JP2008526019A5 - - Google Patents
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- Publication number
- JP2008526019A5 JP2008526019A5 JP2007548229A JP2007548229A JP2008526019A5 JP 2008526019 A5 JP2008526019 A5 JP 2008526019A5 JP 2007548229 A JP2007548229 A JP 2007548229A JP 2007548229 A JP2007548229 A JP 2007548229A JP 2008526019 A5 JP2008526019 A5 JP 2008526019A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- nanometers
- layer
- plasma
- silicon
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 5
- 229910052710 silicon Inorganic materials 0.000 claims 5
- 239000010703 silicon Substances 0.000 claims 5
- 238000000034 method Methods 0.000 claims 3
- 239000004642 Polyimide Substances 0.000 claims 2
- 239000004020 conductor Substances 0.000 claims 2
- 238000000151 deposition Methods 0.000 claims 2
- 229920001721 polyimide Polymers 0.000 claims 2
- 230000008021 deposition Effects 0.000 claims 1
- 150000003961 organosilicon compounds Chemical class 0.000 claims 1
- 238000000059 patterning Methods 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/021,135 US20060131700A1 (en) | 2004-12-22 | 2004-12-22 | Flexible electronic circuit articles and methods of making thereof |
| PCT/US2005/041827 WO2006068741A2 (en) | 2004-12-22 | 2005-11-17 | Flexible electronic circuit articles and methods of making thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2008526019A JP2008526019A (ja) | 2008-07-17 |
| JP2008526019A5 true JP2008526019A5 (enExample) | 2009-01-08 |
Family
ID=36594619
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007548229A Pending JP2008526019A (ja) | 2004-12-22 | 2005-11-17 | フレキシブル電子回路製品及びその製造方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20060131700A1 (enExample) |
| EP (1) | EP1829101A2 (enExample) |
| JP (1) | JP2008526019A (enExample) |
| KR (1) | KR20070091209A (enExample) |
| CN (1) | CN101088156A (enExample) |
| TW (1) | TW200638529A (enExample) |
| WO (1) | WO2006068741A2 (enExample) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8053352B2 (en) * | 2005-10-13 | 2011-11-08 | International Business Machines Corporation | Method and mesh reference structures for implementing Z-axis cross-talk reduction through copper sputtering onto mesh reference planes |
| US20080003804A1 (en) * | 2006-06-29 | 2008-01-03 | Ravi Nalla | Method of providing solder bumps of mixed sizes on a substrate using solder transfer in two stages |
| US8158264B2 (en) * | 2006-10-20 | 2012-04-17 | 3M Innovative Properties Company | Method for easy-to-clean substrates and articles therefrom |
| US20080280164A1 (en) * | 2007-05-11 | 2008-11-13 | 3M Innovative Properties Company | Microporous carbon catalyst support material |
| KR100891531B1 (ko) * | 2007-09-10 | 2009-04-03 | 주식회사 하이닉스반도체 | 패턴 정렬 불량 검출 장치 |
| CN102981378A (zh) * | 2012-11-15 | 2013-03-20 | 中山大学 | 一种去除聚酰亚胺柔性电极制备过程中光刻胶的方法 |
| US10014456B2 (en) | 2014-03-25 | 2018-07-03 | 3M Innovative Properties Company | Flexible circuits with coplanar conductive features and methods of making same |
| WO2016022628A1 (en) | 2014-08-07 | 2016-02-11 | 3M Innovative Properties Company | Reflection sheet and method of manufacturing the same |
| US10351729B2 (en) * | 2016-03-03 | 2019-07-16 | Motorola Mobility Llc | Polysiloxane films and methods of making polysiloxane films |
| CN106711085B (zh) * | 2016-12-12 | 2019-02-19 | 东莞市广信知识产权服务有限公司 | 一种柔性互连金属的制备方法 |
| CN115064320A (zh) * | 2022-07-22 | 2022-09-16 | 业成科技（成都）有限公司 | 导电层及其制作方法和电子设备 |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4613556A (en) * | 1984-10-18 | 1986-09-23 | Xerox Corporation | Heterogeneous electrophotographic imaging members of amorphous silicon and silicon oxide |
| DE3818509A1 (de) * | 1987-06-01 | 1988-12-22 | Gen Electric | Verfahren und einrichtung zum herstellen eines niederohmigen kontaktes mit aluminium und dessen legierungen durch selektives niederschlagen von wolfram |
| JP2000164887A (ja) * | 1992-07-21 | 2000-06-16 | Semiconductor Energy Lab Co Ltd | 半導体装置 |
| JP2592392B2 (ja) * | 1993-03-30 | 1997-03-19 | 株式会社 半導体エネルギー研究所 | 珪素を含む炭素被膜の作製方法 |
| JP3344017B2 (ja) * | 1993-08-23 | 2002-11-11 | 松下電工株式会社 | 金属と有機物の接合方法および配線板の製造方法 |
| US5684356A (en) * | 1996-03-29 | 1997-11-04 | Texas Instruments Incorporated | Hydrogen-rich, low dielectric constant gate insulator for field emission device |
| US5888594A (en) * | 1996-11-05 | 1999-03-30 | Minnesota Mining And Manufacturing Company | Process for depositing a carbon-rich coating on a moving substrate |
| US5948166A (en) * | 1996-11-05 | 1999-09-07 | 3M Innovative Properties Company | Process and apparatus for depositing a carbon-rich coating on a moving substrate |
| US6071597A (en) * | 1997-08-28 | 2000-06-06 | 3M Innovative Properties Company | Flexible circuits and carriers and process for manufacture |
| JP3374901B2 (ja) * | 1998-02-27 | 2003-02-10 | 日本電気株式会社 | 半導体装置 |
| US6299294B1 (en) * | 1999-07-29 | 2001-10-09 | Hewlett-Packard Company | High efficiency printhead containing a novel oxynitride-based resistor system |
| US6696157B1 (en) * | 2000-03-05 | 2004-02-24 | 3M Innovative Properties Company | Diamond-like glass thin films |
| US6863795B2 (en) * | 2001-03-23 | 2005-03-08 | Interuniversitair Microelektronica Centrum (Imec) | Multi-step method for metal deposition |
| WO2003005438A2 (en) * | 2001-07-02 | 2003-01-16 | Dow Corning Corporation | Improved metal barrier behavior by sic:h deposition on porous materials |
| JP2004098570A (ja) * | 2002-09-11 | 2004-04-02 | Amt Kenkyusho:Kk | フィルム状積層体およびフレキシブル回路基板 |
-
2004
- 2004-12-22 US US11/021,135 patent/US20060131700A1/en not_active Abandoned
-
2005
- 2005-11-17 KR KR1020077016718A patent/KR20070091209A/ko not_active Ceased
- 2005-11-17 CN CNA2005800445752A patent/CN101088156A/zh active Pending
- 2005-11-17 EP EP05851811A patent/EP1829101A2/en not_active Withdrawn
- 2005-11-17 WO PCT/US2005/041827 patent/WO2006068741A2/en not_active Ceased
- 2005-11-17 JP JP2007548229A patent/JP2008526019A/ja active Pending
- 2005-12-09 TW TW094143750A patent/TW200638529A/zh unknown
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