EP2258998A3 - High performance heat transfer device, methods of manufacture thereof and articles comprising the same - Google Patents

High performance heat transfer device, methods of manufacture thereof and articles comprising the same Download PDF

Info

Publication number
EP2258998A3
EP2258998A3 EP10163176.0A EP10163176A EP2258998A3 EP 2258998 A3 EP2258998 A3 EP 2258998A3 EP 10163176 A EP10163176 A EP 10163176A EP 2258998 A3 EP2258998 A3 EP 2258998A3
Authority
EP
European Patent Office
Prior art keywords
layer
shell
heat transfer
transfer device
articles
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP10163176.0A
Other languages
German (de)
French (fr)
Other versions
EP2258998A2 (en
Inventor
Kripa Kiran Varanasi
Pramod Chamarthy
Hendrik Pieter Jacobus De Bock
Lauraine Danault
Tao Deng
Aaron Jay Knobloch
Ambarish Jayant Kulkarni
Brian Magann Rush
Boris Alexander Russ
Stanton Earl Weaver Jr.
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co
Original Assignee
General Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co filed Critical General Electric Co
Publication of EP2258998A2 publication Critical patent/EP2258998A2/en
Publication of EP2258998A3 publication Critical patent/EP2258998A3/en
Withdrawn legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2245/00—Coatings; Surface treatments
    • F28F2245/02—Coatings; Surface treatments hydrophilic
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2245/00—Coatings; Surface treatments
    • F28F2245/04—Coatings; Surface treatments hydrophobic
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making

Landscapes

  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Laminated Bodies (AREA)

Abstract

Disclosed herein is an heat transfer device (100) that includes a shell (20); the shell (20) being an enclosure that prevents matter from within the shell (20) from being exchanged with matter outside the shell (20); the shell (20) having an outer surface and an inner surface; and a particle layer disposed on the inner surface of the shell (20); the particle layer having a thickness effective to enclose a region (24) for transferring a fluid between opposing faces (21 and 23); the particle layer including a first layer and a second layer; the second layer being disposed upon the first layer; the first layer having average particle sizes of about 10 to about 10,000,000 nanometers; the second layer having average particle sizes of about 10 to about 10,000 nanometers.
EP10163176.0A 2009-05-22 2010-05-18 High performance heat transfer device, methods of manufacture thereof and articles comprising the same Withdrawn EP2258998A3 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US12/470,624 US20100294467A1 (en) 2009-05-22 2009-05-22 High performance heat transfer device, methods of manufacture thereof and articles comprising the same

Publications (2)

Publication Number Publication Date
EP2258998A2 EP2258998A2 (en) 2010-12-08
EP2258998A3 true EP2258998A3 (en) 2018-04-04

Family

ID=42646479

Family Applications (1)

Application Number Title Priority Date Filing Date
EP10163176.0A Withdrawn EP2258998A3 (en) 2009-05-22 2010-05-18 High performance heat transfer device, methods of manufacture thereof and articles comprising the same

Country Status (2)

Country Link
US (1) US20100294467A1 (en)
EP (1) EP2258998A3 (en)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10041745B2 (en) 2010-05-04 2018-08-07 Fractal Heatsink Technologies LLC Fractal heat transfer device
US8506105B2 (en) 2010-08-25 2013-08-13 Generla Electric Company Thermal management systems for solid state lighting and other electronic systems
US10018428B2 (en) * 2011-06-27 2018-07-10 Raytheon Company Method and apparatus for heat spreaders having a vapor chamber with a wick structure to promote incipient boiling
EP2713132A1 (en) * 2012-09-26 2014-04-02 Alcatel Lucent A vapor-based heat transfer apparatus
KR101422097B1 (en) * 2012-11-26 2014-07-28 잘만테크 주식회사 Evaporator for the looped heat pipe system and method for manufacturing thereof
US9133973B2 (en) 2013-01-14 2015-09-15 Nanopore, Inc. Method of using thermal insulation products with non-planar objects
US9598857B2 (en) 2013-01-14 2017-03-21 Nanopore, Inc. Thermal insulation products for insulating buildings and other enclosed environments
US9726438B2 (en) * 2013-01-14 2017-08-08 Nanopore Incorporated Production of thermal insulation products
US9849405B2 (en) * 2013-01-14 2017-12-26 Nanopore, Inc. Thermal insulation products and production of thermal insulation products
TWI513069B (en) * 2013-05-21 2015-12-11 Subtron Technology Co Ltd Heat dissipation plate
US20150114606A1 (en) * 2013-10-29 2015-04-30 Louisiana Tech University Research Foundation; a Division of Louisiana Tech University Foundation, Capillary Action Heat Exchanger
US10267567B1 (en) * 2014-01-13 2019-04-23 Nutech Ventures Monolithic heat-transfer device
CN105698580B (en) * 2014-11-28 2017-11-03 台达电子工业股份有限公司 Heat pipe
US10704794B2 (en) 2015-04-07 2020-07-07 Brown University Apparatus and method for passively cooling an interior
WO2016164561A1 (en) * 2015-04-07 2016-10-13 Brown University Apparatus and method for passively cooling an interior
US10746478B2 (en) * 2015-12-11 2020-08-18 California Institute Of Technology Silicon biporous wick for high heat flux heat spreaders
EP3485062A4 (en) * 2016-10-07 2020-03-11 Hewlett-Packard Development Company, L.P. Coating for a vapor chamber
US9945618B1 (en) * 2017-01-04 2018-04-17 Wieland Copper Products, Llc Heat transfer surface
RU2638233C1 (en) * 2017-01-23 2017-12-12 Государственное научное учреждение "Институт порошковой металлургии" Method for manufacturing thermal pipe with aluminium housing and water as heat carrier
US11031312B2 (en) 2017-07-17 2021-06-08 Fractal Heatsink Technologies, LLC Multi-fractal heatsink system and method
JP7116912B2 (en) * 2018-07-30 2022-08-12 株式会社リコー Wick, loop heat pipe, cooling device, electronic device, and wick manufacturing method
CA3110861A1 (en) 2018-08-31 2020-03-05 Techstyle Materials, Inc. Multifunctional system for passive heat and water management
US11300362B2 (en) * 2019-01-31 2022-04-12 Toyota Motor Engineering & Manufacturing North America, Inc. Hybrid evaporator-feeding wicks for uniform fluid delivery to multiple heat sources in a vapor chamber
JP2022074693A (en) * 2020-11-05 2022-05-18 東京エレクトロン株式会社 Substrate supporter, substrate transport device, and manufacturing method of substrate supporter
US11732974B2 (en) * 2021-01-06 2023-08-22 Asia Vital Components Co., Ltd. Thin-type two-phase fluid device

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2130822A1 (en) * 1971-06-22 1973-01-11 Bbc Brown Boveri & Cie Heat tube - with dual porosity capillary structure
DE2515753A1 (en) * 1975-04-10 1976-10-14 Siemens Ag WARM PIPE
JPH09133485A (en) * 1995-11-06 1997-05-20 Mitsubishi Materials Corp Heat pipe
WO2005005903A2 (en) * 2003-06-26 2005-01-20 Thermal Corp. Brazed wick for a heat transfer device and method of making same
US20060213061A1 (en) * 2005-03-25 2006-09-28 Jung-Yuan Wu Method for making a heat pipe

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3433984C2 (en) * 1984-09-15 1986-07-24 Daimler-Benz Ag, 7000 Stuttgart Heat pipe made of aluminum or steel
US4885129A (en) * 1988-10-24 1989-12-05 The United States Of America As Represented By The Secretary Of The Air Force Method of manufacturing heat pipe wicks
US5647429A (en) * 1994-06-16 1997-07-15 Oktay; Sevgin Coupled, flux transformer heat pipes
GB2341230B (en) * 1998-04-13 2002-01-09 Furukawa Electric Co Ltd Plate type heat pipe and cooling device using same
TW551612U (en) * 2002-07-26 2003-09-01 Tai Sol Electronics Co Ltd Piercing type IC heat dissipating device
JP2004245550A (en) * 2003-02-17 2004-09-02 Fujikura Ltd Heat pipe superior in circulating characteristic
US6889755B2 (en) * 2003-02-18 2005-05-10 Thermal Corp. Heat pipe having a wick structure containing phase change materials
EP1639628A4 (en) * 2003-06-26 2007-12-26 Thermal Corp Heat transfer device and method of making same
US20050126757A1 (en) * 2003-12-16 2005-06-16 Bennett Donald L. Internally enhanced tube with smaller groove top
FI120050B (en) * 2004-06-03 2009-06-15 Luvata Oy Method for reducing and bonding metal oxide powder to a heat transfer surface and heat transfer surface
CN100413061C (en) * 2004-06-07 2008-08-20 鸿富锦精密工业（深圳）有限公司 Thermal tube and producing method thereof
CN100453955C (en) * 2005-01-07 2009-01-21 鸿富锦精密工业（深圳）有限公司 Heat pipe and manufacturing method thereof
US20060197245A1 (en) * 2005-01-14 2006-09-07 Ching-Tai Cheng Method of manufacturing heat pipe having sintered powder wick
TWI275766B (en) * 2005-03-18 2007-03-11 Foxconn Tech Co Ltd Heat pipe
TWI260387B (en) * 2005-04-01 2006-08-21 Foxconn Tech Co Ltd Sintered heat pipe and manufacturing method thereof
US20070151708A1 (en) * 2005-12-30 2007-07-05 Touzov Igor V Heat pipes with self assembled compositions
CN100561108C (en) * 2006-04-14 2009-11-18 富准精密工业(深圳)有限公司 Heat pipe

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2130822A1 (en) * 1971-06-22 1973-01-11 Bbc Brown Boveri & Cie Heat tube - with dual porosity capillary structure
DE2515753A1 (en) * 1975-04-10 1976-10-14 Siemens Ag WARM PIPE
JPH09133485A (en) * 1995-11-06 1997-05-20 Mitsubishi Materials Corp Heat pipe
WO2005005903A2 (en) * 2003-06-26 2005-01-20 Thermal Corp. Brazed wick for a heat transfer device and method of making same
US20060213061A1 (en) * 2005-03-25 2006-09-28 Jung-Yuan Wu Method for making a heat pipe

Also Published As

Publication number Publication date
US20100294467A1 (en) 2010-11-25
EP2258998A2 (en) 2010-12-08

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