EP1639628A4 - Heat transfer device and method of making same - Google Patents

Heat transfer device and method of making same

Info

Publication number
EP1639628A4
EP1639628A4 EP04754527A EP04754527A EP1639628A4 EP 1639628 A4 EP1639628 A4 EP 1639628A4 EP 04754527 A EP04754527 A EP 04754527A EP 04754527 A EP04754527 A EP 04754527A EP 1639628 A4 EP1639628 A4 EP 1639628A4
Authority
EP
European Patent Office
Prior art keywords
heat transfer
transfer device
making same
making
same
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP04754527A
Other languages
German (de)
French (fr)
Other versions
EP1639628A2 (en
Inventor
John H Rosenfeld
Donald M Ernst
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Aavid Thermal Corp
Original Assignee
Thermal Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/607,337 external-priority patent/US6994152B2/en
Application filed by Thermal Corp filed Critical Thermal Corp
Publication of EP1639628A2 publication Critical patent/EP1639628A2/en
Publication of EP1639628A4 publication Critical patent/EP1639628A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2275/00—Fastening; Joining
    • F28F2275/04—Fastening; Joining by brazing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
EP04754527A 2003-06-26 2004-06-04 Heat transfer device and method of making same Withdrawn EP1639628A4 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/607,337 US6994152B2 (en) 2003-06-26 2003-06-26 Brazed wick for a heat transfer device
US10/765,660 US7028759B2 (en) 2003-06-26 2004-01-27 Heat transfer device and method of making same
PCT/US2004/017937 WO2005006395A2 (en) 2003-06-26 2004-06-04 Heat transfer device and method of making same

Publications (2)

Publication Number Publication Date
EP1639628A2 EP1639628A2 (en) 2006-03-29
EP1639628A4 true EP1639628A4 (en) 2007-12-26

Family

ID=34068495

Family Applications (1)

Application Number Title Priority Date Filing Date
EP04754527A Withdrawn EP1639628A4 (en) 2003-06-26 2004-06-04 Heat transfer device and method of making same

Country Status (3)

Country Link
US (1) US20060124281A1 (en)
EP (1) EP1639628A4 (en)
WO (1) WO2005006395A2 (en)

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US20100006268A1 (en) * 2008-07-14 2010-01-14 Meyer Iv George Anthony Vapor chamber and supporting structure of the same
US8579018B1 (en) * 2009-03-23 2013-11-12 Hrl Laboratories, Llc Lightweight sandwich panel heat pipe
US20100294467A1 (en) * 2009-05-22 2010-11-25 General Electric Company High performance heat transfer device, methods of manufacture thereof and articles comprising the same
US20100294475A1 (en) * 2009-05-22 2010-11-25 General Electric Company High performance heat transfer device, methods of manufacture thereof and articles comprising the same
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US10849217B2 (en) * 2018-07-02 2020-11-24 Aptiv Technologies Limited Electrical-circuit assembly with heat-sink
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US11278978B2 (en) * 2019-06-21 2022-03-22 International Business Machines Corporation Pattern bonded finned cold plate
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CN111397410A (en) * 2019-12-31 2020-07-10 东莞市万维热传导技术有限公司 Tubeless sealed aluminum temperature-equalizing plate and manufacturing process thereof
JP7444704B2 (en) 2020-06-04 2024-03-06 古河電気工業株式会社 Heat transfer member and cooling device having heat transfer member
US11382205B2 (en) 2020-09-16 2022-07-05 Aptiv Technologies Limited Heatsink shield with thermal-contact dimples for thermal-energy distribution in a radar assembly
CN113734417A (en) * 2021-09-06 2021-12-03 上海航天精密机械研究所 Semi-active heat-proof structure and manufacturing method thereof
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Title
No further relevant documents disclosed *

Also Published As

Publication number Publication date
EP1639628A2 (en) 2006-03-29
WO2005006395A2 (en) 2005-01-20
WO2005006395A3 (en) 2005-04-28
US20060124281A1 (en) 2006-06-15

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