 2012-10-21
US20060181826A1 (en) 2006-08-17
JP2011109121A (ja) 2011-06-02
US7688598B2 (en) 2010-03-30
CN101595769B (zh) 2011-09-14
CN101189365B (zh) 2015-09-16
WO2006089272A2 (en) 2006-08-24
TWI397356B (zh) 2013-05-21
JP5588362B2 (ja) 2014-09-10
US20060181827A1 (en) 2006-08-17
JP2008529309A (ja) 2008-07-31
WO2007050114A2 (en) 2007-05-03
TW200642547A (en) 2006-12-01
TW200642548A (en) 2006-12-01
US7593203B2 (en) 2009-09-22
WO2006089272A3 (en) 2009-04-16
JP5241238B2 (ja) 2013-07-17
CN101189365A (zh) 2008-05-28
CN101595769A (zh) 2009-12-02

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