JP2008518468A5 - - Google Patents

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Publication number
JP2008518468A5
JP2008518468A5 JP2007538937A JP2007538937A JP2008518468A5 JP 2008518468 A5 JP2008518468 A5 JP 2008518468A5 JP 2007538937 A JP2007538937 A JP 2007538937A JP 2007538937 A JP2007538937 A JP 2007538937A JP 2008518468 A5 JP2008518468 A5 JP 2008518468A5
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JP
Japan
Prior art keywords
article
breakable seal
closed volume
volume
sidewall
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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JP2007538937A
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English (en)
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JP2008518468A (ja
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Priority claimed from US10/977,454 external-priority patent/US20060090881A1/en
Application filed filed Critical
Publication of JP2008518468A publication Critical patent/JP2008518468A/ja
Publication of JP2008518468A5 publication Critical patent/JP2008518468A5/ja
Withdrawn legal-status Critical Current

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Claims (1)

  1. 放熱部品を冷却するための物品であって:
    密閉容積を画定するために協働する、少なくとも1つの側壁と破壊可能なシールとを含み、前記破壊可能なシールが前記密閉容積に近接する内面、及び外面を有する本体と;
    前記密閉容積内に入れられたある量の伝熱流体とを含む、物品。
JP2007538937A 2004-10-29 2005-09-29 浸漬冷却装置 Withdrawn JP2008518468A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/977,454 US20060090881A1 (en) 2004-10-29 2004-10-29 Immersion cooling apparatus
PCT/US2005/035129 WO2006049768A1 (en) 2004-10-29 2005-09-29 Immersion cooling apparatus

Publications (2)

Publication Number Publication Date
JP2008518468A JP2008518468A (ja) 2008-05-29
JP2008518468A5 true JP2008518468A5 (ja) 2008-11-06

Family

ID=35759399

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007538937A Withdrawn JP2008518468A (ja) 2004-10-29 2005-09-29 浸漬冷却装置

Country Status (6)

Country Link
US (1) US20060090881A1 (ja)
EP (1) EP1808060A1 (ja)
JP (1) JP2008518468A (ja)
KR (1) KR20070084584A (ja)
CN (1) CN101053290A (ja)
WO (1) WO2006049768A1 (ja)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080236795A1 (en) * 2007-03-26 2008-10-02 Seung Mun You Low-profile heat-spreading liquid chamber using boiling
FR2939183B1 (fr) * 2008-11-28 2011-04-15 Fd Eclairage Architectural Source lumineuse a diode led de puissance equipee d'un systeme de refroidissement par fluide
US20100263885A1 (en) * 2009-04-21 2010-10-21 3M Innovative Properties Company Protection systems and methods for electronic devices
JP2013033773A (ja) * 2009-11-24 2013-02-14 Bosch Corp 電子部品用冷却装置
JP4801797B1 (ja) 2010-03-10 2011-10-26 パナソニック株式会社 半導体装置及びその製造方法
WO2011133820A1 (en) * 2010-04-23 2011-10-27 Wavien, Inc. Liquid cooled led lighting device
US8471575B2 (en) 2010-04-30 2013-06-25 International Business Machines Corporation Methodologies and test configurations for testing thermal interface materials
US8686749B2 (en) 2010-04-30 2014-04-01 International Business Machines Corporation Thermal interface material, test structure and method of use
US8953318B1 (en) * 2010-09-13 2015-02-10 The Board Of Trustees Of The University Of Alabama, For And On Behalf Of The University Of Alabama In Huntsville Passive cooling systems and methods for electronics
JP2012172866A (ja) * 2011-02-18 2012-09-10 Showa Denko Kk 沸騰冷却装置
JP2014031960A (ja) * 2012-08-03 2014-02-20 Showa Denko Kk 沸騰冷却装置
US8953320B2 (en) * 2012-09-13 2015-02-10 Levi A. Campbell Coolant drip facilitating partial immersion-cooling of electronic components
US9057488B2 (en) 2013-02-15 2015-06-16 Wavien, Inc. Liquid-cooled LED lamp
US9401468B2 (en) 2014-12-24 2016-07-26 GE Lighting Solutions, LLC Lamp with LED chips cooled by a phase transformation loop
GB2542844B (en) * 2015-10-01 2021-06-16 Iceotope Group Ltd An immersion cooling system
KR102625643B1 (ko) * 2017-06-07 2024-01-15 쓰리엠 이노베이티브 프로퍼티즈 컴파니 침지 냉각용 유체
CN108601286B (zh) * 2018-01-02 2020-09-25 联想(北京)有限公司 电子设备
WO2019194089A1 (ja) * 2018-04-02 2019-10-10 日本電気株式会社 電子機器
US10257960B1 (en) 2018-07-23 2019-04-09 TAS Energy, Inc. Power distribution for immersion-cooled information systems
US10321603B1 (en) 2018-07-23 2019-06-11 TAS Energy, Inc. Electrical power distribution for immersion cooled information systems
TWI669479B (zh) * 2018-08-22 2019-08-21 威剛科技股份有限公司 具有散熱功能的儲存裝置及硬碟
CN109058952A (zh) * 2018-09-03 2018-12-21 中国科学院工程热物理研究所 用于强化沸腾传热的纳米织构开放式通道、散热器及led灯
US20220151113A1 (en) * 2019-03-28 2022-05-12 Nec Corporation Electronic device
DE102019128871A1 (de) * 2019-10-25 2021-04-29 Bayerische Motoren Werke Aktiengesellschaft Kühlvorrichtung und Kraftfahrzeug mit einer Kühlvorrichtung
CN115003101B (zh) * 2021-10-27 2023-05-12 荣耀终端有限公司 电子元件散热结构的制造方法、散热结构及电子设备
TWI807635B (zh) * 2022-02-14 2023-07-01 艾姆勒科技股份有限公司 浸沒式液冷散熱結構

Family Cites Families (43)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2410310A (en) * 1944-10-14 1946-10-29 Gen Motors Corp Refrigerating apparatus
US3741292A (en) * 1971-06-30 1973-06-26 Ibm Liquid encapsulated air cooled module
US4024991A (en) * 1975-11-28 1977-05-24 George Noblit Tyson Imparter to provide silver to water supplies
US4092697A (en) * 1976-12-06 1978-05-30 International Business Machines Corporation Heat transfer mechanism for integrated circuit package
US4203129A (en) * 1978-07-11 1980-05-13 International Business Machines Corporation Bubble generating tunnels for cooling semiconductor devices
JPS55118561A (en) * 1979-03-05 1980-09-11 Hitachi Ltd Constant pressure type boiling cooler
JPS55165658A (en) * 1979-06-11 1980-12-24 Fujitsu Ltd Semiconductor device
US4799537A (en) * 1987-10-13 1989-01-24 Thermacore, Inc. Self regulating heat pipe
US5006924A (en) * 1989-12-29 1991-04-09 International Business Machines Corporation Heat sink for utilization with high density integrated circuit substrates
US5000256A (en) * 1990-07-20 1991-03-19 Minnesota Mining And Manufacturing Company Heat transfer bag with thermal via
US5139666A (en) * 1991-01-04 1992-08-18 Domotechnica Canada, Inc. Bottle and filter
US5257755A (en) * 1991-11-18 1993-11-02 Hughes Aircraft Company Endothermic cooler for electronic components
US5629840A (en) * 1992-05-15 1997-05-13 Digital Equipment Corporation High powered die with bus bars
US5704416A (en) * 1993-09-10 1998-01-06 Aavid Laboratories, Inc. Two phase component cooler
US5485671A (en) * 1993-09-10 1996-01-23 Aavid Laboratories, Inc. Method of making a two-phase thermal bag component cooler
US5458189A (en) * 1993-09-10 1995-10-17 Aavid Laboratories Two-phase component cooler
AU2126295A (en) * 1994-03-23 1995-10-09 Board Of Regents, The University Of Texas System Boiling enhancement coating
US5634351A (en) * 1994-03-24 1997-06-03 Aavid Laboratories, Inc. Two-phase cooling system for a laptop computer lid
US5383340A (en) * 1994-03-24 1995-01-24 Aavid Laboratories, Inc. Two-phase cooling system for laptop computers
US5411077A (en) * 1994-04-11 1995-05-02 Minnesota Mining And Manufacturing Company Flexible thermal transfer apparatus for cooling electronic components
US5626022A (en) * 1994-05-31 1997-05-06 Insta-Heat, Inc. Container with integral module for heating or cooling the contents
CA2186488C (en) * 1995-01-25 2000-01-18 Henry F. Villaume Thermal management system
US5621613A (en) * 1995-05-16 1997-04-15 Intel Corporation Apparatus for dissipating heat in a hinged computing device
US5646822A (en) * 1995-08-30 1997-07-08 Intel Corporation Heat pipe exchanger system for cooling a hinged computing device
US5647416A (en) * 1996-03-15 1997-07-15 Les Produits Addico Inc. Bottled water dispenser system
CA2181828C (en) * 1996-07-22 2002-01-15 Richard Lamoureux One-piece cap for liquid dispenser container
US5982616A (en) * 1997-08-20 1999-11-09 Compaq Computer Corporation Electronic apparatus with plug-in heat pipe module cooling system
US6786330B2 (en) * 1997-10-14 2004-09-07 Biogaia Ab Two-compartment container
US5940270A (en) * 1998-07-08 1999-08-17 Puckett; John Christopher Two-phase constant-pressure closed-loop water cooling system for a heat producing device
US6175493B1 (en) * 1998-10-16 2001-01-16 Dell Usa, Lp Heat transfer from base to display portion of a portable computer
US20020104319A1 (en) * 1999-01-25 2002-08-08 Paine Lisa Jane Heat transfer device
SE518446C2 (sv) * 1999-06-14 2002-10-08 Ericsson Telefon Ab L M Anordning vid kylning av elektroniska komponenter
JP2003510553A (ja) * 1999-10-06 2003-03-18 サーモティック デヴェロップメンツ リミテッド 自己加熱又は自己冷却容器
US6690578B2 (en) * 2000-02-02 2004-02-10 Rittal Gmbh & Co. Kg Cooling device
US6466438B1 (en) * 2000-04-17 2002-10-15 Sui-Lin Lim Generic external portable cooling device for computers
US6398073B1 (en) * 2000-07-24 2002-06-04 Bag O Water Limited Fluid dispensing system with collapsible container
US6639799B2 (en) * 2000-12-22 2003-10-28 Intel Corporation Integrated vapor chamber heat sink and spreader and an embedded direct heat pipe attachment
ITMI20011340A1 (it) * 2001-06-26 2002-12-26 Ausimont Spa Pfpe aventi almeno un terminale alchiletereo e relativo processo dipreparazione
US6388882B1 (en) * 2001-07-19 2002-05-14 Thermal Corp. Integrated thermal architecture for thermal management of high power electronics
GB2383321B (en) * 2001-12-21 2005-07-27 Ebac Ltd Feed tube for use in a liquid delivery system
US20030136550A1 (en) * 2002-01-24 2003-07-24 Global Win Technology Heat sink adapted for dissipating heat from a semiconductor device
US20030168730A1 (en) * 2002-03-08 2003-09-11 Howard Davidson Carbon foam heat exchanger for integrated circuit
US7157793B2 (en) * 2003-11-12 2007-01-02 U.S. Monolithics, L.L.C. Direct contact semiconductor cooling

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