JP2008518468A5 - - Google Patents

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Publication number
JP2008518468A5
JP2008518468A5 JP2007538937A JP2007538937A JP2008518468A5 JP 2008518468 A5 JP2008518468 A5 JP 2008518468A5 JP 2007538937 A JP2007538937 A JP 2007538937A JP 2007538937 A JP2007538937 A JP 2007538937A JP 2008518468 A5 JP2008518468 A5 JP 2008518468A5
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JP
Japan
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article
breakable seal
closed volume
volume
sidewall
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JP2007538937A
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English (en)
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JP2008518468A (ja
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Priority claimed from US10/977,454 external-priority patent/US20060090881A1/en
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Publication of JP2008518468A publication Critical patent/JP2008518468A/ja
Publication of JP2008518468A5 publication Critical patent/JP2008518468A5/ja
Withdrawn legal-status Critical Current

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Claims (1)

  1. 放熱部品を冷却するための物品であって:
    密閉容積を画定するために協働する、少なくとも1つの側壁と破壊可能なシールとを含み、前記破壊可能なシールが前記密閉容積に近接する内面、及び外面を有する本体と;
    前記密閉容積内に入れられたある量の伝熱流体とを含む、物品。
JP2007538937A 2004-10-29 2005-09-29 浸漬冷却装置 Withdrawn JP2008518468A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/977,454 US20060090881A1 (en) 2004-10-29 2004-10-29 Immersion cooling apparatus
PCT/US2005/035129 WO2006049768A1 (en) 2004-10-29 2005-09-29 Immersion cooling apparatus

Publications (2)

Publication Number Publication Date
JP2008518468A JP2008518468A (ja) 2008-05-29
JP2008518468A5 true JP2008518468A5 (ja) 2008-11-06

Family

ID=35759399

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007538937A Withdrawn JP2008518468A (ja) 2004-10-29 2005-09-29 浸漬冷却装置

Country Status (6)

Country Link
US (1) US20060090881A1 (ja)
EP (1) EP1808060A1 (ja)
JP (1) JP2008518468A (ja)
KR (1) KR20070084584A (ja)
CN (1) CN101053290A (ja)
WO (1) WO2006049768A1 (ja)

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WO2011111126A1 (ja) * 2010-03-10 2011-09-15 パナソニック株式会社 半導体装置及びその製造方法
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JP2012172866A (ja) * 2011-02-18 2012-09-10 Showa Denko Kk 沸騰冷却装置
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CN109058952B (zh) * 2018-09-03 2024-07-26 中国科学院工程热物理研究所 用于强化沸腾传热的纳米织构开放式通道、散热器及led灯
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