JP2008527424A5 - - Google Patents
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- Publication number
- JP2008527424A5 JP2008527424A5 JP2007549671A JP2007549671A JP2008527424A5 JP 2008527424 A5 JP2008527424 A5 JP 2008527424A5 JP 2007549671 A JP2007549671 A JP 2007549671A JP 2007549671 A JP2007549671 A JP 2007549671A JP 2008527424 A5 JP2008527424 A5 JP 2008527424A5
- Authority
- JP
- Japan
- Prior art keywords
- conductive member
- electrode
- conductive
- contact
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Claims (1)
- 第1のピクセル駆動回路、第1の導電性部材、および第2の導電性部材を含む基板であって、前記第1および第2の導電性部材が互いに隔置され、前記第1の導電性部材が前記第1のピクセル駆動回路に接続され、前記第2の導電性部材が電力伝送線の一部である、基板と、
第1の電子部品
前記第1の導電性部材と接触する第1の電極、
前記第2の導電性部材に接続されるが接触しない第2の電極、および
前記第1の電極と前記第2の電極との間にある有機層
を含む第1の電子部品と、
第3の導電性部材であって
前記第2の電極および前記第2の導電性部材に接続され、かつ
前記第2の導電性部材と接触する
第3の導電性部材と
を備えたことを特徴とする電子デバイス。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/025,110 | 2004-12-29 | ||
US11/025,110 US7189991B2 (en) | 2004-12-29 | 2004-12-29 | Electronic devices comprising conductive members that connect electrodes to other conductive members within a substrate and processes for forming the electronic devices |
PCT/US2005/047519 WO2006072024A2 (en) | 2004-12-29 | 2005-12-29 | Electronic devices comprising conductive members that connect electrodes to other conductive members within a substrate and processes for forming the electronic devices |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2008527424A JP2008527424A (ja) | 2008-07-24 |
JP2008527424A5 true JP2008527424A5 (ja) | 2009-02-19 |
JP5255279B2 JP5255279B2 (ja) | 2013-08-07 |
Family
ID=36610342
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007549671A Expired - Fee Related JP5255279B2 (ja) | 2004-12-29 | 2005-12-29 | 電極を基板内の他の導電性部材に接続する導電性部材を含む電子デバイス、および電子デバイスを形成するためのプロセス |
Country Status (7)
Country | Link |
---|---|
US (2) | US7189991B2 (ja) |
EP (1) | EP1839336A4 (ja) |
JP (1) | JP5255279B2 (ja) |
KR (1) | KR101261653B1 (ja) |
CN (1) | CN100505288C (ja) |
TW (1) | TWI377711B (ja) |
WO (1) | WO2006072024A2 (ja) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7189991B2 (en) * | 2004-12-29 | 2007-03-13 | E. I. Du Pont De Nemours And Company | Electronic devices comprising conductive members that connect electrodes to other conductive members within a substrate and processes for forming the electronic devices |
US7563392B1 (en) * | 2004-12-30 | 2009-07-21 | E.I. Du Pont De Nemours And Company | Organic conductive compositions and structures |
DE102005037290A1 (de) * | 2005-08-08 | 2007-02-22 | Siemens Ag | Flachbilddetektor |
US7642109B2 (en) * | 2005-08-29 | 2010-01-05 | Eastman Kodak Company | Electrical connection in OLED devices |
US7700471B2 (en) * | 2005-12-13 | 2010-04-20 | Versatilis | Methods of making semiconductor-based electronic devices on a wire and articles that can be made thereby |
US7638416B2 (en) * | 2005-12-13 | 2009-12-29 | Versatilis Llc | Methods of making semiconductor-based electronic devices on a wire and articles that can be made using such devices |
JP5191650B2 (ja) * | 2005-12-16 | 2013-05-08 | シャープ株式会社 | 窒化物半導体発光素子および窒化物半導体発光素子の製造方法 |
US8247824B2 (en) * | 2005-12-19 | 2012-08-21 | Matthew Stainer | Electronic devices comprising electrodes that connect to conductive members within a substrate and processes for forming the electronic devices |
US7314786B1 (en) * | 2006-06-16 | 2008-01-01 | International Business Machines Corporation | Metal resistor, resistor material and method |
US8153029B2 (en) * | 2006-12-28 | 2012-04-10 | E.I. Du Pont De Nemours And Company | Laser (230NM) ablatable compositions of electrically conducting polymers made with a perfluoropolymeric acid applications thereof |
US8227877B2 (en) * | 2010-07-14 | 2012-07-24 | Macronix International Co., Ltd. | Semiconductor bio-sensors and methods of manufacturing the same |
US20230341986A1 (en) * | 2019-10-10 | 2023-10-26 | Corning Incorporated | Systems and methods for forming wrap around electrodes |
US20230087088A1 (en) * | 2021-09-23 | 2023-03-23 | Apple Inc. | Local Passive Matrix Displays |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3530362B2 (ja) * | 1996-12-19 | 2004-05-24 | 三洋電機株式会社 | 自発光型画像表示装置 |
KR100257811B1 (ko) * | 1997-10-24 | 2000-06-01 | 구본준 | 액정표시장치의 기판의 제조방법 |
TW484238B (en) * | 2000-03-27 | 2002-04-21 | Semiconductor Energy Lab | Light emitting device and a method of manufacturing the same |
KR100495702B1 (ko) * | 2001-04-13 | 2005-06-14 | 삼성에스디아이 주식회사 | 유기 전계 발광 표시 장치 및 그 제조 방법 |
KR100437475B1 (ko) * | 2001-04-13 | 2004-06-23 | 삼성에스디아이 주식회사 | 평판 디스플레이 장치용 표시 소자 제조 방법 |
US6900470B2 (en) * | 2001-04-20 | 2005-05-31 | Kabushiki Kaisha Toshiba | Display device and method of manufacturing the same |
KR100682377B1 (ko) * | 2001-05-25 | 2007-02-15 | 삼성전자주식회사 | 유기 전계발광 디바이스 및 이의 제조 방법 |
KR100443831B1 (ko) * | 2001-12-20 | 2004-08-09 | 엘지.필립스 엘시디 주식회사 | 액정표시소자의 제조 방법 |
JP4310984B2 (ja) * | 2002-02-06 | 2009-08-12 | 株式会社日立製作所 | 有機発光表示装置 |
KR100941129B1 (ko) * | 2002-03-26 | 2010-02-09 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 발광장치 및 그의 제조방법 |
KR100435054B1 (ko) * | 2002-05-03 | 2004-06-07 | 엘지.필립스 엘시디 주식회사 | 유기전계 발광소자와 그 제조방법 |
KR100478759B1 (ko) * | 2002-08-20 | 2005-03-24 | 엘지.필립스 엘시디 주식회사 | 유기전계 발광소자와 그 제조방법 |
US7049636B2 (en) * | 2002-10-28 | 2006-05-23 | Universal Display Corporation | Device including OLED controlled by n-type transistor |
KR100905473B1 (ko) | 2002-12-03 | 2009-07-02 | 삼성전자주식회사 | 유기 이엘 표시판 및 그 제조 방법 |
JP3861816B2 (ja) | 2003-01-24 | 2006-12-27 | 住友電気工業株式会社 | 光送受信モジュール及びその製造方法 |
CA2419704A1 (en) * | 2003-02-24 | 2004-08-24 | Ignis Innovation Inc. | Method of manufacturing a pixel with organic light-emitting diode |
JP3915734B2 (ja) * | 2003-05-12 | 2007-05-16 | ソニー株式会社 | 蒸着マスクおよびこれを用いた表示装置の製造方法、ならびに表示装置 |
US6953705B2 (en) * | 2003-07-22 | 2005-10-11 | E. I. Du Pont De Nemours And Company | Process for removing an organic layer during fabrication of an organic electronic device |
CN1890698B (zh) * | 2003-12-02 | 2011-07-13 | 株式会社半导体能源研究所 | 显示器件及其制造方法和电视装置 |
US7189991B2 (en) | 2004-12-29 | 2007-03-13 | E. I. Du Pont De Nemours And Company | Electronic devices comprising conductive members that connect electrodes to other conductive members within a substrate and processes for forming the electronic devices |
KR100700650B1 (ko) * | 2005-01-05 | 2007-03-27 | 삼성에스디아이 주식회사 | 유기 전계 발광 장치 및 그 제조 방법 |
US7554261B2 (en) * | 2006-05-05 | 2009-06-30 | Eastman Kodak Company | Electrical connection in OLED devices |
-
2004
- 2004-12-29 US US11/025,110 patent/US7189991B2/en active Active
-
2005
- 2005-12-29 CN CNB200580045246XA patent/CN100505288C/zh not_active Expired - Fee Related
- 2005-12-29 TW TW094147293A patent/TWI377711B/zh not_active IP Right Cessation
- 2005-12-29 WO PCT/US2005/047519 patent/WO2006072024A2/en active Application Filing
- 2005-12-29 EP EP05855999A patent/EP1839336A4/en not_active Withdrawn
- 2005-12-29 JP JP2007549671A patent/JP5255279B2/ja not_active Expired - Fee Related
- 2005-12-29 KR KR1020077017237A patent/KR101261653B1/ko not_active IP Right Cessation
-
2006
- 2006-12-12 US US11/637,453 patent/US7488975B2/en not_active Expired - Fee Related
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