JP2008528987A5 - - Google Patents
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- Publication number
- JP2008528987A5 JP2008528987A5 JP2007552618A JP2007552618A JP2008528987A5 JP 2008528987 A5 JP2008528987 A5 JP 2008528987A5 JP 2007552618 A JP2007552618 A JP 2007552618A JP 2007552618 A JP2007552618 A JP 2007552618A JP 2008528987 A5 JP2008528987 A5 JP 2008528987A5
- Authority
- JP
- Japan
- Prior art keywords
- cap
- sensor
- substrate
- optical element
- sensor element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims 42
- 230000003287 optical effect Effects 0.000 claims 31
- 239000000463 material Substances 0.000 claims 10
- 230000005855 radiation Effects 0.000 claims 8
- 239000007789 gas Substances 0.000 claims 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims 2
- 238000003384 imaging method Methods 0.000 claims 2
- 238000000034 method Methods 0.000 claims 2
- 150000001875 compounds Chemical class 0.000 claims 1
- 238000001514 detection method Methods 0.000 claims 1
- 230000007613 environmental effect Effects 0.000 claims 1
- 229910052757 nitrogen Inorganic materials 0.000 claims 1
- 238000005192 partition Methods 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 claims 1
- 239000010703 silicon Substances 0.000 claims 1
- 238000001228 spectrum Methods 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/045,910 US7326932B2 (en) | 2005-01-26 | 2005-01-26 | Sensor and cap arrangement |
| PCT/EP2006/050174 WO2006079588A1 (en) | 2005-01-26 | 2006-01-12 | A sensor |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013006435A Division JP2013083669A (ja) | 2005-01-26 | 2013-01-17 | センサ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2008528987A JP2008528987A (ja) | 2008-07-31 |
| JP2008528987A5 true JP2008528987A5 (https=) | 2009-02-26 |
Family
ID=36092860
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007552618A Pending JP2008528987A (ja) | 2005-01-26 | 2006-01-12 | センサ |
| JP2013006435A Pending JP2013083669A (ja) | 2005-01-26 | 2013-01-17 | センサ |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013006435A Pending JP2013083669A (ja) | 2005-01-26 | 2013-01-17 | センサ |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US7326932B2 (https=) |
| EP (1) | EP1842040B1 (https=) |
| JP (2) | JP2008528987A (https=) |
| CN (1) | CN101107500B (https=) |
| TW (1) | TWI293362B (https=) |
| WO (1) | WO2006079588A1 (https=) |
Families Citing this family (39)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE112005002762T5 (de) | 2004-11-12 | 2007-08-30 | Analog Devices Inc., Norwood | Beabstandete, mit Kontakthöckern versehene Komponenten-Struktur |
| US7326932B2 (en) * | 2005-01-26 | 2008-02-05 | Analog Devices, Inc. | Sensor and cap arrangement |
| US7435964B2 (en) * | 2005-01-26 | 2008-10-14 | Analog Devices, Inc. | Thermal sensor with increased sensitivity |
| US7807972B2 (en) * | 2005-01-26 | 2010-10-05 | Analog Devices, Inc. | Radiation sensor with cap and optical elements |
| US7718967B2 (en) * | 2005-01-26 | 2010-05-18 | Analog Devices, Inc. | Die temperature sensors |
| US7692148B2 (en) | 2005-01-26 | 2010-04-06 | Analog Devices, Inc. | Thermal sensor with thermal barrier |
| US8487260B2 (en) * | 2005-01-26 | 2013-07-16 | Analog Devices, Inc. | Sensor |
| US8476591B2 (en) | 2005-09-21 | 2013-07-02 | Analog Devices, Inc. | Radiation sensor device and method |
| US7897920B2 (en) | 2005-09-21 | 2011-03-01 | Analog Devices, Inc. | Radiation sensor device and method |
| US7986027B2 (en) * | 2006-10-20 | 2011-07-26 | Analog Devices, Inc. | Encapsulated metal resistor |
| US8766186B2 (en) * | 2006-12-27 | 2014-07-01 | Analog Devices, Inc. | Control aperture for an IR sensor |
| US8523427B2 (en) | 2008-02-27 | 2013-09-03 | Analog Devices, Inc. | Sensor device with improved sensitivity to temperature variation in a semiconductor substrate |
| WO2009129198A1 (en) * | 2008-04-15 | 2009-10-22 | Analog Devices, Inc. | Wafer level csp sensor |
| FR2936868B1 (fr) * | 2008-10-07 | 2011-02-18 | Ulis | Detecteur thermique a micro-encapsulation. |
| US8390083B2 (en) | 2009-09-04 | 2013-03-05 | Analog Devices, Inc. | System with recessed sensing or processing elements |
| US9407997B2 (en) | 2010-10-12 | 2016-08-02 | Invensense, Inc. | Microphone package with embedded ASIC |
| FR2985576B1 (fr) * | 2012-01-05 | 2014-10-17 | Ulis | Detecteur infrarouge comportant un boitier integrant au moins un reseau de diffraction |
| JP6100882B2 (ja) * | 2012-03-20 | 2017-03-22 | エーエスエムエル ネザーランズ ビー.ブイ. | リソグラフィ装置、センサ及び方法 |
| US9823115B2 (en) | 2012-07-12 | 2017-11-21 | Pixart Imaging Inc. | Packaged optical device having a specular reflection configuration |
| JP6339669B2 (ja) | 2013-07-08 | 2018-06-06 | モーション・エンジン・インコーポレーテッド | Memsデバイスおよび製造する方法 |
| US10273147B2 (en) | 2013-07-08 | 2019-04-30 | Motion Engine Inc. | MEMS components and method of wafer-level manufacturing thereof |
| WO2015013827A1 (en) | 2013-08-02 | 2015-02-05 | Motion Engine Inc. | Mems motion sensor for sub-resonance angular rate sensing |
| CN105190264A (zh) * | 2013-09-18 | 2015-12-23 | 上海巨哥电子科技有限公司 | 一种封装非制冷焦平面阵列的方法与焦平面阵列装置 |
| CN104576883B (zh) | 2013-10-29 | 2018-11-16 | 普因特工程有限公司 | 芯片安装用阵列基板及其制造方法 |
| WO2015103688A1 (en) | 2014-01-09 | 2015-07-16 | Motion Engine Inc. | Integrated mems system |
| JP6167926B2 (ja) * | 2014-02-11 | 2017-07-26 | 株式会社デンソー | 赤外線検出装置 |
| US20170030788A1 (en) | 2014-04-10 | 2017-02-02 | Motion Engine Inc. | Mems pressure sensor |
| US11674803B2 (en) | 2014-06-02 | 2023-06-13 | Motion Engine, Inc. | Multi-mass MEMS motion sensor |
| US10231629B1 (en) * | 2014-08-25 | 2019-03-19 | Maxim Integrated Products, Inc. | Mobile integrated electrode multifunction sensor and method |
| US11287486B2 (en) | 2014-12-09 | 2022-03-29 | Motion Engine, Inc. | 3D MEMS magnetometer and associated methods |
| WO2016112463A1 (en) | 2015-01-15 | 2016-07-21 | Motion Engine Inc. | 3d mems device with hermetic cavity |
| US9666558B2 (en) | 2015-06-29 | 2017-05-30 | Point Engineering Co., Ltd. | Substrate for mounting a chip and chip package using the substrate |
| DE102015217290A1 (de) * | 2015-09-10 | 2017-03-16 | Robert Bosch Gmbh | Mikroelektronische Anordnung und entsprechendes Herstellungsverfahren für eine mikroelektronische Anordnung |
| DE102016209798A1 (de) * | 2016-06-03 | 2017-12-07 | Robert Bosch Gmbh | Mikroelektronische Sensorvorrichtung und Verfahren zum Herstellen einer mikroelektronischen Sensorvorrichtung |
| US10976196B2 (en) * | 2017-03-15 | 2021-04-13 | Asml Netherlands B.V. | Sensor mark and a method of manufacturing a sensor mark |
| DE102017206385A1 (de) * | 2017-04-13 | 2018-10-18 | Robert Bosch Gmbh | Verfahren zum Schutz einer MEMS-Einheit vor Infrarot-Untersuchungen sowie MEMS-Einheit |
| EP3511697B1 (de) | 2018-01-12 | 2023-07-12 | Drägerwerk AG & Co. KGaA | Anordnung und verfahren zur analyse eines fluids |
| JP7292077B2 (ja) * | 2018-07-11 | 2023-06-16 | 三菱電機株式会社 | パッケージ素子の製造方法およびパッケージ素子 |
| DE102019119502A1 (de) * | 2019-07-18 | 2021-01-21 | Hamilton Medical Ag | Nichtdispersive Mehrkanal-Sensorbaugruppe mit refraktivem oder/und diffraktivem Strahlenteiler |
Family Cites Families (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58131525A (ja) * | 1982-01-31 | 1983-08-05 | Matsushita Electric Works Ltd | 赤外線検出装置 |
| US7415126B2 (en) * | 1992-05-05 | 2008-08-19 | Automotive Technologies International Inc. | Occupant sensing system |
| US4994664A (en) * | 1989-03-27 | 1991-02-19 | Massachusetts Institute Of Technology | Optically coupled focal plane arrays using lenslets and multiplexers |
| JPH0821703B2 (ja) * | 1990-07-17 | 1996-03-04 | 株式会社東芝 | 固体撮像素子 |
| US5528038A (en) * | 1991-05-07 | 1996-06-18 | Matsushita Electric Industrial Co., Ltd. | Temperature distribution measurement apparatus and its application to a human body detecting system |
| KR970010976B1 (ko) * | 1993-12-31 | 1997-07-05 | 엘지전자 주식회사 | 적외선 어레이센서 장치 |
| US5550373A (en) * | 1994-12-30 | 1996-08-27 | Honeywell Inc. | Fabry-Perot micro filter-detector |
| US5650624A (en) * | 1995-04-13 | 1997-07-22 | Engelhard Sensor Technologies, Inc. | Passive infrared analysis gas sensor |
| JP3613838B2 (ja) * | 1995-05-18 | 2005-01-26 | 株式会社デンソー | 半導体装置の製造方法 |
| GB2310952B (en) * | 1996-03-05 | 1998-08-19 | Mitsubishi Electric Corp | Infrared detector |
| US5701008A (en) * | 1996-11-29 | 1997-12-23 | He Holdings, Inc. | Integrated infrared microlens and gas molecule getter grating in a vacuum package |
| JP3366590B2 (ja) * | 1998-02-04 | 2003-01-14 | 科学技術振興事業団 | 温度測定装置、熱型赤外線イメージセンサ及び温度測定方法 |
| JP3580126B2 (ja) * | 1998-03-12 | 2004-10-20 | オムロン株式会社 | 赤外線センサ |
| JP2000019015A (ja) * | 1998-06-30 | 2000-01-21 | Toshiba Corp | 赤外線検出装置 |
| US6252229B1 (en) * | 1998-07-10 | 2001-06-26 | Boeing North American, Inc. | Sealed-cavity microstructure and microbolometer and associated fabrication methods |
| EP1077386A4 (en) * | 1999-03-03 | 2005-11-30 | Mitsubishi Electric Corp | INFRARED OPTICAL SYSTEM FOR INFRARED CAMERA |
| CA2300400A1 (en) * | 1999-03-22 | 2000-09-22 | Michael George Taranowski | Electronic optical target ranging and imaging |
| JP3573040B2 (ja) * | 1999-05-07 | 2004-10-06 | 三菱電機株式会社 | 赤外線カメラ及び赤外線カメラシステム |
| US6222454B1 (en) * | 1999-07-01 | 2001-04-24 | Goal Electronics Inc. | Non-contacting temperature sensing device |
| JP2001326367A (ja) * | 2000-05-12 | 2001-11-22 | Denso Corp | センサおよびその製造方法 |
| JP2001349787A (ja) * | 2000-06-06 | 2001-12-21 | Seiko Epson Corp | 赤外線検出素子および測温計 |
| WO2002056251A1 (en) * | 2000-12-27 | 2002-07-18 | Mitsubishi Denki Kabushiki Kaisha | Image processing device and elevator mounting it thereon |
| JP2002243908A (ja) * | 2001-02-13 | 2002-08-28 | Minolta Co Ltd | 赤外線用光学素子および赤外線カメラ |
| FR2822541B1 (fr) * | 2001-03-21 | 2003-10-03 | Commissariat Energie Atomique | Procedes et dispositifs de fabrication de detecteurs de rayonnement |
| US6890834B2 (en) * | 2001-06-11 | 2005-05-10 | Matsushita Electric Industrial Co., Ltd. | Electronic device and method for manufacturing the same |
| JP3519720B2 (ja) * | 2001-06-11 | 2004-04-19 | 松下電器産業株式会社 | 電子デバイス |
| US6893574B2 (en) * | 2001-10-23 | 2005-05-17 | Analog Devices Inc | MEMS capping method and apparatus |
| JP2005019966A (ja) * | 2003-06-06 | 2005-01-20 | Sanyo Electric Co Ltd | 半導体装置及びその製造方法 |
| DE102004034066B4 (de) | 2004-07-15 | 2012-10-31 | Bayerische Motoren Werke Aktiengesellschaft | Vorrichtung zur Steuerung der Kühlung einer Brennkraftmaschine für Kraftfahrzeuge |
| US7326932B2 (en) * | 2005-01-26 | 2008-02-05 | Analog Devices, Inc. | Sensor and cap arrangement |
-
2005
- 2005-01-26 US US11/045,910 patent/US7326932B2/en not_active Expired - Lifetime
-
2006
- 2006-01-12 EP EP06701123.9A patent/EP1842040B1/en not_active Expired - Lifetime
- 2006-01-12 WO PCT/EP2006/050174 patent/WO2006079588A1/en not_active Ceased
- 2006-01-12 JP JP2007552618A patent/JP2008528987A/ja active Pending
- 2006-01-12 CN CN2006800032167A patent/CN101107500B/zh not_active Expired - Fee Related
- 2006-01-19 TW TW095102059A patent/TWI293362B/zh not_active IP Right Cessation
-
2013
- 2013-01-17 JP JP2013006435A patent/JP2013083669A/ja active Pending
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