JP2008518468A - 浸漬冷却装置 - Google Patents

浸漬冷却装置 Download PDF

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Publication number
JP2008518468A
JP2008518468A JP2007538937A JP2007538937A JP2008518468A JP 2008518468 A JP2008518468 A JP 2008518468A JP 2007538937 A JP2007538937 A JP 2007538937A JP 2007538937 A JP2007538937 A JP 2007538937A JP 2008518468 A JP2008518468 A JP 2008518468A
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JP
Japan
Prior art keywords
article
seal
sidewall
heat transfer
transfer fluid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2007538937A
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English (en)
Japanese (ja)
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JP2008518468A5 (enExample
Inventor
イー． トゥマ，フィリップ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
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3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of JP2008518468A publication Critical patent/JP2008518468A/ja
Publication of JP2008518468A5 publication Critical patent/JP2008518468A5/ja
Withdrawn legal-status Critical Current

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/44—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements the complete device being wholly immersed in a fluid other than air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2007538937A 2004-10-29 2005-09-29 浸漬冷却装置 Withdrawn JP2008518468A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/977,454 US20060090881A1 (en) 2004-10-29 2004-10-29 Immersion cooling apparatus
PCT/US2005/035129 WO2006049768A1 (en) 2004-10-29 2005-09-29 Immersion cooling apparatus

Publications (2)

Publication Number Publication Date
JP2008518468A true JP2008518468A (ja) 2008-05-29
JP2008518468A5 JP2008518468A5 (enExample) 2008-11-06

Family

ID=35759399

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007538937A Withdrawn JP2008518468A (ja) 2004-10-29 2005-09-29 浸漬冷却装置

Country Status (6)

Country Link
US (1) US20060090881A1 (enExample)
EP (1) EP1808060A1 (enExample)
JP (1) JP2008518468A (enExample)
KR (1) KR20070084584A (enExample)
CN (1) CN101053290A (enExample)
WO (1) WO2006049768A1 (enExample)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011065245A1 (ja) * 2009-11-24 2011-06-03 ボッシュ株式会社 電子部品用冷却装置
WO2011111126A1 (ja) * 2010-03-10 2011-09-15 パナソニック株式会社 半導体装置及びその製造方法
JP2012172866A (ja) * 2011-02-18 2012-09-10 Showa Denko Kk 沸騰冷却装置
JP2014031960A (ja) * 2012-08-03 2014-02-20 Showa Denko Kk 沸騰冷却装置
WO2019194089A1 (ja) * 2018-04-02 2019-10-10 日本電気株式会社 電子機器
WO2020195301A1 (ja) * 2019-03-28 2020-10-01 日本電気株式会社 電子機器

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US20080236795A1 (en) * 2007-03-26 2008-10-02 Seung Mun You Low-profile heat-spreading liquid chamber using boiling
FR2939183B1 (fr) * 2008-11-28 2011-04-15 Fd Eclairage Architectural Source lumineuse a diode led de puissance equipee d'un systeme de refroidissement par fluide
US20100263885A1 (en) * 2009-04-21 2010-10-21 3M Innovative Properties Company Protection systems and methods for electronic devices
KR20130061142A (ko) * 2010-04-23 2013-06-10 웨이비엔, 인코포레이티드 액냉식 led 발광장치
US8686749B2 (en) 2010-04-30 2014-04-01 International Business Machines Corporation Thermal interface material, test structure and method of use
US8471575B2 (en) 2010-04-30 2013-06-25 International Business Machines Corporation Methodologies and test configurations for testing thermal interface materials
US8953318B1 (en) * 2010-09-13 2015-02-10 The Board Of Trustees Of The University Of Alabama, For And On Behalf Of The University Of Alabama In Huntsville Passive cooling systems and methods for electronics
US8953320B2 (en) * 2012-09-13 2015-02-10 Levi A. Campbell Coolant drip facilitating partial immersion-cooling of electronic components
US12402271B2 (en) 2012-12-14 2025-08-26 Midas Green Technologies, Llc Appliance immersion cooling system
US9057488B2 (en) 2013-02-15 2015-06-16 Wavien, Inc. Liquid-cooled LED lamp
US9401468B2 (en) 2014-12-24 2016-07-26 GE Lighting Solutions, LLC Lamp with LED chips cooled by a phase transformation loop
GB2542844B (en) * 2015-10-01 2021-06-16 Iceotope Group Ltd An immersion cooling system
KR102625643B1 (ko) 2017-06-07 2024-01-15 쓰리엠 이노베이티브 프로퍼티즈 컴파니 침지 냉각용 유체
CN108601286B (zh) * 2018-01-02 2020-09-25 联想(北京)有限公司 电子设备
US10321603B1 (en) 2018-07-23 2019-06-11 TAS Energy, Inc. Electrical power distribution for immersion cooled information systems
US10257960B1 (en) 2018-07-23 2019-04-09 TAS Energy, Inc. Power distribution for immersion-cooled information systems
TWI669479B (zh) * 2018-08-22 2019-08-21 威剛科技股份有限公司 具有散熱功能的儲存裝置及硬碟
CN109058952B (zh) * 2018-09-03 2024-07-26 中国科学院工程热物理研究所 用于强化沸腾传热的纳米织构开放式通道、散热器及led灯
DE102019128871A1 (de) * 2019-10-25 2021-04-29 Bayerische Motoren Werke Aktiengesellschaft Kühlvorrichtung und Kraftfahrzeug mit einer Kühlvorrichtung
CN112071817A (zh) * 2020-09-25 2020-12-11 中国科学院苏州纳米技术与纳米仿生研究所 浸没冷却散热结构、散热器、散热系统及其制作方法
CN115003101B (zh) * 2021-10-27 2023-05-12 荣耀终端有限公司 电子元件散热结构的制造方法、散热结构及电子设备
US12317450B1 (en) 2021-11-08 2025-05-27 Rhodium Technologies LLC Fluid circulation systems and methods for cooling having a collector
DE102021130926B4 (de) * 2021-11-25 2025-08-14 Dr. Ing. H.C. F. Porsche Aktiengesellschaft Flüssigkeitsgekühlte Leistungselektronikeinheit
US20230247795A1 (en) 2022-01-28 2023-08-03 The Research Foundation For The State University Of New York Regenerative preheater for phase change cooling applications
TWI807635B (zh) * 2022-02-14 2023-07-01 艾姆勒科技股份有限公司 浸沒式液冷散熱結構
US12477684B1 (en) 2022-03-07 2025-11-18 Rhodium Technologies LLC Fluid circulation systems and cooling facilities with elevated heat exchanger
US20240314975A1 (en) * 2023-03-13 2024-09-19 MTS IP Holdings Ltd Electronic Package Construction for Immersion Cooling of Integrated Circuits
WO2025014514A1 (en) 2023-07-10 2025-01-16 MTS IP Holdings Ltd Direct to chip application of boiling enhancement coating

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Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011065245A1 (ja) * 2009-11-24 2011-06-03 ボッシュ株式会社 電子部品用冷却装置
WO2011111126A1 (ja) * 2010-03-10 2011-09-15 パナソニック株式会社 半導体装置及びその製造方法
JP4801797B1 (ja) * 2010-03-10 2011-10-26 パナソニック株式会社 半導体装置及びその製造方法
US8384212B2 (en) 2010-03-10 2013-02-26 Panasonic Corporation Semiconductor equipment and method of manufacturing the same
JP2012172866A (ja) * 2011-02-18 2012-09-10 Showa Denko Kk 沸騰冷却装置
JP2014031960A (ja) * 2012-08-03 2014-02-20 Showa Denko Kk 沸騰冷却装置
WO2019194089A1 (ja) * 2018-04-02 2019-10-10 日本電気株式会社 電子機器
JPWO2019194089A1 (ja) * 2018-04-02 2021-03-11 日本電気株式会社 電子機器
JP7156368B2 (ja) 2018-04-02 2022-10-19 日本電気株式会社 電子機器
US11644249B2 (en) 2018-04-02 2023-05-09 Nec Corporation Electronic apparatus
WO2020195301A1 (ja) * 2019-03-28 2020-10-01 日本電気株式会社 電子機器
JPWO2020195301A1 (enExample) * 2019-03-28 2020-10-01
JP7176615B2 (ja) 2019-03-28 2022-11-22 日本電気株式会社 電子機器

Also Published As

Publication number Publication date
KR20070084584A (ko) 2007-08-24
EP1808060A1 (en) 2007-07-18
US20060090881A1 (en) 2006-05-04
CN101053290A (zh) 2007-10-10
WO2006049768A1 (en) 2006-05-11

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