JP2008527743A - Ｃｍｏｓデバイスの自己形成金属シリサイド化ゲート - Google Patents

Ｃｍｏｓデバイスの自己形成金属シリサイド化ゲート Download PDF

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Publication number
JP2008527743A
JP2008527743A JP2007551329A JP2007551329A JP2008527743A JP 2008527743 A JP2008527743 A JP 2008527743A JP 2007551329 A JP2007551329 A JP 2007551329A JP 2007551329 A JP2007551329 A JP 2007551329A JP 2008527743 A JP2008527743 A JP 2008527743A
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JP
Japan
Prior art keywords
layer
silicon material
high temperature
silicide
temperature process
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Pending
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JP2007551329A
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English (en)
Japanese (ja)
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JP2008527743A5 (https=
Inventor
ルオ、ジーチオン
ファン、スンフェイ
チュー、ホイロン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
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International Business Machines Corp
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Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of JP2008527743A publication Critical patent/JP2008527743A/ja
Publication of JP2008527743A5 publication Critical patent/JP2008527743A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00—Electrodes of devices having potential barriers
    • H10D64/60—Electrodes characterised by their materials
    • H10D64/66—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes
    • H10D64/667—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes the conductor comprising a layer of alloy material, compound material or organic material contacting the insulator, e.g. TiN workfunction layers
    • H10D64/668—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes the conductor comprising a layer of alloy material, compound material or organic material contacting the insulator, e.g. TiN workfunction layers the layer being a silicide, e.g. TiSi2
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/01—Manufacture or treatment
    • H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
    • H10D30/0212—Manufacture or treatment of FETs having insulated gates [IGFET] using self-aligned silicidation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/601—Insulated-gate field-effect transistors [IGFET] having lightly-doped drain or source extensions, e.g. LDD IGFETs or DDD IGFETs 
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00—Electrodes of devices having potential barriers
    • H10D64/01—Manufacture or treatment
    • H10D64/013—Manufacture or treatment of electrodes having a conductor capacitively coupled to a semiconductor by an insulator
    • H10D64/01302—Manufacture or treatment of electrodes having a conductor capacitively coupled to a semiconductor by an insulator the insulator being formed after the semiconductor body, the semiconductor being silicon
    • H10D64/01304—Manufacture or treatment of electrodes having a conductor capacitively coupled to a semiconductor by an insulator the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor
    • H10D64/01318—Manufacture or treatment of electrodes having a conductor capacitively coupled to a semiconductor by an insulator the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor the conductor comprising a layer of alloy material, compound material or organic material contacting the insulator, e.g. TiN
    • H10D64/0132—Manufacture or treatment of electrodes having a conductor capacitively coupled to a semiconductor by an insulator the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor the conductor comprising a layer of alloy material, compound material or organic material contacting the insulator, e.g. TiN the conductor being a metallic silicide
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01—Manufacture or treatment
    • H10D84/0123—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs
    • H10D84/0126—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs the components including insulated gates, e.g. IGFETs
    • H10D84/0165—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs the components including insulated gates, e.g. IGFETs the components including complementary IGFETs, e.g. CMOS devices
    • H10D84/0172—Manufacturing their gate conductors
    • H10D84/0174—Manufacturing their gate conductors the gate conductors being silicided
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01—Manufacture or treatment
    • H10D84/02—Manufacture or treatment characterised by using material-based technologies
    • H10D84/03—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology
    • H10D84/038—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology using silicon technology, e.g. SiGe

Landscapes

  • Electrodes Of Semiconductors (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Thin Film Transistor (AREA)
JP2007551329A 2005-01-13 2006-01-10 Ｃｍｏｓデバイスの自己形成金属シリサイド化ゲート Pending JP2008527743A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/905,629 US7105440B2 (en) 2005-01-13 2005-01-13 Self-forming metal silicide gate for CMOS devices
PCT/US2006/000838 WO2006076373A1 (en) 2005-01-13 2006-01-10 Self-forming metal silicide gate for cmos devices

Publications (2)

Publication Number Publication Date
JP2008527743A true JP2008527743A (ja) 2008-07-24
JP2008527743A5 JP2008527743A5 (https=) 2008-12-04

Family

ID=36653783

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007551329A Pending JP2008527743A (ja) 2005-01-13 2006-01-10 Ｃｍｏｓデバイスの自己形成金属シリサイド化ゲート

Country Status (7)

Country Link
US (1) US7105440B2 (https=)
EP (1) EP1856725A4 (https=)
JP (1) JP2008527743A (https=)
KR (1) KR20070095933A (https=)
CN (1) CN100505187C (https=)
TW (1) TW200636920A (https=)
WO (1) WO2006076373A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007080955A (ja) * 2005-09-12 2007-03-29 Nec Corp 半導体装置及びその製造方法

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7687396B2 (en) * 2006-12-29 2010-03-30 Texas Instruments Incorporated Method of forming silicided gates using buried metal layers
KR100852212B1 (ko) 2007-06-12 2008-08-13 삼성전자주식회사 반도체 소자 및 이를 형성하는 방법
US7615831B2 (en) * 2007-10-26 2009-11-10 International Business Machines Corporation Structure and method for fabricating self-aligned metal contacts
US7964923B2 (en) 2008-01-07 2011-06-21 International Business Machines Corporation Structure and method of creating entirely self-aligned metallic contacts
US9165826B2 (en) 2011-08-01 2015-10-20 Taiwan Semiconductor Manufacturing Company, Ltd. Method of forming a semiconductor device comprising titanium silicon oxynitride
US8765603B2 (en) * 2011-08-01 2014-07-01 Taiwan Semiconductor Manufacturing Company, Ltd. Method of forming a buffer layer
US12389616B2 (en) * 2022-02-11 2025-08-12 Globalfoundries U.S. Inc. Transistors with multiple silicide layers

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06244136A (ja) * 1992-12-25 1994-09-02 Hitachi Ltd 半導体装置及びその製造方法
JPH1117182A (ja) * 1997-06-26 1999-01-22 Sony Corp 半導体装置およびその製造方法
JPH11135789A (ja) * 1997-10-31 1999-05-21 Nippon Steel Corp 半導体装置およびその製造方法
JP2000252462A (ja) * 1999-03-01 2000-09-14 Toshiba Corp Ｍｉｓ型半導体装置及びその製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR950003233B1 (ko) * 1992-05-30 1995-04-06 삼성전자 주식회사 이중층 실리사이드 구조를 갖는 반도체 장치 및 그 제조방법
US5444302A (en) * 1992-12-25 1995-08-22 Hitachi, Ltd. Semiconductor device including multi-layer conductive thin film of polycrystalline material
CN1222754A (zh) * 1997-12-19 1999-07-14 西门子公司 在硅化物膜上进行化学汽相淀积的方法和设备
US6562718B1 (en) 2000-12-06 2003-05-13 Advanced Micro Devices, Inc. Process for forming fully silicided gates
US6555453B1 (en) 2001-01-31 2003-04-29 Advanced Micro Devices, Inc. Fully nickel silicided metal gate with shallow junction formed
US6878623B2 (en) * 2001-02-01 2005-04-12 Chartered Semiconductor Manufacturing Ltd. Technique to achieve thick silicide film for ultra-shallow junctions
US7029966B2 (en) * 2003-09-18 2006-04-18 International Business Machines Corporation Process options of forming silicided metal gates for advanced CMOS devices

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06244136A (ja) * 1992-12-25 1994-09-02 Hitachi Ltd 半導体装置及びその製造方法
JPH1117182A (ja) * 1997-06-26 1999-01-22 Sony Corp 半導体装置およびその製造方法
JPH11135789A (ja) * 1997-10-31 1999-05-21 Nippon Steel Corp 半導体装置およびその製造方法
JP2000252462A (ja) * 1999-03-01 2000-09-14 Toshiba Corp Ｍｉｓ型半導体装置及びその製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007080955A (ja) * 2005-09-12 2007-03-29 Nec Corp 半導体装置及びその製造方法

Also Published As

Publication number Publication date
CN100505187C (zh) 2009-06-24
US7105440B2 (en) 2006-09-12
EP1856725A4 (en) 2009-01-14
KR20070095933A (ko) 2007-10-01
EP1856725A1 (en) 2007-11-21
US20060154413A1 (en) 2006-07-13
WO2006076373A1 (en) 2006-07-20
CN101080811A (zh) 2007-11-28
TW200636920A (en) 2006-10-16

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