JP2008518468A5 - - Google Patents
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- JP2008518468A5 JP2008518468A5 JP2007538937A JP2007538937A JP2008518468A5 JP 2008518468 A5 JP2008518468 A5 JP 2008518468A5 JP 2007538937 A JP2007538937 A JP 2007538937A JP 2007538937 A JP2007538937 A JP 2007538937A JP 2008518468 A5 JP2008518468 A5 JP 2008518468A5
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- Prior art keywords
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Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/977,454 US20060090881A1 (en) | 2004-10-29 | 2004-10-29 | Immersion cooling apparatus |
| PCT/US2005/035129 WO2006049768A1 (en) | 2004-10-29 | 2005-09-29 | Immersion cooling apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2008518468A JP2008518468A (ja) | 2008-05-29 |
| JP2008518468A5 true JP2008518468A5 (enExample) | 2008-11-06 |
Family
ID=35759399
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007538937A Withdrawn JP2008518468A (ja) | 2004-10-29 | 2005-09-29 | 浸漬冷却装置 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20060090881A1 (enExample) |
| EP (1) | EP1808060A1 (enExample) |
| JP (1) | JP2008518468A (enExample) |
| KR (1) | KR20070084584A (enExample) |
| CN (1) | CN101053290A (enExample) |
| WO (1) | WO2006049768A1 (enExample) |
Families Citing this family (34)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080236795A1 (en) * | 2007-03-26 | 2008-10-02 | Seung Mun You | Low-profile heat-spreading liquid chamber using boiling |
| FR2939183B1 (fr) * | 2008-11-28 | 2011-04-15 | Fd Eclairage Architectural | Source lumineuse a diode led de puissance equipee d'un systeme de refroidissement par fluide |
| US20100263885A1 (en) * | 2009-04-21 | 2010-10-21 | 3M Innovative Properties Company | Protection systems and methods for electronic devices |
| JP2013033773A (ja) * | 2009-11-24 | 2013-02-14 | Bosch Corp | 電子部品用冷却装置 |
| JP4801797B1 (ja) * | 2010-03-10 | 2011-10-26 | パナソニック株式会社 | 半導体装置及びその製造方法 |
| KR20130061142A (ko) * | 2010-04-23 | 2013-06-10 | 웨이비엔, 인코포레이티드 | 액냉식 led 발광장치 |
| US8686749B2 (en) | 2010-04-30 | 2014-04-01 | International Business Machines Corporation | Thermal interface material, test structure and method of use |
| US8471575B2 (en) | 2010-04-30 | 2013-06-25 | International Business Machines Corporation | Methodologies and test configurations for testing thermal interface materials |
| US8953318B1 (en) * | 2010-09-13 | 2015-02-10 | The Board Of Trustees Of The University Of Alabama, For And On Behalf Of The University Of Alabama In Huntsville | Passive cooling systems and methods for electronics |
| JP2012172866A (ja) * | 2011-02-18 | 2012-09-10 | Showa Denko Kk | 沸騰冷却装置 |
| JP2014031960A (ja) * | 2012-08-03 | 2014-02-20 | Showa Denko Kk | 沸騰冷却装置 |
| US8953320B2 (en) * | 2012-09-13 | 2015-02-10 | Levi A. Campbell | Coolant drip facilitating partial immersion-cooling of electronic components |
| US12402271B2 (en) | 2012-12-14 | 2025-08-26 | Midas Green Technologies, Llc | Appliance immersion cooling system |
| US9057488B2 (en) | 2013-02-15 | 2015-06-16 | Wavien, Inc. | Liquid-cooled LED lamp |
| US9401468B2 (en) | 2014-12-24 | 2016-07-26 | GE Lighting Solutions, LLC | Lamp with LED chips cooled by a phase transformation loop |
| GB2542844B (en) * | 2015-10-01 | 2021-06-16 | Iceotope Group Ltd | An immersion cooling system |
| KR102625643B1 (ko) | 2017-06-07 | 2024-01-15 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 침지 냉각용 유체 |
| CN108601286B (zh) * | 2018-01-02 | 2020-09-25 | 联想(北京)有限公司 | 电子设备 |
| WO2019194089A1 (ja) * | 2018-04-02 | 2019-10-10 | 日本電気株式会社 | 電子機器 |
| US10321603B1 (en) | 2018-07-23 | 2019-06-11 | TAS Energy, Inc. | Electrical power distribution for immersion cooled information systems |
| US10257960B1 (en) | 2018-07-23 | 2019-04-09 | TAS Energy, Inc. | Power distribution for immersion-cooled information systems |
| TWI669479B (zh) * | 2018-08-22 | 2019-08-21 | 威剛科技股份有限公司 | 具有散熱功能的儲存裝置及硬碟 |
| CN109058952B (zh) * | 2018-09-03 | 2024-07-26 | 中国科学院工程热物理研究所 | 用于强化沸腾传热的纳米织构开放式通道、散热器及led灯 |
| JP7176615B2 (ja) * | 2019-03-28 | 2022-11-22 | 日本電気株式会社 | 電子機器 |
| DE102019128871A1 (de) * | 2019-10-25 | 2021-04-29 | Bayerische Motoren Werke Aktiengesellschaft | Kühlvorrichtung und Kraftfahrzeug mit einer Kühlvorrichtung |
| CN112071817A (zh) * | 2020-09-25 | 2020-12-11 | 中国科学院苏州纳米技术与纳米仿生研究所 | 浸没冷却散热结构、散热器、散热系统及其制作方法 |
| CN115003101B (zh) * | 2021-10-27 | 2023-05-12 | 荣耀终端有限公司 | 电子元件散热结构的制造方法、散热结构及电子设备 |
| US12317450B1 (en) | 2021-11-08 | 2025-05-27 | Rhodium Technologies LLC | Fluid circulation systems and methods for cooling having a collector |
| DE102021130926B4 (de) * | 2021-11-25 | 2025-08-14 | Dr. Ing. H.C. F. Porsche Aktiengesellschaft | Flüssigkeitsgekühlte Leistungselektronikeinheit |
| US20230247795A1 (en) | 2022-01-28 | 2023-08-03 | The Research Foundation For The State University Of New York | Regenerative preheater for phase change cooling applications |
| TWI807635B (zh) * | 2022-02-14 | 2023-07-01 | 艾姆勒科技股份有限公司 | 浸沒式液冷散熱結構 |
| US12477684B1 (en) | 2022-03-07 | 2025-11-18 | Rhodium Technologies LLC | Fluid circulation systems and cooling facilities with elevated heat exchanger |
| US20240314975A1 (en) * | 2023-03-13 | 2024-09-19 | MTS IP Holdings Ltd | Electronic Package Construction for Immersion Cooling of Integrated Circuits |
| WO2025014514A1 (en) | 2023-07-10 | 2025-01-16 | MTS IP Holdings Ltd | Direct to chip application of boiling enhancement coating |
Family Cites Families (43)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2410310A (en) * | 1944-10-14 | 1946-10-29 | Gen Motors Corp | Refrigerating apparatus |
| US3741292A (en) * | 1971-06-30 | 1973-06-26 | Ibm | Liquid encapsulated air cooled module |
| US4024991A (en) * | 1975-11-28 | 1977-05-24 | George Noblit Tyson | Imparter to provide silver to water supplies |
| US4092697A (en) * | 1976-12-06 | 1978-05-30 | International Business Machines Corporation | Heat transfer mechanism for integrated circuit package |
| US4203129A (en) * | 1978-07-11 | 1980-05-13 | International Business Machines Corporation | Bubble generating tunnels for cooling semiconductor devices |
| JPS55118561A (en) * | 1979-03-05 | 1980-09-11 | Hitachi Ltd | Constant pressure type boiling cooler |
| JPS55165658A (en) * | 1979-06-11 | 1980-12-24 | Fujitsu Ltd | Semiconductor device |
| US4799537A (en) * | 1987-10-13 | 1989-01-24 | Thermacore, Inc. | Self regulating heat pipe |
| US5006924A (en) * | 1989-12-29 | 1991-04-09 | International Business Machines Corporation | Heat sink for utilization with high density integrated circuit substrates |
| US5000256A (en) * | 1990-07-20 | 1991-03-19 | Minnesota Mining And Manufacturing Company | Heat transfer bag with thermal via |
| US5139666A (en) * | 1991-01-04 | 1992-08-18 | Domotechnica Canada, Inc. | Bottle and filter |
| US5257755A (en) * | 1991-11-18 | 1993-11-02 | Hughes Aircraft Company | Endothermic cooler for electronic components |
| US5629840A (en) * | 1992-05-15 | 1997-05-13 | Digital Equipment Corporation | High powered die with bus bars |
| US5485671A (en) * | 1993-09-10 | 1996-01-23 | Aavid Laboratories, Inc. | Method of making a two-phase thermal bag component cooler |
| US5704416A (en) * | 1993-09-10 | 1998-01-06 | Aavid Laboratories, Inc. | Two phase component cooler |
| US5458189A (en) * | 1993-09-10 | 1995-10-17 | Aavid Laboratories | Two-phase component cooler |
| WO1995025603A1 (en) * | 1994-03-23 | 1995-09-28 | Board Of Regents, The University Of Texas System | Boiling enhancement coating |
| US5634351A (en) * | 1994-03-24 | 1997-06-03 | Aavid Laboratories, Inc. | Two-phase cooling system for a laptop computer lid |
| US5383340A (en) * | 1994-03-24 | 1995-01-24 | Aavid Laboratories, Inc. | Two-phase cooling system for laptop computers |
| US5411077A (en) * | 1994-04-11 | 1995-05-02 | Minnesota Mining And Manufacturing Company | Flexible thermal transfer apparatus for cooling electronic components |
| US5626022A (en) * | 1994-05-31 | 1997-05-06 | Insta-Heat, Inc. | Container with integral module for heating or cooling the contents |
| CA2186488C (en) * | 1995-01-25 | 2000-01-18 | Henry F. Villaume | Thermal management system |
| US5621613A (en) * | 1995-05-16 | 1997-04-15 | Intel Corporation | Apparatus for dissipating heat in a hinged computing device |
| US5646822A (en) * | 1995-08-30 | 1997-07-08 | Intel Corporation | Heat pipe exchanger system for cooling a hinged computing device |
| US5647416A (en) * | 1996-03-15 | 1997-07-15 | Les Produits Addico Inc. | Bottled water dispenser system |
| CA2181828C (en) * | 1996-07-22 | 2002-01-15 | Richard Lamoureux | One-piece cap for liquid dispenser container |
| US5982616A (en) * | 1997-08-20 | 1999-11-09 | Compaq Computer Corporation | Electronic apparatus with plug-in heat pipe module cooling system |
| US6786330B2 (en) * | 1997-10-14 | 2004-09-07 | Biogaia Ab | Two-compartment container |
| US5940270A (en) * | 1998-07-08 | 1999-08-17 | Puckett; John Christopher | Two-phase constant-pressure closed-loop water cooling system for a heat producing device |
| US6175493B1 (en) * | 1998-10-16 | 2001-01-16 | Dell Usa, Lp | Heat transfer from base to display portion of a portable computer |
| US20020104319A1 (en) * | 1999-01-25 | 2002-08-08 | Paine Lisa Jane | Heat transfer device |
| SE518446C2 (sv) * | 1999-06-14 | 2002-10-08 | Ericsson Telefon Ab L M | Anordning vid kylning av elektroniska komponenter |
| EP1217927A1 (en) * | 1999-10-06 | 2002-07-03 | Thermotic Developments Limited | Self-heating or self-cooling containers |
| US6690578B2 (en) * | 2000-02-02 | 2004-02-10 | Rittal Gmbh & Co. Kg | Cooling device |
| US6466438B1 (en) * | 2000-04-17 | 2002-10-15 | Sui-Lin Lim | Generic external portable cooling device for computers |
| US6398073B1 (en) * | 2000-07-24 | 2002-06-04 | Bag O Water Limited | Fluid dispensing system with collapsible container |
| US6639799B2 (en) * | 2000-12-22 | 2003-10-28 | Intel Corporation | Integrated vapor chamber heat sink and spreader and an embedded direct heat pipe attachment |
| ITMI20011340A1 (it) * | 2001-06-26 | 2002-12-26 | Ausimont Spa | Pfpe aventi almeno un terminale alchiletereo e relativo processo dipreparazione |
| US6388882B1 (en) * | 2001-07-19 | 2002-05-14 | Thermal Corp. | Integrated thermal architecture for thermal management of high power electronics |
| GB2383321B (en) * | 2001-12-21 | 2005-07-27 | Ebac Ltd | Feed tube for use in a liquid delivery system |
| US20030136550A1 (en) * | 2002-01-24 | 2003-07-24 | Global Win Technology | Heat sink adapted for dissipating heat from a semiconductor device |
| US20030168730A1 (en) * | 2002-03-08 | 2003-09-11 | Howard Davidson | Carbon foam heat exchanger for integrated circuit |
| US7157793B2 (en) * | 2003-11-12 | 2007-01-02 | U.S. Monolithics, L.L.C. | Direct contact semiconductor cooling |
-
2004
- 2004-10-29 US US10/977,454 patent/US20060090881A1/en not_active Abandoned
-
2005
- 2005-09-29 KR KR1020077011937A patent/KR20070084584A/ko not_active Withdrawn
- 2005-09-29 CN CNA2005800374668A patent/CN101053290A/zh active Pending
- 2005-09-29 JP JP2007538937A patent/JP2008518468A/ja not_active Withdrawn
- 2005-09-29 WO PCT/US2005/035129 patent/WO2006049768A1/en not_active Ceased
- 2005-09-29 EP EP05802148A patent/EP1808060A1/en not_active Withdrawn
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